Wave Solder
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Full Wave Recorder
I-FullWaver
The I-FullWaver systems were specifically developed for precise full waveform time domain induced polarisation, Resistivity and self-potential measurements. Each system is fully independent; incorporating its own power source, GPS module and digital memory for up to 3 months continuous recording.
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Millimeter Wave Spectrum Analyzer
Insight Product Co. offers the spectrum analyzer for frequency measurements of millimeter wave generators of continuous or pulsed signals. The spectrum analyzer can be ordered to cover a complete millimeter wave frequency band: 35-53 GHz; 53-78 GHz; 78-118 GHz; or 118-178 GHz and offer exceptional spectral resolution of 1-5 kHz.
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Wave Buoy
MOTUS
The MOTUS (movement in Latin) Wave Buoy is a perfect solution for collecting environmental data in coastal areas.Collect reliable environmental data with MOTUS Wave Data Buoy.The MOTUS (movement in Latin) Buoy is a perfect solution for collecting environmental data in coastal areas for all-year deployments. The platform used for collecting data is a robust buoy which has proven to be an excellent platform for providing high accuracy and reliable meteorological and oceanographic data. The wave buoy can effectively combine various Hydrological and Meteorological parameters. Basic parameters such as wind, waves, and currents can easily be expanded to include sensor packages with different water quality sensors. Data is controlled and synchronized by the data management systems that Xylem Analytics offers, which also controls and powers real-time communication. This provides a low-power efficient system offering long-term deployment capabilities.The MOTUS Wave Buoys combine our ultra-low power and field-proven solutions from developing oceanographic and water quality sensors. We have 60 years of experience operating in the industry, providing you with an optimal platform based on the buoy, a rugged, lightweight polyethylene buoy deployed in more than 40 countries all over the world. By selecting Xylem as your partner in your projects, you are on track for the lowest overall cost of ownership and a versatile platform that can be tailored to your needs. The MOTUS Buoy is developed for both scientific and commercial use.
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High Speed Solder Paste Inspection
VisionPro HSi
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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Wave and Tide Sensor
Aanderaa Wave and Tide Sensors are compact fully integrated sensor for measuring the wave and tide conditions designed to be mounted on the Aanderaa multiparameter SeaGuard Platform or via cable connected to SmartGuard datalogger.
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9-Pin D-Type Male, Solder Bucket, HV
92-960-009-M-HV
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - Without Backshell
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High-speed 3D Solder Inspection Machine
YSi-SP
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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Solder Wettability Tester
5200 Advanced
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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Square Wave Frequency Generator
F125
The F125 square wave frequency generator replaces our F150/155/105 frequency generators. It is a completely new design with many new features. The main one being that it can run standalone up to 1500 program files copied from a PC or Mac. It is also possible to connect the F125 to a computer via a USB port and control it with the F100 3.0 software for MS-Windows in the same way our F150/155/105 operate from a PC. Program files written for our current F150/155/105 are compatible with the new F125.
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Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Mm Wave Measurement
Erickson PM5B
bsw TestSystems & Consulting AG
Erickson PM5B from VDI, which has been further optimised in the version just presented. The measuring head of the PM5B operates in the WR10 band, i.e. in the 75 - 110 GHz range. High-precision accessories, so-called tapers, provide for adjustments and thus make measurements in the waveguide bands, currently up to WR0.34 beyond 3 THz, possible.
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Normal Incidence Shear Wave Transducers
Single element normal incidence Shear Wave Transducers contact transducers introduce shear waves directly into the test piece without the use of refracted wave mode conversion. We recommend the use of our SWC shear wave couplant for general purpose testing.
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SparkFun Solder-able Breadboard
Mini
This is the Mini SparkFun Solder-able Breadboard. A bare PCB that is the exact size as our mini modular breadboards with the same connections to pins. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Wave Quality Analyzer
Nexus 1500
From the Industrial Giants, Fortune 100 companies to municipal utilities, an energy management and power monitoring program is critical to their success. The Nexus® 1500, the most advanced monitoring product, provides the global picture of power quality and usage from any metered point within a distribution network, enabling users to make power-related decisions quickly and effectively.
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Solderability Tester
LBT210
Microtronic Microelectronic Vertriebs GmbH
Microtronic's LBT-210 solderability tester has software that offers statistical information such as mean value, standard deviation, etc. A camera option offers video of the test cycle and storage in memory with the appropriate test measurements and data. Additionally, it has the feature to test under nitrogen. This function can be switched on in the software. An enclosure that is flooded with nitrogen lowers and rises with the device under test.
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Solder Paste Inspection System
LaserVision SP3D Mini
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
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2-22 GHz GaAs MMIC Traveling Wave Amplifier
HMMC-5021
The HMMC-5021 is a broadband GaAs MMIC traveling wave amplifier designed for moderate gain and moderate output power over the full 2-22 GHz frequency range. Typical applications of the HMMC-5021 include wideband gain blocks of communication systems and microwave instrumentation, which require a flat gain response and excellent port matches over the 2-22 GHz frequency range.
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Sentinel V Waves Array
Teledyne Marine RD Instruments
Teledyne RD Instruments Sentinel V Waves Array combines our highly robust, field-proven WavesMon processing with our new 5-beam Sentinel V ADCP to provide the highest-quality waves and current profiles of any ADCP in use today.
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37-Pin D-Type Male Solder Bucket
92-960-037-M
Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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Travelling Wave Fault Location Test Kit
PH Series
PH series travelling waveform fault locating relay/equipment test set is a new device to meet the needs of testing and verification for travelling wave fault location equipment and protection relay with TWFL function.
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Plane Wave Converter
PWC200
The R&S®PWC200 Plane Wave Converter is a bidirectional array of 156 wideband Vivaldi antennas placed in the radiating near field of the device under test (DUT). The phased antenna array can form planar waves inside a specified quiet zone within the radiating near field of the 5G massive MIMO base station for realtime radiated power and transceiver measurements (EVM, ACLR, SEM, etc.).
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Mini Coax, Contact, ITA, Solder Sleeve, RG316 & RG178
610103140
Mini Coax, Contact, ITA, Solder Sleeve, RG316 & RG178.Mechanical SpecificationsDurability 20,000 cyclesContact Material Shield – BrassCenter Conductor – BeCuContact Plating Shield – 50µ" Au over 100µ" NiCenter Conductor – 60µ" Au over 100µ" NiContact Termination Solder SleeveInsulator PTFEMating Force 1.5 lbs max [0.68 kg]Electrical SpecificationsCharacteristic Impedance 50 ΩFrequency Range DC to 2 GHzVSWR ≤ 1.2 @ 2 GhzInsertion Loss ≤ 0.05 dB @ 500 Mhz≥ -0.3 dB @ 2 GhzDWV 1500 VDC Min.Contact Resistance < 5 mΩ @ 0.5 Amp & always < 10 mΩCable Specifications RG316 & RG178Environmental SpecificationsOperating Temperature -50°C to +105°CInsulation Resistance 1000 MΩ min.
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37-Pin D-Type Female Solder Bucket
92-960-037-F
Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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Multicore Universal Solderability Tester
MUST System 3
The MUST System 3 is the latest technological evolution of the original Multicore Universal Solderability Tester (MUST) that grandfathered all modern solderability test standards. It remains the unquestioned industry benchmark for solderability testing.
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9-Pin D-Type Female, Solder Bucket, HV
40-960-009-F-HV
9-Pin Female D-Type Connector, High Voltage, Solder Bucket - With Backshell
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SparkFun Solder-able Breadboard
This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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68-Pin Micro-D Male Solder Bucket With Backshell
40-962B-068-SB-M
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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3D Solder Paste Inspection
aSPIre 3
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
