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Thermal

The radiation of heat.

See Also: Energy, Chemical, Electrical, Nuclear, Electromagnetic, Thermal Shock, Thermal Test, Infrared


Showing results: 1081 - 1095 of 1172 items found.

  • PXI 32 Channel I/O, High Side Driver

    40-413-001 - Pickering Interfaces Ltd.

    A 32 channel Digital I/O module with high output voltage and currentcapability and a dual variable threshold input. The 40-413 range is available in three configurations, a high side only (shown here), alow side only and a combined high and low side each capable of driving 2A loads. Eachoutput is fully protected against over-voltage, over-current and thermal overload,ensuring robust and reliable operation in the toughest test environments. For highside voltage driving the high side voltage source is supplied from an external voltagesource, permitting the module to drive high capacity loads without impacting thePXI chassis power supply.

  • Professional Science Kit

    FLIR A400/A700 - Teledyne FLIR

    FLIR A400 and A700 Science Kits offer researchers and engineers a streamlined solution for accurate temperature measurement. Simplified yet robust connections help you set up and start testing quickly; then easily view, acquire, and analyze data using included FLIR Research Studio software. The Standard kit includes a FLIR A400 or A700 Image Streaming camera, 24° lens with automatic/remote and manual focusing, as well as FLIR Macro Mode. The Professional kit has the added benefits of MSX® image enhancement, radiometric data transmission over Wi-Fi, and a close-up lens for accurate thermal measurements on small components.

  • Caibration Equipment For Lab Use

    Ponovo Power Co., Ltd.

    In the field of high-power semiconductor testing, PONOVO has launched a smart test platform with high-speed high-frequency, high-voltage, high-current power sources, combined with high-speed, high-precision high-voltage, high-current analog acquisition technology and high-speed digital processing control system. The platform can complete the testing of dynamic parameter parameters, static parameters, thermal parameters and mechanical parameters, and power life parameter of various types of high-power semiconductor devices, modules, and chips, which could meet different testing requirements. It is the universal testing platform for automated testing for different application purpose, such as the research and development testing, engineering acceptance test, factory acceptance test, etc.

  • Thermogravimetric Analyzer

    TGA-1000/1500 - Thermtest Instruments

    The Thermogravimetric Analyzer TGA-1000/1500 is a thermal analysis instrument that measures weight changes as a function of temperature or time. The system allows for multiple heating, cooling, and isothermal segments to be linked together to achieve a complex profile. Automatic gas switching is also supported during the temperature program. The vertical hangdown design offers stable and smooth weight readings to be recorded during the experiment. The TGA’s small mass furnace responds quickly to changes in the temperature profile and cools down quickly for fast turn around between experiments. Typical analyses for a TGA-1000/1500 include percent weight loss, onset temperature calculations and residual weight.

  • ATEX-Compliant IR Temperature Sensors

    FLIR A310 ex - Teledyne FLIR

    Explosive atmospheres need to be protected from ignition sources. Selecting equipment and protective systems which meet the requirements of the ATEX Product Regulations or similar regulations is essential. FLIR A310 ex is an ATEX compliant solution, with a thermal imaging camera mounted in an enclosure, making it possible to monitor critical and other valuable assets also in explosive atmospheres. Typical applications for the A310 ex include process monitoring, quality control, and fire detection in explosive locations. Because the FLIR A310 ex is rated IP 67, it can be installed in dusty environments. The Flame-Proof Enclosure "d"prevents any explosion transmission from the inside of the enclosure to the outside.

  • Precision Low Power FGA™ Voltage References

    ISL60002 - Renesas Electronics Corp.

    The ISL60002 FGA™ voltage references are very high precision analog voltage references fabricated on Renesas' proprietary Floating Gate Analog technology and feature low supply voltage operation at ultra-low 350nA operating current. Additionally, the ISL60002 family features guaranteed initial accuracy as low as ±1.0mV and 20ppm/°C temperature coefficient. The initial accuracy and temperature stability performance of the ISL60002 family, plus the low supply voltage and 350nA power consumption, eliminates the need to compromise thermal stability for reduced power consumption making it an ideal companion to high resolution, low power data conversion systems.

  • SparkFun IR Array Breakout

    110 Degree FOV, MLX90640 (Qwiic) - SparkFun Electronics

    It's time to say hip hip array for this IR Breakout! The MLX90640 SparkFun IR Array Breakout is equipped with a 32x24 array of thermopile sensors creating, in essence, a low resolution thermal imaging camera. With this breakout you can detect surface temperatures from many feet away with an accuracy of ±1.5°C (best case). To make it even easier to get your low-resolution infrared image, all communication is enacted exclusively via I2C, utilizing our handy Qwiic system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard.

  • Camera Modules

    CameraModule - OtO Photonics Inc.

    Series is built with the linear back-thinned 2048 x 64 pixels CCD type sensor and high performance 32bits RISC controller in. CM series contains a Thermal Electric Cooler (TEC) along with cooling system design to reduce dark current and maintain a lower stable operating temperature. CM Series has outstanding sensitivity, high SNR ratio, high dynamic range, low electrical-heat noise and fast spectrum responds, suitable for 785 nm laser 2800 cm-1(790~1010nm) or 3500 cm-1(790~1090 nm) Raman application and long wavelength measurement (180~1100 nm).

  • Fanless Embedded System With Intel® Celeron® 2980U/ Core™ I5-4300U/i3-5010U ULT SoC, HDMI/DisplayPort, 2 GbE LANs, 4 USB 3.0, 2 COM And PCIe Mini Card

    eBOX560-880-FL - Axiomtek Co., Ltd.

    The eBOX560-880-FL, a palm-sized, fanless embedded computing system utilizes high performance Intel® Haswell ULT multi-core SoC. The ultra-compact, ultra-lightweight eBOX560-880-FL adopts an IP40-rated rugged aluminum cold-rolled steel enclosure to withstand vibration of up to 3 Grms (with SSD) and has a unique thermal solution to support the temperature range from -20°C to +50°C (-4°F to +122°F). Supporting 4K2K resolution via HDMI interface, the outstanding embedded box computer is ideal for passenger information system, Kiosk, entry-level gaming, video surveillance, and other automation & embedded applications.

  • One Axis Differential Interferometer

    10719A - Keysight Technologies

    The Keysight 10719A One Axis Differential Interferometer makes either a differential linear or angular measurement for use in single and multiple axis applications. The linear measurement gauges the displacement between two objects, such as a stage and an optical column or inspection tool. The 10719A also measures either pitch or roll. An angle is measured when both reference and measurement beams measure to the same mirror. The 10721A provides high immunity to unwanted interferometer displacement, such as thermal expansion. It is a modular, compact design with monolithic optics for maximized mechanical stability. Use of a small 3 mm beam helps decrease Abb offset error.

  • 13-slot ATX-supported PICMG1.3 Bus Passive Backplane

    FAB114 - Axiomtek Co., Ltd.

    The FAB114 has a PICMG 1.3 CPU card slot, one PCI Express x16 slot, three PCI Express x1 slots and a total of eight 32bit/33MHz PCI slots. The onboard 24-pin ATX power connector and 8-pin connector for thermal detected board are featured. Through one PCIe x16 link, this PICMG 1.3 backplane maximize the performance of high-end PCI Express graphics and video cards. Furthermore, the backplane supports two high speed USB 2.0 ports. The FAB114 is perfect fit for AXIOMTEK's SHB100 and SHB110. AXIOMTEK also offers versatile 4U industrial chassis specially design for the FAB114, such as the AX61400, AX6156 series and AX61491.

  • 14-slot PICMG 1.3 Bus Passive Backplane

    FAB101 - Axiomtek Co., Ltd.

    The FAB101 features one CPU card slot and thirteen 32bit/33MHz PCI slots, and built in a 24-pin ATX power connector and 8-pin connector for thermal detected board. Furthermore, the FAB101 delivers outstanding system performance through high-bandwidth interfaces such as Serial ATA and USB 2.0 high speed peripheral (optional function). It is designed for all of PICMG 1.3 single board computers, and is a perfect fit for AXIOMTEK's SHB100 & SHB110, which are built around the PICMG 1.3 form factor. We also have various 4U-high enclosures, AX6156E, AX6156LE, AX6156LLE, AX6156LLES, AX61400, AX61491, and AX6145, to house the FAB101 and any customer's industrial integrations flexibly.

  • Collimators

    Inframet

    Collimators are optical systems used to imitate standard targets placed in "optical infinity" (very long distance). The collimators are used for projection of image of reference targets into direction of tested imagers. According to type of optical elements used in design, collimators are divided into two groups: reflective collimators and refractive collimators. Reflective collimators due to their wide spectral range are almost exclusively used in systems for testing thermal imagers and are also preferable in systems testing TV cameras, SWIR imagers, laser systems or multi-sensor surveillance systems. Refractive collimators are mostly used in systems for testing night vision devices or TV cameras working in visible/near infrared range.

  • COM-HPC Server Type Size E Reference Development Platform based on Ampere® Altra® SoC

    Ampere Altra Developer Platform - ADLINK Technology Inc.

    Backed by a broad Arm® ecosystem with an Ampere® Altra® SoC at its core, using the Arm® Neoverse™ N1 platform, the Ampere Altra Developer Platform provides premium performance from a cloud-to-edge infrastructure, keeps an extremely low thermal envelope, lower TCO, and significantly lower power consumption than x86 designs. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.

  • Analytical Services

    Park Systems Corp.

    Atomic Force Microscopy (AFM) allows for sub nanometer resolution imaging of surface topography and is able to quantify surface roughness at the angstrom scale. Our team can give you highly accurate measurements such as surface topography, dopant distribution, magnetic domain features, and a wide variety of other sample properties to give you the information you need to do great work.Park can provide measurements in the following areas:● Topography (surface roughness, grain size, step height, etc.)● Mechanical Properties (stiffness, etc.)● Electrical properties (capacitance, conductivity, etc.)● Thermal properties ● Magnetic properties These properties can be measured in air or liquid, depending on your needs.

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