General purpose pre-punched insulating punchboard is available in variety of grid patterns shown below for assembling circuit components. Vectorbord® is available in FR4 epoxy glass, FR2 phenolic, CEM-1 epoxy glass composite and FR4 HiTg 170°C materials. Vectorbord® listed below is unplated copper clad on one side, both sides or unclad with no copper layer on either side.
Boards with hole diameter of 0.042" (1.067mm) on 0.100"(2.54mm) square grid pattern. P-Pattern is available in FR4 epoxy glass, FR2 phenolic, CEM-1 epoxy glass composite and FR4 HiTg 170°C materials. P-Pattern listed below is unplated copper clad on one side, both sides or unclad with no copper on either side.
Boards with hole diameter of 0.062" (1.57mm) on 0.100"(2.54mm) square grid pattern. H-Pattern is available in FR4 epoxy glass material. H-Pattern listed below is without copper on either side.
Boards with hole diameter of 0.025" (0.635mm) on 0.050"(1.27mm) square grid pattern. M-Pattern is available in FR4 epoxy glass material. M-Pattern listed below is with and without uplated copper clad layer on one side.
Boards with hole diameter of 0.025" (0.635mm) on 0.078"(2mm) square grid pattern. Q-Pattern is available in FR4 epoxy glass material. Q-Pattern boards are without copper clad layers.
Boards with hole diameter of 0.067"(1.7mm) on 0.156"(3.96mm) square grid pattern. T-Pattern is available in FR4 epoxy glass and FR2 phenolic materials. T-Pattern boards are without copper clad layers.
Boards with hole diameter of 0.062"(1.57mm) on 0.100"(3.96mm) hex grid pattern. G-Pattern is available in FR4 epoxy glass material. G-Pattern boards are without copper clad layers.
Boards without holes, cut to size. X-Pattern is available in FR4 epoxy glass and CEM-1 epoxy glass composite materials.X-Pattern listed below is unplated copper clad on one side, both sides or unclad with no copper on either side.
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