ALTO-SD-150/200 - In-Line Wafer Surface Defect Inspection ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.

YTV M1 Series AOI - M-size In-Line Automated Inspection Programming the M1 Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The M1 Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines.

XE-LCD - Automated Industrial AFM for In-line Flat Panel Inspection and Metrology Atomic Force Microscopy (AFM) is emerging as an essential tool in many industries. With its ability to accurately measure critical dimensions in the micrometer to nanometer regime, the AFM is becoming an essential tool choice in flat panel applications such as surface roughness, channel height and width measurement, and column/pitch spacer characterization. The XE-LCD is a completely automated AFM/SPM system designed for characterization of flat panel displays as either an in-line or off-line inspection tool.

PVI-6 Solar - Automated Optical In-line Solar Wafer and Cell Inspection The PVI-6? is designed for optical in-line dual sided inspection of photovoltaic (PV) wafers and cells. The newest addition to KLA-Tencor?s ICOS division?s PV portfolio, the PVI-6 provides customers with the capability to inspect solar wafers and cells at the highest speed and accuracy for all stages of the production process. These new capabilities enable solar manufacturers to achieve substantial yield improvements and more accurate product classification

XE-Wafer - Automated Industrial AFM for In-line Wafer Inspection and Metrology The XE-Wafer is a fully automated industrial AFM that can measure surface roughness, trench width, depth and angle measurements on 200mm & 300mm wafers with precision in a production environment.

YTV F1 Series AOI - Automated In-line PCB Inspection Nordson YESTECH's advanced 5 megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera and four side viewing cameras, the FX Series inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

AITTFH - In-Line Pattern Wafer Defect Inspection System offers exceptional sensitivity and throughput needed by today's advanced thin film head manufacturing fabs for a broad range of patterned wafer tool monitoring applications, including deposition, CMP, critical etch, and photo modules.

Prime - 3D In-line After Printing Substrate Bump Inspection System 3D In-line After Printing Substrate Bump Inspection System

Solder Paste Inspection (In-Line) With higher measurement resolution than laser triangulation technology, wider measurement range than Moire technology and faster inspection speed by on-the-fly imaging technology, FAHP (Flying Absolute Height Profilometry) technology features outstanding 3D measurement performance beyond state of the art 3D technologies. True volume measurement of solder paste without pad offset effect.

X8011 - In-line-Capable X-ray Inspection System Newer and multi-layered technologies require inspection solutions suitable for making concealed and ever-smaller structures visible. Typical application areas for the X8011 include inspection of populated PCBs, electronic components, and also the challenges of non-destructive testing (NDT) and general quality assurance.

S3070 - AFI-Scan - Fully Automatic In-line Final Inspection for Bare Boards The optical inspection of completed bare boards is essential to guarantee a high quality during subsequent component placement. The S3070 AFI-Scan detects mechanical damage, solder resist splashes or other contamination on the visible surface, as well as mask offset, contour defects and missing or faulty holes, cuts, and cut edges.

KY8030-2 - Dual Projection 3D In-Line Solder Inspection System The new KY8030-2 delivers 2x faster inspection without compromising performance and accuracy. Using patented dual projection, the system eliminates the critical Shadow problem that all 3D SPI systems can be vulnerable to. Easy UI and SPC Plus are included in the system package in order to help users achieve faster & easier printer process optimization

X2 2D X-Ray - Automated In-line X-Ray Inspection System Nordson YESTECH's versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCB's and packaged semiconductors. Ideal for in-line or off-line operation, the X2's proven algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.

GEM - Compact AOI system MVP's GEM Compact AOI system is a revolutionary tabletop, lightweight inspection solution. MVP is now offering unsurpassed high performance and high resolution capabilities previously only available with in-line AOI platforms. The GEM Compact represents a breakthrough in tabletop inspection by providing the leading comprehensive solutions to complex inspection challenges.

850G - 2D and 3D Material Inspection The 850Gs Combined 2D and 3D capabilities provide full epoxy, paste and underfill measurements. The 850G 3D Paste capabilities allow for in‐line high speed inspection of paste deposition, positional accuracy, volume and height with a resolution down to 4um. The 2D Flux capabilities allow for flux inspection without the need for florescent additives. Capabilities include; flux boundary and coverage (flow and spread) and positional accuracy.

BX AOI - Benchtop Automated Optical Inspection Nordson YESTECH's advanced 5 megapixel color camera imaging technology offers benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput. The optional four side viewing cameras add additional inspection capabilities found only on in-line systems.

AIT-TFH - Micro-Defect Inspection System KLA-Tencor's AITTFH in-line pattern wafer defect inspection system offers exceptional sensitivity and throughput needed by today's advanced thin film head manufacturing fabs for a broad range of patterned wafer tool monitoring applications, including deposition, CMP, critical etch, and photo modules.

TR7600 - Automated X-Ray Inspection system The TR7600 in-line Automated X-Ray Inspection system uses X-Ray technology to penetrate PCBs and components to capture test images. It is the ideal solution for testing BGA components and areas not accessible by other test technologies.

YTV M1m AOI - Automated Optical Inspection for Microelectronics Nordson YESTECH's advanced megapixel technology offers high-speed device inspection with exceptional defect coverage. With high resolution and telecentric optics, M1m inspects bond wires, die placement, SMT components and substrates, all within a footprint less than 1 sq. meter. The M1m can be put in-line with your wire bonders or off-line to support several bonders. A magazine loader/unloader is available for off-line operations.

TR7500 - In-Line Full-Feature Color AOI System he TR7500 is TRI's newest in-line AOI system with the latest technology. Featuring a high-end digital 3-CCD full color camera and four black and white angle cameras, the TR7500 has a greater field-of-view for faster inspection

Ranger - High Speed 3D Cameras The Ranger camera measures 3D features at unmatched speed, producing a complete data set of the object measured. Providing a third dimension adds height and shape measurement data, which can be critical when correctly classifying an object. Ranger is the key component in many market leading in-line inspection machines used in the Electronic, Semicon, Wood, Robot Vision, Plastic, Rubber and Food industries.

SpecVision - FIBER OPTIC MICROSCOPES SpecVision™ is a video probe that engages directly with Krell polishing machines. This permits the viewing of polished optical surfaces while connectors or bare fibers are still loaded in the polisher. This in-line video inspection technique minimizes material handling and potential damage/contamination that may occur when transferring components from the polisher to a traditional microscope. SpecVision™ can interface with Scepter™, SpecPro™ and Rev™ Polishers.

HS-PL - Wafer and Cells PL System Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.