PCB Materials

Teledyne Labtech specialise in the manufacture of RF/Microwave PCB utilising PTFE, LCP and high performance ceramic based substrates. These include materials from Rogers, Taconic and Neltec. The materials range in dielectric constant from, 1.96 (RO 5880 LZ) up to 12.85 (TMM 13).

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RF/Microwave PCB

Teledyne Labtech

Teledyne Labtech is recognised as a world leading supplier of complex RF PCB and Microwave Printed Circuit Boards. With over 35 years’ experience, Teledyne Labtech is your “one-stop” solution for design, manufacture and test of the most demanding RF/Microwave PCB designs.

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Pre-Bonded Metalbacked PCB

Teledyne Labtech

Teledyne Labtech's significant in-house resources have the capability to satisfy the most exacting demands of complex pre-bonded PTFE Microwave PCB. Our extensive machine shop facilities allows Teledyne Labtech to offer a complete sourcing solution from low volume prototypes to high volume production requirements. Teledyne Labtech can also offer pre-bonded metalbacked PCB with integrated wave-guide transitions and co-planar wave-guides.

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Multi-layer PCB

Teledyne Labtech

Teledyne Labtech has established considerable technical knowledge and manufacturing experience in the supply of complex microwave PTFE and Mixed Dielectric Multi-layer PCB. From simple multi-layer structures through to complex metal-cored PCB, Teledyne Labtech can offer the complete solution.Teledyne Labtech has a policy of continuous investment and now boasts a capability that can meet the most demanding RF/Microwave requirements. Teledyne Labtech can offer blind and buried, plated through vias (THP), laser cut cavities, embedded resistors and connectors.

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Metal Cored PCB

Teledyne Labtech

Teledyne Labtech is at the forefront of complex metal-cored PCB design and manufacture. The PCB use a thin metal core <2 mm, which acts as isolation between the RF/Microwave circuit and the Analogue/Digital circuitry and creates an excellent thermal path.The major advantages are reduced size and no need for complex microwave feed-thru's. The ability to laser cut pockets allows the designer engineer to mount the high power MMIC directly on to the metal core.

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Embedded Components

Teledyne Labtech

Teledyne Labtech prides itself in being at the forefront of RF/Microwave PCB development. Teledyne Labtech were also one of the first companies to successfully develop techniques for embedding SMD resistors and capacitors within multilayer structures and the embedding of connector pins in buried stripline circuits.The advantages of such a structures ensures a much higher density of interconnect. This then removes the need for via-hole connections to the board surface or the need to create access pockets to the inner layers. Consequently you finish with a board with that exhibits much lower RF/Microwave losses. This is particularly important when designing large RF feed networks or 16:1 power dividers.

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OhmegaPly®

Teledyne Labtech

For many years Teledyne Labtech has manufactured RF & Microwave PCB with integrated OhmegaPly® resistors. OhmegaPly® is a thin film resistor-conductor material. Using standard subtractive printed circuit technology, integral resistors are formed on circuit layers. These resistors can be buried within a Multilayer circuit board or used on the board surface. The resistors can also be used mounted on Metalbacked PCB.OhmegaPly® is available in 25 ohm per square, 50 ohm per square and 100 ohm per square sheet resistivity.

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Large Format PCB

Teledyne Labtech

Teledyne Labtech is one of the few companies in the world who can offer large format PCB for use in RF/Microwave applications. Our continued investment has expanded our capabilities to enable Teledyne Labtech to offer a large range of non-standard PCB. Our auto-clave vacuum oven capability allows Teledyne Labtech to manufacture large format Multilayer PCB.

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