Showing results: 31 - 45 of 438 items found.
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SortMax200™ -
Genmark Automation
Achieve exceptional performance with Genmark's SortMax200™ wafer sorter, designed for handling wafers up to 200mm. The SortMax200™ can be configured to accommodate a maximum number of eight open cassette stations.
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ipTEST Limited
ipTEST now offers a range of multi-prober test systems with increased productivity and increased capability for power discrete wafer testing. Perform power discrete wafer testing and Known Good Die (KGD) tests.
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IV-W2000 -
In.D Solution
The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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SemiProbe
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Tropel® -
Corning Inc.
Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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EV Group
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Insight Scientific
Aged wafer equipment upgrade all control hardware & software and operation system, expand data connectivity for industrial 4.0.
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IL-800 -
Sinton Instruments
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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INSPECTRA® Series -
Toray Engineering Co., Ltd.
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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IQtouch -
Johnstech International Corporation
The new IQtouch™ Micro Final Test Probe Arrays, for example, deliver unsurpassed low and stable contact resistance (CRES). This is accomplished through a balanced optimization among several critical and competing engineered parameters, including effective test signal transmission path, probe / wafer interface (“touch”) points and elastomeric web forces, and precision manufactured components for superior X/Y/Z co-planarity
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SortMax300™ -
Genmark Automation
Genmark's SortMax300™ is a next generation SORTER producing the highest throughput rapid software set-up and lowest cost-of-ownership culminating from 25 years' experience in design, development, and manufacture of wafer handling equipment.High throughput is achieved using Genmark’s high precision robots, including the robot series featuring the patented GPR technology robots enabling automatic compliant interaction with misaligned process modules and capable of deflection compensation during transport of high payloads.
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Dynamic Test Solutions
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Camtek Intelligent Imaging
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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JRT Photovoltaics GmbH & Co. KG
The highly sophisticated machine platform WHD meets the various requirements of solar cell mass production. The WHD ensures the efficient, fully automated loading and unloading of quartz boats in the diffusion process step.