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Showing results: 1 - 11 of 11 items found.

  • Compact and Low-Weight X-ray System

    XT V 130 - Nikon Metrology, Inc.

    Compact XT V 130 QA-system for affordable X-ray visualization and automated inspection

  • Automated X-ray Inspection (AXI)

    TR7600X SII - Test Research, Inc.

    Built for maximum inspection performance, TR7600X SII series offers ultimate performance 3D X-ray inspection for the largest server, networking and power PCBs. With advanced ultra-high-speed cameras, the TR7600X SII series combines TRI’s unique shadow-free 3D inspection of multi-layer boards with 2/3-layer PoPs, µBGAs, QFNs, Press-fit connectors with fully automated programming and multi-resolution programs help maximize production yields on any production line. - See more at: http://www.tri.com.tw/en/product/product_detail-12-2-23-1.html#sthash.sVL14SCV.dpuf

  • Automated X-ray Inspection (AXI)

    TR7600 SII - Test Research, Inc.

    Featuring advanced automated 3D X-ray inspection of PCBAs, the TR7600 SII high speed scanning with multiple resolutions in a single program. Automatic Pass/Fail determination uses 2D + 3D images provided using 6-axis control and ultra-high-speed multiple angle cameras with automatic board warp compensation. TR7600 SII is ideal for inspection of fine pitch 01005 components, BGAs, PoPs, LGAs and other bottom termination components on both sides of the PCBA, including complex Pressfit connectors.

  • Energy Dispersive X-ray Fluorescence Spectrometer

    EDX-LE - Shimadzu Corp.

    EDX-LE is an X-ray fluorescence spectrometer designed specifically for screening elements regulated by RoHS/ELV directives. The model uses a detector (Si-PIN semiconductor detector) that does not require liquid nitrogen, thereby achieving lower operation cost and easier maintenance. Automated analysis functions improve operability without sacrificing its high level of inspection reliability. The time required from start of measurement to judgment is as short as one minute for some samples, which is very helpful in screening inspections for elements regulated by the RoHS directive.

  • Universal Offline AXI Systems

    AXI XT-6 Series - Nordson Corporation

    The XT-series provides the advanced inspection capability of Nordson TEST & INSPECTION's inline system in a smaller footprint manual load/island of automation system. The platforms are designed for flexibility and ease of use for a wide variety of products requiring 2D and 2.5D automated X-ray inspection. The XT-6/XT-6A platform is a highly flexible automated X-ray inspection system with minimum footprint and a parallel-kinematic Hexaglide manipulation unit for extreme-angle off-axis image acquisition with high resolution. It is suitable for high-quality X-ray analysis of electronic assemblies and material analysis of parts that require flexible part manipulation with multiple inspection angles. For batch modes and volume inspection the XT-6 can be equipped with a single-sided conveyor setup and magazine load/unload station (XT-6A).

  • High Flexible Inline AXI Platform

    AXI X# Series - Nordson Corporation

    The X#-platform series is an inline automated X-ray system which covers a wide range of AXI applications. It is a flexible platform with very versatile fields of use depending on the application requirements. The inspectable applications range from component level inspection for wire bonds, large SMT boards, high-power electronic modules up to fully assembled modules.

  • High Speed Inline AXI Platform

    AXI X Series - Nordson Corporation

    The X-platform series is a dedicated high speed inline automated X-ray inspection system for the inspection of PCB-assembly boards for single/multipanels or samples in trays. The system offers market leading inspection speed and is ideal for low-mix high-volume production environment.

  • High Resolution Inline AXI Platform

    AXI XS Series - Nordson Corporation

    The XS-platform series is a small-footprint high-resolution automated X-ray inspection system concept designed for sophisticated high-speed inspection of semiconductor samples, wire bonds and PCB-assembly boards for single/multipanels or samples in trays. The inspectable applications range from component level inspection to mid-sized SMT boards.

  • Inline 3D-CT Automated X-ray Inspection Systems (3D-AXI)

    3Xi Series - Saki Corporation

    Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.

  • X-Ray Inspection Systems

    Sciencescope International

    Scienscope’s X-Ray inspection systems division offers state of the art X-ray cabinet systems with the highest performance to price ratio in the industry today. Scienscope has over 16 years of experience selling solutions as a leading NDT (non-destructive test) supplier of x-ray inspection equipment into the electronic, medical device, materials, and biological markets. Our advanced x-ray systems feature high power micro-focus x-ray sources up to 130kV, high resolution digital detectors, large inspection stages with 350° degrees rotation, oblique angle inspection, and all of the manual and automated s/w tools you expect in an advanced system are included.

  • Circuit Card Assembly

    Teledyne Defense Electronics

    Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes

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