Showing results: 61 - 75 of 81 items found.
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Series 547 -
Aries
Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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Series 6556 -
Aries
Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
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Series X55X -
Aries
Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
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Series 800 -
Aries
Vertisockets Horizontal Mounting with Bifurcated Contacts. Aries offers a full line of VertisocketsTM for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. The variations of mounting position and pin configuration provide exceptional design freedom.
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Series 154 -
Aries
Yellow Streak Jumpers on .100 [2.54] Centers. A low-cost jumper available with (Series 154YP) or without (Series 154YS) pitch bars.
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Series 516 -
Aries
Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Contacts are normally open and are closed by a unique cam action controlled by dual lever arms. The last 15° of movement of the cam provides a wiping action to the contacts on the legs of the device to remove any residue, ensuring a gas-tight seal.
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1111841-X -
Aries
.5MM 8 AND 10 PIN MSOP TO .3 DIP ADAPTERS. A cost effective means of upgrading to MSOP .5MM package SOIC... without changing your PCB layout. Available on .300 [7.62] centers.
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96-160M65 -
Aries
QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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16-304633-18 -
Aries
20 PIN PLCC TO 16 PIN DIP ADAPTER FOR MOTOROLA MC12009 AND OTHERS. A cost effective means of upgrading to PLCC Package without changing your PCB layout.
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22-304504-18 -
Aries
24Pin SOIC w/ Package to 22 Pin .4 DIP. A cost effective means of upgrading to SOIC without changing your PCB layout.
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1111903 -
Aries
24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC?s. A cost effective means of upgrading to SOIC without changing your PCB layout.
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44-305263-20 -
Aries
44 Pin .8mm QFP to 44 Pin PLCC Adapter. cost effective means of upgrading to QFP without changing your PCB layout.
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1110267-N -
Aries
68 PIN PLCC PACKAGE MOTOROLA MC68HC000 TO 64 PIN DIP FOOTPRINT. Allows easy replacement of a difficult to find part.
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EJECT-A-DIP -
Aries
Lock/Eject DIP Collet Sockets with Surface Mount Pins. Features: Aries Eject-A-Dip is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage.
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68-304538-10 -
Aries
68P PLCC WITH DIE FLIPPED TO 68 PGA FOR 87C196 IC AND OTHERS. Correct-A-Chip technology solves problems associated with the use of alternative ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.