Photonics & Telecom
Scientific Computing International (SCI)
photonic integrated circuit manufacturing delivers unmatched measurement accuracy.
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Product
Micro-spot DUV Reflection and Transmission Spectrophotometry
FilmTek 3000 PAR
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Scientific Computing International
Metrology system with a 50µm spot that delivers high-performance transmission and reflection measurement of patterned films deposited on transparent substrates. Ideally suited for measuring the thickness and optical constants of very thin absorbing films.
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Product
Multiple Angle Reflectometry
FilmTek 4000
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Scientific Computing International
Fully-automated wafer metrology optimized for photonic integrated circuit manufacturing. Delivers unmatched measurement accuracy, with a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems. Designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.
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Product
Reflection/Transmission Spectrophotometry
FilmTek 3000 PAR-SE
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Scientific Computing International
Engineered to meet the needs of any advanced thin film measurement application, excelling at material characterization on both transparent and non-transparent substrates. Combines spectroscopic ellipsometry, DUV multi-angle polarized reflectometry, and transmission measurement with a wide spectral range to meet the most challenging of measurement demands in both R&D and production. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
