Showing results: 1 - 15 of 28 items found.
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Tokyo Seimitsu Co., Ltd.
We offer the ATC Run-Out Detection System and the Wireless Bore Gauge. We will boost the realization of increased productivity with high precision measurement technology.
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Tokyo Seimitsu Co., Ltd.
As the pioneer of air micrometers and electric micrometers in Japan, we respond to a variety of needs for high precision production line measurements.
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Tokyo Seimitsu Co., Ltd.
Measurements of the length displacement or yawing and pitching, measurements of rotation angles, measurements of overshoots during vibrations or when stopped and of uneven speed, etc. can be handled. Length measuring instruments can be used for a variety of purposes, including precise inspection of heavy duty equipment.
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Tokyo Seimitsu Co., Ltd.
We respond to a variety of needs with our lineup including both rotating table types that enable high precision measurement of cylindrical workpieces, and rotating type detectors that handle eccentric or heavy workpieces.
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Tokyo Seimitsu Co., Ltd.
This is a flexible sensor that can be installed anywhere and is equipped with high environmental resistance enabling use in harsh environments.
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Tokyo Seimitsu Co., Ltd.
We offer an abundant lineup such as the PULCOM series for in-process and post-process measurements, and the SBS products for the grinding wheel’s automatic balance system.
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Tokyo Seimitsu Co., Ltd.
Probing machine is a wafer transfer and positioning device used for testing the electrical characteristics of chips formed on wafers. This wafer test is used to sort out good and defective chips.
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Tokyo Seimitsu Co., Ltd.
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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Tokyo Seimitsu Co., Ltd.
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Tokyo Seimitsu Co., Ltd.
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Tokyo Seimitsu Co., Ltd.
The surface and the internal parts, in one measurement. We provide “Dimensional X-ray CT System” that does not only observe the interior of the workpiece, but that can also perform high precision, contactless measurements.
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Tokyo Seimitsu Co., Ltd.
We have a lineup of package singulation machines, automatic cleaning systems, chillers, etc. that support the dicing process.
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