They provide uniformity, durability and repeatability in circuit fabrication. The coils are polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermocompression bonding.
MACOM’s MMI-9000 and 9100 Series Chip Capacitors feature high stand-off voltage and low dielectric loss leveraging nitride/oxide dielectric layers. Gold bonding surfaces, top and bottom provide ease of bonding and minimum contact resistance. MACOMs beam lead capacitors have high insulation resistance, low dissipation factor, and low temperature coefficient, which are features that produce devices with excellent long-term stability.
MACOM’s BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are additive, so many combinations are possible.
MACOM’s Mounting Capacitors are designed for transient protection for MICs and FETs. Since the capacitor substrate is silicon, it provides an optimum match both thermally and mechanically with the device to be mounted. A wide range of sizes and capacitance values are available as standard products. Our design flexibility allows MACOM to offer a variety of size and capacitance options for specific customer requirements.
MACOM’s MMI-9000 and 9100 Series Chip Capacitors feature high stand-off voltage and low dielectric loss due to our use of nitride/oxide dielectric layers. Gold bonding surfaces, top and bottom provide ease of bonding and minimum contact resistance. MACOMs high Q MNOS series of capacitors have high insulation resistance, low dissipation factor, and low temperature coefficient, which are features that produce devices with excellent long term stability.
MACOM's chip capacitors are used extensively in commercial and aerospace and defense applications. Our capacitors are designed for long-term reliability and repeatable performance in a variety of hybrid microwave circuit applications operating up through the Ku-band frequency. MACOM’s capacitors have the distinct advantage of higher capacitance per unit area, resulting in smaller chips for a given capacitance.
MACOM’s MIS capacitors utilize a silicon nitride dielectric over a thermally grown silicon dioxide base. The resultant composite dielectric exhibits low leakage current and insertion loss with excellent long-term stability. The temperature coefficient of capacitance is typically +55 ppm / ºC and is ideally suited for high reliability applications.
MACOM’s MMI-9000 and 9100 Series Chip Capacitors feature high stand-off voltage and low dielectric loss leveraging nitride/oxide dielectric layers. Gold bonding surfaces, top and bottom provide ease of bonding and minimum contact resistance. MACOMs beam lead capacitors have high insulation resistance, low dissipation factor, and low temperature coefficient, which are features that produce devices with excellent long-term stability.
MACOM’s BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are additive, so many combinations are possible.
MACOM’s Mounting Capacitors are designed for transient protection for MICs and FETs. Since the capacitor substrate is silicon, it provides an optimum match both thermally and mechanically with the device to be mounted. A wide range of sizes and capacitance values are available as standard products. Our design flexibility allows MACOM to offer a variety of size and capacitance options for specific customer requirements.
MACOM’s MMI-9000 and 9100 Series Chip Capacitors feature high stand-off voltage and low dielectric loss due to our use of nitride/oxide dielectric layers. Gold bonding surfaces, top and bottom provide ease of bonding and minimum contact resistance. MACOMs high Q MNOS series of capacitors have high insulation resistance, low dissipation factor, and low temperature coefficient, which are features that produce devices with excellent long term stability.
MACOM's chip capacitors are used extensively in commercial and aerospace and defense applications. Our capacitors are designed for long-term reliability and repeatable performance in a variety of hybrid microwave circuit applications operating up through the Ku-band frequency. MACOM’s capacitors have the distinct advantage of higher capacitance per unit area, resulting in smaller chips for a given capacitance.
MACOM’s MIS capacitors utilize a silicon nitride dielectric over a thermally grown silicon dioxide base. The resultant composite dielectric exhibits low leakage current and insertion loss with excellent long-term stability. The temperature coefficient of capacitance is typically +55 ppm / ºC and is ideally suited for high reliability applications.
We use cookies to optimize site functionality and give you the best possible experience. To learn more including options for managing cookies, please check out our cookie policy.