Photonics & Telecom

Scientific Computing International (SCI)

photonic integrated circuit manufacturing delivers unmatched measurement accuracy.

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Micro-spot DUV Reflection and Transmission Spectrophotometry

FilmTek 3000 PAR - Scientific Computing International

Metrology system with a 50µm spot that delivers high-performance transmission and reflection measurement of patterned films deposited on transparent substrates. Ideally suited for measuring the thickness and optical constants of very thin absorbing films.

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Multiple Angle Reflectometry

FilmTek 4000 - Scientific Computing International

Fully-automated wafer metrology optimized for photonic integrated circuit manufacturing. Delivers unmatched measurement accuracy, with a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems. Designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.

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Reflection/Transmission Spectrophotometry

FilmTek 3000 PAR-SE - Scientific Computing International

Engineered to meet the needs of any advanced thin film measurement application, excelling at material characterization on both transparent and non-transparent substrates. Combines spectroscopic ellipsometry, DUV multi-angle polarized reflectometry, and transmission measurement with a wide spectral range to meet the most challenging of measurement demands in both R&D and production. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.

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Photonics & Telecom

Topics

Micro-spot DUV Reflection and Transmission Spectrophotometry

Multiple Angle Reflectometry

Reflection/Transmission Spectrophotometry