Nordson YESTECH's versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCB's and packaged semiconductors. Ideal for in-line or off-line operation, the X2's proven algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.
The Omron VT-X700 is the perfect solution to manufacturers desiring high-speed, in-line, automated X-Ray inspection on PCBs containing components such as BGAs or CSPs with hidden solder joints. Traditional AOI technology is incapable of inspecting these types of components but the VT-X700 uses revolutionary, high-precision, X-ray, CT imaging to perform precise and reliable analysis of these hidden areas.
Nordson YESTECH's advanced 5 megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewingcamera and four side viewing cameras, the FX Series inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
Nordson YESTECH's advanced 9 megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewingcamera and four side viewing cameras, the FX-940 inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
With higher measurement resolution than laser triangulation technology, wider measurement range than Moire technology and faster inspection speed by on-the-fly imaging technology, FAHP (Flying Absolute Height Profilometry) technology features outstanding 3D measurement performance beyond state of the art 3D technologies. True volume measurement of solder paste without pad offset effect.
Designed for in-line inspection, the VT-RNSII is an ideal solution for smaller manufacturers running low volume to customers with large volumes. The inspection algorithms used in the VT-RNSII are identical to the fully automated in-line machine, the VT-RNSII-PTH benchtop machine.
Saki boosts up the inspection to another stage by this ultimate inspection system.The high-accuracy 3D image makes the detection of defects much easier.BF-X2 is our proudly offered 3D X-ray inspection system which provides a new standard of inspection system.
The PVI-6? is designed for optical in-line dual sided inspection of photovoltaic (PV) wafers and cells. The newest addition to KLA-Tencor?s ICOS division?s PV portfolio, the PVI-6 provides customers with the capability to inspect solar wafers and cells at the highest speed and accuracy for all stages of the production process. These new capabilities enable solar manufacturers to achieve substantial yield improvements and more accurate product classification
The next generation fastest in-line Solder paste inspection system in the market. The measuring speed is 100cm2/sec at 13x13um resolution, and 80cm2/sec at 10x10um resolution. It can inspect smaller than 01005 pads and sizes as small as 100um. The HS70 inspection cycle time has been greatly reduced based on PARMI’s development of the RSC-6 sensor. Furthermore, there are two kinds of magnification of Camera Lens for the RSC Sensor delivering – 0.42x to 0.6x magnifications providing more control t...
Programming the M1 Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The M1 Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines.
Newer and multi-layered technologies require inspection solutions suitable for making concealed and ever-smaller structures visible. Typical application areas for the X8011 include inspection of populated PCBs, electronic components, and also the challenges of non-destructive testing (NDT) and general quality assurance.
offers exceptional sensitivity and throughput needed by today's advanced thin film head manufacturing fabs for a broad range of patterned wafer tool monitoring applications, including deposition, CMP, critical etch, and photo modules.
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY...
Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. Ideal for in-line or off-line operation, the X3's innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.
Quality Inspection Systems for in-line quality and completeness control for assembly are used for fast and reliable inspection of all visible components in complex assembly, packaging, and production lines.
The Coherix team serves its electronics and semiconductor customers with high-speed in-line inspection products. The 3DX™ Series is a major advance in the semiconductor inspection technology. Handlers no longer need to stop parts to inspect them. 3DX measures semiconductor packages optically on-the-fly, setting a new standard of throughput. This vision inspection system measures 3D characteristics of up to 70,000 parts per hour!
Designed for off-line inspection, the VT-RNSII-ptH is an ideal solution for smaller manufacturers running low volume or prototyping assembly lines. The inspection algorithms used in the VT-RNSII-ptH are identical to the fully automated in-line machine, the VT-RNSII.
The 850Gs Combined 2D and 3D capabilities provide full epoxy, paste and underfill measurements.The 850G 3D Paste capabilities allow for in‐line high speed inspection of paste deposition, positional accuracy, volume and height with a resolution down to 4um.The 2D Flux capabilities allow for flux inspection without the need for florescent additives. Capabilities include; flux boundary and coverage (flow and spread) and positional accuracy.
Automatic high-speed in-line inspection system for electronic devices and assemblies. Featuring transmission x-ray technology, intelligent handling system for fast loading/unloading as well as MIPS software solutions for inspection of single-sided and double-sided boards. Patent Pending Slice Filter Technology (SFT) allows for inspection of overlapping solder joints.
MVP's GEM Compact AOI system is a revolutionary tabletop, lightweight inspection solution. MVP is now offering unsurpassed high performance and high resolution capabilities previously only available with in-line AOI platforms. The GEM Compact represents a breakthrough in tabletop inspection by providing the leading comprehensive solutions to complex inspection challenges.