SIP
Session Initiation Protocol, Standard Interchange Protocol
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Product
AC/DC - On-board Converter Module
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Mornsun Guangzhou Science & Technology
Mornsun AC/DC On-board Converter, one of the best-selling AC to DC converter power supplies, has a good market in the wholesale of AC to DC converter modules. On-board AC to DC converter modules are more frequently used in emerging applications. MORNSUN is expanding and enhancing its portfolio of board mount AC to DC converters to provide customers with a diverse selection of AC/DC converter module power supply in terms of package configurations (SIP, DIP, open-frame, chassis mount, etc.), input/output voltage options and multiple protections. These PCB mount AC to DC power converter modules cover power levels from 1W to 1000W, featuring compact size, standard or extra wide input voltage range, wide operating temperature range, high reliability, etc. Perfectly meet your design requirements for AC to DC converter power supply modules in different industrial applications.
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Product
SIP-90-6 Test System Interface Probe
SIP-90-6
ICT/FCT Probe
Overall Length (mil): 656Overall Length (mm): 16.66Rec. Mounting Hole Size (mil): 57Rec. Mounting Hole Size (mm): 1.45Recommended Drill Size: 1,45 mm
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Product
Single-in-Line (SIL / SIP) Reed Relays
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The SIL / SIP reed relay is the industry standard when high reliability and consistent performance are desired in a compact package. Pickering Electronics Series 100 - 110 SIL / SIP reed relays feature the highest quality instrumentation grade reed switches making them suitable for the most demanding applications.
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Product
SDIO SiP module
SX-SDPAC
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The SX-SDPAC is a dual-band 1x1 802.11a/b/g/n/ac plus Bluetooth 5.0+HS “Smart Ready” SDIO SiP module specifically designed for low cost high volume embedded applications.
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Product
Digital Matrix Intercom System
Gemini
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A system that interfaces with existing communication assets such as SIP telephones.A way to reduce costs for linking remote sites by using standard IP infrastructure.An intercom system that operates over LAN or WAN or Internet.Works on any terrestrial or satellite-based network.Virtual and hardware operator panels to configure and manage each unit.Private one-to-one, group and conference calls with the ability to manage simple to complex conference and private conversations simply and quickly.Interfaces for telephony, 4 wire, and other audio devices such as Radio base station or Presenter systems.Sophisticated SIP integration for modern telephony interconnection options.Camera Mix interfaces for 6 cameras to/from Engineering and Production.
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Product
Signal Chain µModule Receivers
µModule®
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Analog Devices µModule® (micromodule) receivers consist of high performance, high speed ADCs with fixed-gain, high speed amplifiers and antialias filters. Our integrated ADC and driver products include integrated bypass capacitance and simplify the high frequency layout required to preserve ac performance. The board space savings are significant for instrumentation applications such as spectrum analyzers, oscilloscopes ,and communications test equipment, or for communications applications such as high sensitivity receivers, software-defined radio (SDR), or signal intelligence receivers. Our portfolio uses system-in-package (SiP) technology similar to multichip modules (MCM) to integrate components with different technologies, along with passive components to make an integrated subsystem.
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Product
Isolation Amplifier
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Mornsun Guangzhou Science & Technology
An isolation amplifier is an amplifier that provides isolation between the input and output of the circuits, including isolation between their associated power supplies. MORNSUN offers different types of analog isolation amplifiers, such as acquisition type signal conditioning modules, output isolation signal conditioning modules, two-wire loop power supply signal conditioning modules and signal isolators, etc. These analog isolation amplifiers feature excellent temperature drift characteristics of less than 50PPM/℃ across the entire operating temperature range of -40 ℃ to +85 ℃ and achieve isolation transmission, signal conversion (programmable for some models), HART communication, signal amplification, port protection and other functions. SIP, DIP, SMD and DIN Rail packages are optional.
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Product
Built-in MOSFET Integrated SiP
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Renesas Electronics offers SiP products with integrated MOSFETs to enable easy configuration of high-performance multi-phase power supplies. They combine in a single package either controller, driver, and MOSFETs or driver and MOSFETs. These products make it easy to build a high-performance DC/DC converter while reducing stray capacitance and inductance, and achieving higher mounting density.
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Product
3U CPCI Dual IP Carrier
CPCI-SIP
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The CPCI-SIP module provides a 3U high performance flexible I/O scheme that supports industry standard Industry. PacksÔ. For application requiring low cost, high density I/O or unique combinations, the CPCI-SIP is the perfect solution. The CPCI-SIP is also available with the Industry Pack lines routed to the CompactPCI P2 connector for application that require rear panel I/O.
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Product
Slave Dual Industry Pack Carrier
CPCI-SIP-3
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The new CPCI-SIP-3Module provides a 3U high performance flexible I/Oscheme, that supports industry standard IndustryPacks. Choose from over a 100 different IndustryPacks from Alphi Tech and others. For applicationrequiring low cost, high density I/O or unique combinations, the CPCISIP-3 is the perfectsolution.
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Product
3U Format CompactPCI (CPCI) Bus IP Carrier
CPCI-SIP-2
Bus Extender
The CPCI-SIP is a 3U format CompactPCI (CPCI) bus IP carrier. The CPCI-SIP-2 provides mechanical support and the electrical interfaces for two single width IP modules, or a double width IP module. Multiple CPCI-SIP-2 boards may be installed in a single system.
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Product
SIP-90-4 Test System Interface Probe
SIP-90-4
ICT/FCT Probe
Overall Length (mil): 693Overall Length (mm): 17.60Rec. Mounting Hole Size (mil): 57Rec. Mounting Hole Size (mm): 1.45Recommended Drill Size: 1,45 mm
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Product
High-density Power Drivers
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Gate drivers, FETs and protection circuitry integrated into a single package to drive loads in industrial and home-appliance applications, with increased power density per cm². ST’s high-density power drivers are System in Package (SiP) solutions integrating in compact QFN packages the STDRIVE gate drivers and MOSFET-based power stages, responding to the industrial market trend towards higher levels of integration and lower development costs.
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Product
DC Alignment
SEP/SIP
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There are analog phase control type DC power supply type and digital control type inverter energy saving type. We provide the most suitable equipment according to the current capacity and cycle time.If the "start command" is executed from the existing molding equipment, each mode of "alignment-pause-demagnetization" is continuously operated by the program inside the instrument. It is also possible to share an emergency stop signal and output an output current abnormality signal.
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Product
Single-in-Line Reed Relays from Pickering Electronics
SIL / SIP
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The SIL / SIP reed relay is the industry standard when high reliability and consistent performance are desired in a compact package. Pickering Electronics Series 100 - 119 SIL / SIP reed relays feature the highest quality instrumentation grade reed switches making them suitable for the most demanding applications. Features include:
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Product
Dual Industry Pack Carrier Module
CPCI-SIP-rp
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The CPCI-SIP module provides a 3U high performance flexible I/O scheme that supports industry standard Industry PacksÔ. For application requiring low cost, high density I/O or unique combinations, the CPCI-SIP is the perfect solution.The CPCI-SIP is also available with the Industry Pack lines routed to the CompactPCI P2 connector for application that require rear panel I/O.
