Showing results: 106 - 120 of 435 items found.
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Sigma EFEM -
Xyztec
Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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FM200 -
HenergySolar
Sapphire/SIC wafer flatness and surface appearance system provide a previous surface flatness testing solution, though non-contract lighting testing to record the whole information of the surface, rapid and fast measurement for various of surfaces, line and all kinds of surface information.
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GPR-GB7SY -
Genmark Automation
The GPR-GB7SY Yaw-Axis (single and dual yaw) robot features Genmark’s technologically advanced mechanisms including patented GPR and YAW technologies to achieve the highest level of performance currently available in an automated material handler capable of transporting up to 450mm wafer payloads with utmost reliability and precision.
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GB4S-W -
Genmark Automation
Genmark’s “wet” process wafer handling robot, the GB4S-W Robot System, offers precision, performance, and reliability. The GB4S-W assures optimal performance and maximum up time of wet process equipment with minimal footprint. The GB4S-W addresses all major concerns such as premature damage of robot’s mechanisms due to moisture/humidity operational conditions associated with wet process applications including CMP and other applications.
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GPR-GB7-W -
Genmark Automation
GPR-GB7-W Robot System is designed with sealed mechanisms to prevent internal damage due to exposure to wet environments associated with automation of CMP and other process applications requiring materials handling under wet conditions.
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Hprobe Company
Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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IS-T1 -
BT Imaging Pty Ltd
Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
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MX 10x series -
E+H Metrology GmbH
The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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GPR-GB8 -
Genmark Automation
Designed for ultra-precise transport of 300/450mm wafers and large FPDs, the GPR-GB8 Robot System combines increased reach and load capacity while employing Genmark’s breakthrough patented GPR™ technology.The patented GPR™ technology enables the servo-controlled robot to interface compliantly and intelligently with misaligned cassettes, FOUPS and process modules, as well as provide software-controlled end-effector deflection compensation during transport of heavier payloads.
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GPR-GB8-SM -
Genmark Automation
The combination of global linear motion of the two-links arm (R-axis) and rotation (Y-axis) of two swapping arms (A1 and A2 axes) ensure optimal handling of up to 4 in-line FOUPs, and dimensionally equivalent process modules, without the need to mount the robot on linear track component.
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G-Rex3™ -
Genmark Automation
The G-Rex3™ robotic system offers a small footprint, optimal throughput, reliability and serviceability in a cost effective package. It features innovative patent-pending designs, advanced control approaches and EZTeach technologies resulting in improved performance and reliability. The G-Rex3™ is a simplified low-mass design with fewer parts and moving components. The result is improved dynamics leading to higher acceleration and speed.
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PN-100BI -
NAPSON Corp.
*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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MX 70x -
E+H Metrology GmbH
The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
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Customized Solutions -
Microtronic, Inc.
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.