Showing results: 346 - 360 of 435 items found.
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Test Electronics
Ceramic engineering specializing in Silicon Carbide, Boron Carbide, Alumina, Zirconia and Lead Zirconate Titanate (PZT) based ceramics, composites and thin films for High Strength, high temperature, semiconductive ceramic designed for use in wafer fabrication or hybrid circuits in vapor deposite ovens. Test Electronics will precision drill and customize pallets for your circuit board. Click on the Quote tab on the left then click on the Carrier Pallets tab to get an instant quotation on your process carrier pallets.
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HS-3FC II -
HenergySolar
Super Silicon Resistivity and Type Tester is specially designed for silicon sorting，it can quickly test the silicon type, heavy-doped, resistivity and current, and can be widely used in all kinds of silicon sorting, like granular polysilicon material, break semiconduct silicon wafer, chunk material, top and tail material and so on. Furthermore, it integrates two probes, three probes and four probes. With the three probes, it could show type and heavy type simultaneously, strongly improved the sorting efficiency.
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CS-153N -
HORIBA, Ltd.
The CS-153N is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use HF/HNO3 solution to etch silicon oxide and remove particles from the wafer surface. The CS-153N continually monitors each component of the HF/HNO3 solution (HF/HNO3/H2O), alerting the user each time the solution is replaced or replenished. This allows you to maintain the concentration of the HF/HNO3 solution within the tolerance range, while eliminating unnecessary solution replacement.
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CS-137 -
HORIBA, Ltd.
The CS-137 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use BHF solution to etch silicon oxide and remove particles from the wafer surface. The CS-137 continually monitors each component of the BHF solution (NH4F/HF/H2O), alerting the user each time the solution is replaced or replenished. This allows you to maintain the concentration of the BHF solution within the required component ranges, while eliminating unnecessary solution replacement.
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DC3 -
Hilevel Technology, Inc.
The wafer has been fully tested, cut and packaged. Today's IC manufacturers are finding tremendous cost savings in performing just fast DC tests on these packaged parts rather than running the full wafer tests all over again. Until now this required either an expensive full-power IC tester, or a "rack-n-stack" collection of instruments. Enter the HILEVEL DC3 Co-Optive Parametric Tester. No more instruments, no switching matrix, no tricky software. The DC3 combines a high-precision DC-PMU and internal DUT supplies to test up to 2,048 pins, all in a single chassis with Multi-Site capability up to 64 sites. And every DC3 includes our Classic Curve Trace feature, allowing easy curve tracing on every pin.
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Tropel® FlatMaster® MSP -
Corning Inc.
The Tropel® FlatMaster® MSP (Multi-Surface Profiler) is a frequency stepping interferometer that provides fast and accurate metrology for semiconductor wafers up to 300mm in diameter. In seconds up to 3 million data points are collected with sub-micron accuracy enabling total thickness and flatness characterization over the entire surface.
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ASE Industrial Holding Co., Ltd.
ASE provides a complete range of semiconductor testing services to our customers, including front-end engineering testing, wafer probing, final testing of logic, mixed signal, and memory semiconductors, and other test-related services. Our testing services employ technology and expertise that are among the most advanced in the semiconductor industry.
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T5830 -
Advantest Corp.
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Reedholm Systems
We make DC test systems used by semiconductor manufacturers to make measurements on electrical test structures and simple devices. Because of the broad application of test structures, our test systems help assure quality and reliability in process development, wafer acceptance testing, reliability evaluation, and dc final test.
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T5230 -
Advantest Corp.
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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TableTop Shadow Moiré (TTSM) -
Akrometrix, llc
Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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FilmTek 2000 -
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter. Capable of simultaneous determination of multiple film characteristics within a fraction of a second per site.
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EV Group
EVG's metrology solutions for wafer inspection and measurement are optimized for lithography and all types of bonding applications. Customers can choose between integration of the metrology technology within fully-automated equipment, or stand-alone metrology systems serving multiple process steps. EVG's metrology solutions are optimized to maximize our customers' production yields, featuring:
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Anton Paar GmbH
Surface analysis is a vital method for qualifying new materials in technical and biological applications. Surface charge analysis empowers users to closely monitor the surface chemistry from small particles in the nanometer range up to large wafers. Gain insights into modifications resulting from surface treatment and surface interactions with natural environments under near-ambient conditions. Get a competitive edge in optimizing existing products and developing new ones using the Anton Paar instruments which offer zeta potential measurement for a wide range of applications.
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Production Triangular Voltage Sweep (TVS) Option -
Materials Development Corporation
In traditional TVS measurements, the operator must select the end points of the mobile ion peak todetermine the area to analyze. Though the selection of these points is a simple matter for the operator, the required input precludes using this technique in asemi-autonomous production environment. The goal of TVS Production testing is the rapid determination of mobile charge concentration with little or no operator input. The test methodology must be compatible with production environments where accuracy, easeof use, and minimum operator involvement are of paramount concern. Also, the possibility of automated wafer handling must be considered.
