Showing results: 1 - 15 of 30 items found.
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SimScale
Many materials and products have temperature-dependent characteristics; this makes analyzing the impact of heat and ensuring thermal management of structures and fluids crucial in product development. The SimScale cloud-based platform allows you to predict the airflow, temperature distribution and heat transfer. Use thermal simulation to analyze and optimize your product early in the design phase.
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SEMCAD X -
Schmid & Partner Engineering AG
SEMCAD X is the latest generation of 3-D FDTD full-wave simulation software offering unprecedented levels of user-friendliness, speed & memory efficiency. Its application range has been further greatly extended by incorporating the world's first EM ADI-FDTD solver.
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PCI EmbeddedComputer Systems
The 3U power test module is an ideal solution for evaluating heat dissipation in a rugged conduction cooled VPX cage or chassis. This card is a thermal load in the chassis to evaluate the heat dissipation. The chassis can be monitored with temp sensing probes and or FLIR imaging. Different wattages are selected by setting dip switches. The +5 and 3.3V loads are on the top of the module. The +12V and -12V loads are on the bottom side of the module.
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QuickField™ -
Tera Analysis Ltd.
QuickField™ is a very efficient Finite Element Analysis package for electromagnetic, thermal, and stress design simulation with coupled multi-field analysis.
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TTV -
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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Maya Heat Transfer Technologies Ltd.
Maya HTT Computer Aided Engineering (CAE) Simulation - Acoustic, Thermal, Fluid Dynamics, Motion, Multiphysics, Composites, Structural, Durability, Correlation, Dynamics, Electromagnetics, and Pre-Post.
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Azbil Telstar, S.L.
Telstar Vacuum Solutions offers innovative custom solutions in design, construction and installation of space simulation thermal vacuum chambers, specially developed to optimize testing efficiency.
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Fraunhofer-Gesellschaft
The key area of expertise and the basis for all developments at the Fraunhofer IOF is optical and mechanical design as well as the simulation and analysis of optical and opto-mechanical systems inclusive of thermal and thermo-optical effects. Extensive design and modeling tools enable the simulation and optimization of systems for the THz to X-ray range - from micro-optics to astronomical telescopes.
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Conductor Analysis Technologies, Inc
The OM Thermal Stress System is a cost-effective performance based reliability test methodology which performs convection reflow assembly simulation and air-to-air thermal cycling. The methodology is utilized by both the IPC PCQR and the IPC 6012-QLM programs. OM systems are available for sale or lease, and test services are provided from both CAT and our service partners.
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11A05GJA48Y3HMXX -
ELMA Electronic, Inc.
Elma's ATCA, DC, 4U horizontal enclosure with backplane, and shelf mgmt. options. Pluggable and redundant fans, PEMs and shelf managers for availability (99.999%). Optimized via backplane signal integrity studies and chassis thermal simulation.
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11A02FJB28Y3HMXX -
ELMA Electronic, Inc.
Elma's ATCA, DC, 2U horizontal enclosure with backplane, and shelf mgmt. options. Pluggable and redundant fan trays, PEMs and shelf managers for availability (99.999%). Optimized via backplane signal integrity studies and chassis thermal simulation.
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11A02FJB38Y4HGBX -
ELMA Electronic, Inc.
Elma's ATCA, AC, 3U horizontal enclosure with backplane, and shelf mgmt. options. Pluggable and redundant fan trays, PEMs and shelf managers for availability (99.999%). Optimized via backplane signal integrity studies and chassis thermal simulation.
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11A05FJB58Y4HGBX -
ELMA Electronic, Inc.
Elma's ATCA, AC, 5U horizontal enclosure with backplane, and shelf mgmt. options. Pluggable and redundant fan trays, PEMs and shelf managers for availability (99.999%). Optimized via backplane signal integrity studies and chassis thermal simulation.
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11A06FJB58Y4HMXX -
ELMA Electronic, Inc.
Elma's ATCA, DC, 5U horizontal enclosure with backplane, and shelf mgmt. options. Pluggable and redundant fan trays, PEMs and shelf managers for availability (99.999%). Optimized via backplane signal integrity studies and chassis thermal simulation.
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11A06FJB68Y4HGBX -
ELMA Electronic, Inc.
Elma's ATCA, AC, 6U horizontal enclosure with backplane, and shelf mgmt. options. Pluggable and redundant fan trays, PEMs and shelf managers for availability (99.999%). Optimized via backplane signal integrity studies and chassis thermal simulation.