Showing results: 1 - 12 of 12 items found.
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NI
Wafer-level reliability engineers need to reduce test time without sacrificing measurement quality and accuracy.
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Keysight Technologies
WaferPro Express software performs automated wafer-level measurements of semiconductor devices such as transistors and circuit components. It provides turnkey drivers and test routines for a variety of instruments and wafer probers. Its new user interface makes it easy to setup and run complex wafer-level test plans, while powerful customization capabilities are enabled by the new Python programming environment.
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STAr Technologies, Inc.
STAr provides complete and advanced semiconductor reliability test systems to industry customers, comprising of design for package-level and wafer-level reliability characterization qualification to meet defacto standards.
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MPS-C-300 and MPS-C-350 -
MicroXact, Inc.
MicroXact’s truly unique patent-pending design enables wafer-level testing of spintronic devices, nanoscale electronics and many other materials and devices where magnetic fields are required for accurate test and measurement.
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NSX -
Onto Innovation
With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
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STI3000 -
Solidus Technologies, Inc.
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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NorCom 2020-WL -
NorCom Systems Inc.
The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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T5822 -
Advantest Corp.
Wafer-level testing of DRAMs, NAND devices and other non-volatile memories used throughout portable electronic devices. The T5822 is designed to provide manufacturers of multiple memory devices with cost efficiency and optimal functionality, including full test coverage of as many as 1,536 devices in parallel with data transfer rates up to 1.2 gigabits per second (Gbps).
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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PHD-HMM-48-1 -
High Power Pulse Instruments GmbH
*High current wafer-level and package-level 98 Ω HMM probing with grounded DUT*Built-in high surge 48 Ω pulse reflection suppression resistor up to 80 A peak*Fast rise time < 0.5 ns due to low inductance GND loop*Variable pitch from 50 µm to 5 mm*Tungsten replacement probe tips*SMA pulse force pigtail*Compatible to PHD-3001A interface*High reliability
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Renesas Electronics Corp.
The ISL911xx buck-boost regulator family is capable of working with the ultra-small inductors and capacitors to fit within less than 14mm2 board footprint, making them the ideal 2A switching converter solution for space-constrained mobile devices. The advanced wafer-level CSP package requires only a single inductor and very few external components, which minimizes overall space requirements. The ISL911xx regulators’ 2.5MHz switching frequency further reduces the power supply solution size.
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T5230 -
Advantest Corp.
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.