Tokyo Seimitsu Co., Ltd.
Manufactures and sells semiconductor manufacturing equipment and measuring instruments.
- 042-642-1701
- 042-642-1798
- 2968-2, Ishikawa-machi
Hachioji-shi, Hachioji-shi 192-8515
Japan
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Product
Optical Shaft Measuring System
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The measurements and shape of the shaft or rotating partsare measured in an overwhelmingly short time. In our lineup, we can handle inspection and automation during production processes, so we can contribute to increased productivity at your company.
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Product
Precision ACCRETECH Dicing Tools
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Precision ACCRETECH Dicing Tools for precision cutting are derived from our unique development technology as well as our diverse application technology. We offer products that can cut a variety of materials, cover diverse cutting applications and satisfy today's requirement of "high quality & low cost".
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Product
*CNC Surface Texture Measuring Instrument
Surfcom C5
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SURFCOM C5 allows customization of the workpiece feed unit and jig production to suit particular needs.Basic specifications are Type-C (mainly for cylinder heads, cylinder blocks, and other workpieces wherea 5-direction approach is required) and Type-S (for camshafts and other shaft workpieces that require arotary axis).
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Product
Probing Machines
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Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
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Product
High Rigid Grinder
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High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials.
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Product
Air Micrometers
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As the pioneer of air micrometers and electric micrometers in Japan, we respond to a variety of needs for high precision production line measurements.
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Product
Surface Texture And Contour Measuring Instruments/Systems
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We provide high performance, easy-to-use systems from highly efficient hybrid types that can measure the surface roughness and the contour in one trace, to portable types that can be used even on the production site.
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Product
*Coordinate Measuring Machine
PRISMO ultra
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PRISMO ultra uses uncompromising precision technology and was developed for measurements that require extremely high accuracy. PRISMO ultra incorporates a well-balanced combination of cutting-edge accuracy, speed, rigidity, and cost performance. This 3D coordinate measuring machine is best suited for research and development of high-precision parts and calibration inspection of reference gages.
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Product
Dedicated Measuring Machine
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We offer measurement systems optimized for various production sites. We design and manufacture high precision, stable specialized measuring instruments to match requested specifications and requested performance.
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Product
X-ray CT System
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The surface and the internal parts, in one measurement. We provide “Dimensional X-ray CT System” that does not only observe the interior of the workpiece, but that can also perform high precision, contactless measurements.
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Product
Non-contact Displacement Sensors
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This is a flexible sensor that can be installed anywhere and is equipped with high environmental resistance enabling use in harsh environments.
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Product
Polish Grinders
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The polish grinder is a single machine that can both slice various device wafers and remove damage,which has been developed from a unique idea of ACCRETECH-Tokyo Seimitsu. In recent years, the grinder also contributes to various grinding and polishing processes required for advanced packaging technologies such as laminated memory and FO/2.5D/3D.
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Product
Auxiliary Equipment For Probing Machines
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We have a lineup of products that support the probing process.
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Product
Dicing Machines
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Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
















