Showing results: 961 - 969 of 969 items found.
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Atec, Inc.
A tec, Inc. specializes in the design, manufacture, and integration of complex test systems and quality critical components. Our production engineering expertise separates us from other manufacturing companies when both reliability and cost are important. Atec has the best in 5 to 9 Axis CNC machining, coordinate measuring machines (CMMs), 3D additive metal and plastic printers, 9-Axis capable waterjet, cryogenic liquid flow test benches and environmental test chambers. We can deliver to the tightest tolerances and most exacting requirements. We can advise our customers on electron beam welding, friction joining, electronic test, environmental test, acoustics, vibration and many other technologies that can reduce manufacturing and operating costs. We are currently manufacturing liquid rocket engine fuel and oxidizer valves for multiple launch vehicles and have participated in 158 consecutive launch successes. Atec manufactured and tested advanced lithium-ion battery adapter plates that manage power for the International Space Station. Atec is designing, manufacturing, and testing power flow modules that work to prevent system failure on the human crew capsule (CCTS) that will transport astronauts to/from the ISS. Atec was awarded NASA Agency-Level Small Business Subcontractor of the Year , SBA Region VI Subcontractor of the Year for our support to NASA and Boeing and we were named a DCMA Top 500 Supplier.
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MIC-6313 -
Advantech Co. Ltd.
The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.
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EC997 -
Mustang Dynamometer
The EC997 Series, our standard eddy current motorcycle chassis dynamometer, takes motorcycle performance tuning to the next level. The EC997 Series uses the industry’s most advanced electronics and Dynamic Load Control technology, featuring precision closed-loop torque feedback – a standard feature with every EC997 dyno. Competitor’s dynos on the market allow you to apply “percent % load” but Mustang has perfected the art and science of Dynamic Load Control and proudly offer the most sophisticated Dynamic Load Control dynamometer available at any price. Our superior control technology combined with our ultra-low inertia design allows you to precisely control loading to hold the engine at each RPM. Try doing that with a heavy drive roller and insufficient control technology – you simply cannot! Mustang has delivered thousands of performance dynamometer systems over the past 35 years and has perfected the art and science of dynamic vehicle loading and dynamometer control. We include each motorcycle make and model in our database including weight and drag coefficients so you can simulate the track right on the dyno! While other dyno manufactures are still trying to catch up with our technology, Mustang continues to lead the industry and is recognized around the world as the industry’s best with regards to dynamic dynamometer controls. Mustang has built racing dynos for Harley-Davidson as well as several end of production line testing cells for Harley-Davidson, Honda, and Polaris.
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PICO51R -
Axiomtek Co., Ltd.
The PICO51R is powered by the 7th generation Intel® Core™ i7/i5/i3 or Celeron® processor (code name: Kaby Lake). With the onboard CPU attached on the rear side of the board, the PICO51R can aid the heat-extraction process to make fanless design possible and make system integration fast. The pico-ITX embedded board also provides practical expansion interfaces within its limited dimensions including one M.2 Key E slot for wireless modules and one M.2 key B slot for storage cards. This powerful 2.5-inch Pico-ITX embedded motherboard is designed for minimum maintenance and maximum ruggedness. In addition to two USB 3.0 (USB 3.1 Gen1) ports in support of industrial cameras for machine vision applications, the PICO51R also comes with an M.2 Key E slot for wireless communication capabilities and two Gigabit Ethernet ports for mass data transmission or LAN port teaming functions.The Intel® Core™-based PICO51R supports one 260-pin DDR4-2133 SO-DIMM for up to 16GB of system memory. Moreover, the pico-ITX single board computer utilizes Intel® HD graphics engine to bring a true high definition visual experience with dual display configurations through DisplayPort and 18/24-bit single/dual channel LVDS. In addition, this industrial motherboard can withstand a wide operating temperature range from -20°C to +60°C (-4°F to 140°F) for use in rugged and harsh environments.
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Mustang Dynamometer
With the Portable MD-AWD-500, you have a portable drag strip that can handle just about any 2WD or AWD car on the street. Equipped with a drag racing timing system, multiple displays, and Mustang’s DragSim software, the portable MD-AWD-500 is sure to draw large crowds where ever it appears. One thing is for sure, a dyno draws big crowds when it shows up at an event. There is something about watching the wheels spin and listening to an engine at full throttle that captures people’s attention. Add to that actual drag racing times, reaction time results and a virtual animation of the car racing down the strip or street and you’ve got yourself some serious racing entertainment. Mustang’s top-of-the-line portable chassis dynamometer is the Portable AWD-500 Series dynamometer. No other dyno offers all of the benefits of a Mustang AWD-500 dyno in such a tightly-engineered portable package. Mounted inside of a flatbed trailer, the portable AWD-500 is easy to trailer to and from events and can be set-up by a single operator. This is the ultimate portable dyno. Great for promotional events, dyno sharing arrangements or as a traveling dyno for trade shows or car show events. Like the standard AWD-500, the portable version can test both AWD and 2WD vehicles and can switch back and forth with a simple click of the mouse. With added displays, a drag racing timing system and Mustang’s DragSim Software and you’ve got yourself a portable drag racing strip that is dead nuts accurate, extremely repeatable and a real crowd pleaser. Portable AWD-500 Features Include:
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MD-250-HD -
Mustang Dynamometer
The MD-250-HD series dyno (SE/DE) was designed to be a performance dynamometer first with the added benefit of being able to test 2-wheel-drive heavy-duty vehicles such as truck, buses and commercial vehicles in addition to the standard car or light duty pick-up. The 250-HD is certified in the states of Colorado, Nevada and Utah for use in loaded-mode diesel smog testing programs because of its accuracy and reliability. No other dyno in its class offers more value or better in-house motor vehicle testing capabilities than the Mustang MD-250-HD. For starters, the MD-250-HD boasts a 1,500 horsepower measurement capacity at a top speed of 175 mph and a powerful air-cooled eddy current brake provides the MD-250-HD-SE with 900-hp worth ofloading capacity for steady state testing. Loading capacity can be increased to 1,500-hp via the optional DE model. The 250-HD can be upgraded to the 250-HD-SE-M via the addition of a 100 or 200 hp AC motor for transient testing of electric buses to measure range and regeneration or for emissions testing of IC engines. Do not be fooled by its compact size – the MD-250-HD is a serious dynamometer with serious tuning capabilities. The MD-250-HD uses a powerful eddy current power absorber, a frictionless, air-cooled braking device, to enable it to apply variable and steady state loading. A complete control and data acquisition system lets you design a wide range of tests or select from a host of pre-configured tests included with the standard system. The 250-HD’s four roller design makes setting up vehicles a snap – simply drive onto the 250-HD and let the tires settle in between the rollers. The 250-HD can be installed above-ground or below-ground, it’s your choice. The above-ground system utilizes an optional premium platform and ramp system with an above-ground restraint kit. The addition of an axle pull-down kit help keep the tires from slipping or trying to “climb out” of the rollers.
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MIC-6330 -
Advantech Co. Ltd.
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
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MIC-6314 -
Advantech Co. Ltd.
The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.
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Xeltek
Features:Until now,Support IC manufacturer, pcs devices and keeps growing.1)High speed thanks to the flexible hardware engine. Programming speed adjustable for complicated application environments brought by user target board, length of ISP cable etc.2)Stand-alone and PC-Hosted (USB2.0 High Speed) dual mode;3)Supports ISP programming of devices with I2C, SPI, UART, BDM, MON, MW, JTAG, CAN, ICC, RS232 and any other serial port.4)ATE interface;5)Over-current and ESD protection to protect your equipment;6)DLL and API for easy integration into customers’ system.Hardware Specifications:1) ISP cable integrates I2C, SPI, UART, BDM, MON, MW, JTAG, CAN, ICC, RS232 interfaces。2) VDD (0-5.5V /0.5A) and Vpp (0-15V / 0.2A) lines provided to power the target board and the target devices.3) Cable driver circuit supports target devices of voltage level 1.5-5V and is ESD protected.4) USB 2.0 (high speed) interface for PC hosted mode and management of project files on SD card.5) A 20 Characters x 4 lines LCD and a 6-key keypad are built with it for stand-alone operation. In stand-alone mode project files are stored on the SD card (up to 16GB). The number of the project files is limited only by the capacity of the SD card.6) ATE interface is built for easy external hardware control. 6 lines SEL0-SEL5 are for project selection (maximum 64 files); 2 command lines START and STOP; 3 STATUS lines PASS, FAIL and BUSY. All signals are optical-isolated.7) A universal AC adaptor of DC12V/2A is included for power supply.8)WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility.Software Specifications:1) Supports almost all devices with ISP interface.2) Supports Jam and Staple files from ACTEL and ALTERA; Direct C files from ACTEL.3) Programming speed selectable (High, Normal and Low) for complicated applications such as different cable lengths, different target load characters.4) Dynamic buffer function. Application examples include device S/N, MAC address, frequency or transducer calibration etc.5) File format on SD: FAT16, FAT32.6) Functions for IP protection: Project security, SD security, batch control, administration management etc. 7) API and DLL provided for easy integration into customers’ system like ICT and ATE.8) Software provides the features for multiple units to work concurrently controlled by USB HUB.Applications:1)R&D application like in-circuit test and debug.2)Volume production. Devices may be programmed after the board is fully assembled. One example is the serial number writing to an on-board serial device.3)Field application. Comes with portability, stand-alone mode and mobile data storage media (SD card), it is suitable for field test, debug and data acquisition.4)Third application modules. Friend s/w interface (DLL and Virtual Com communication command set) and h/w interface ( ATE and USB) are provided and make it very easy for customers to integrate ISP01 as a functional module into their systems. One example is the ICT equipment. With this integration user can finish in-circuit test and in-circuit programming in one step.
