Rhesca Co., Ltd.
Manufactures and sells strength testers that measure solder joint strength and bonding strength in the semiconductor assembly process, and surface property testers that evaluate thin film adhesion and frictional wear.
- +81-(0)42-582-4711
- +81-(0)42-589-4686
- 1-15-17 Hinohonmachi
Hino-shi, Tokyo 191-0011
Japan
Categories
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product
Tackiness Tester
TAC1000
For the measurement of tackiness (instantaneous adhesive strength) of various pastes and adhesive tapes, it is possible to quantitatively evaluate the data, which until now had large errors due to individual differences. First, press the measuring probe, which is controlled (approach speed, pressure force, pressure time, separation speed) against the sample, and measure the adhesive force in the process of separating. Measured data can be processed by a computer. With double temperature control (patented), the sample piece is preheated from the back side with a hot plate and the heated probe penetrates the measurement surface, making it possible to keep the set temperature and the temperature of the test surface to be evaluated constant. Since the pressurization time can be as short as 10msec, it is possible to measure the tackiness caused by momentary contact.
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product
Solder Wettability Tester
5200ZC
The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.
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product
Thermal Conductivity Measuring Device
TCM1001
In recent years, there has been a demand for small and thin electronic products such as mobile devices, and printed circuit boards are shifting to thin, multi-layered, and even modularized printed circuit boards. effect of bonding materials, that is, the ability to easily conduct heat, is emphasized, and testing equipment that evaluates thermal conductivity is required .As a business of our company, we have mainly manufactured and sold test equipment for solder wettability tests and solder bonding strength, but there was a need to urgently develop next-generation bonding material test equipment to replace these. Under these circumstances, we received a request from an academic research facility to manufacture a device that can measure the thermal conductivity of conductive adhesives under research and development, and we were able to obtain an opportunity to develop the device. We proceeded with the development based on these requirements .
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product
Repeat Durability Tester
TIQ1000
It is a device to measure repeated endurance such as limit bending test of board, endurance test of mounted board, endurance test of connector, etc. Continuity data and load data can be obtained during the cyclic endurance test. Conforms to JEITA ET-7407 "Environmental and durability test methods for mounted CSP/BGA packages".
