Rhesca Co., Ltd.
Manufactures and sells strength testers that measure solder joint strength and bonding strength in the semiconductor assembly process, and surface property testers that evaluate thin film adhesion and frictional wear.
- +81-(0)42-582-4711
- +81-(0)42-589-4686
- 1-15-17 Hinohonmachi
Hino-shi, Tokyo 191-0011
Japan
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Product
Tackiness Tester
TAC1000
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For the measurement of tackiness (instantaneous adhesive strength) of various pastes and adhesive tapes, it is possible to quantitatively evaluate the data, which until now had large errors due to individual differences. First, press the measuring probe, which is controlled (approach speed, pressure force, pressure time, separation speed) against the sample, and measure the adhesive force in the process of separating. Measured data can be processed by a computer. With double temperature control (patented), the sample piece is preheated from the back side with a hot plate and the heated probe penetrates the measurement surface, making it possible to keep the set temperature and the temperature of the test surface to be evaluated constant. Since the pressurization time can be as short as 10msec, it is possible to measure the tackiness caused by momentary contact.
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Product
Solder Wettability Tester
5200 Advanced
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This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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Product
Repeat Durability Tester
TIQ1000
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It is a device to measure repeated endurance such as limit bending test of board, endurance test of mounted board, endurance test of connector, etc. Continuity data and load data can be obtained during the cyclic endurance test. Conforms to JEITA ET-7407 "Environmental and durability test methods for mounted CSP/BGA packages".
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Product
Seam Fold Test Device
FFR1000
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This equipment is designed to bend a flexible printed circuit board, which has a high degree of freedom and versatility, and at that time, apply a load to the bending point at the initial stage or each time, and repeat bending and unfolding to confirm the durability.
