Hybrid And Fusion Bonding Systems
Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing face-to-face connection of wafers. The main application for hybrid bonding is advanced 3D device stacking.
Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing face-to-face connection of wafers. The main application for hybrid bonding is advanced 3D device stacking.
