Bruker Nano Surfaces
From leading edge scientific research to high-speed production, Bruker provides the critical surface measurements necessary for success with the world's broadest range of AFMs, stylus profilers, mechanical testers, non-contact 3D optical microscopes, and fluorescence optical microscopes.
- 978-663-3660
- 978-663-5585
- pr@bruker.com
- 40 Manning Road
Billerica, MA 01821
United States of America
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Product
CS/ONH Analyzers
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Elemental analysis of CS and ONH in inorganic materials | Based on the know-how of many decades Bruker offers innovative solutions for rapid and precise elemental analysis of carbon, sulfur, oxygen, nitrogen and hydrogen.
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Product
3D Optical Microscopy
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Bruker is the worldwide leader in 3D surface measurement and inspection, offering fast, non-contact analyses for samples ranging in size from microscopic MEMS to entire engine blocks. Our microscopes are the culmination of ten generations of proprietary Wyko® Technology advances that provide the high sensitivity and stability necessary for precision 3D surface measurements in applications and environments that are challenging for other metrology systems.
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Product
Process & Material Characterization System
TriboLab CMP
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Bruker’s TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost-effective bench characterization of waferpolishing processes. Small R&D-scale specialty system for CMP. Reproduces full-scale wafer polishing process conditions without downtime on production equipment. Provides unmatched measurement repeatability and detail. Allows testing on small coupons for substantial cost savings over whole-wafer testing.
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Product
Nanomechanical Test Instruments for Microscopes
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Bruker has developed a comprehensive suite of nanomechanical and nanotribological test instruments that operate in conjunction with powerful microscopy techniques. Combining the advantages of advanced microscopy technologies with quantitative in-situ nanomechanical characterization enables an accelerated understanding of material behavior at the nanoscale.
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Product
CMP Process and Material Characterization System
CP-4
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he new Bruker CP-4 CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost effective characterization of wafer polishing processes. Reproduces full-scale wafer polishing-process conditions. Provides unmatched measurement repeatability and detail. Performs tests on small coupons rather than whole wafers for substantial cost savings.













