Showing results: 226 - 240 of 378 items found.
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PLMT68 -
Pyle Audio Inc.
Light Meter Measures In Lux and Foot Candles (User Selectable)Over-Range IndicatorAuto RangingPeak Hold, Max and Data HoldRelative ModeLong-Life Silicon Photo Diode InsideMeasurement Rate: 1.5 Times per SecondMax Range: 400,000 LuxAccuracy: +/- 5% Under 10000 Lux, +/- 10% Over 10000 LuxMax Resolution: 0.1 Lux/FCAccessories Included: 9V Battery, Carrying Case, Photo DetectorDimensions: 6.50' H x 2.99' W x 1.69' DWeight: 14.22 oz.Sold as : Unit
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ST60 High Temperature -
Dexter Research Center, Inc.
A single-channel silicon-based thermopile that will withstand operating temperatures of 225C, with a small active area of 0.61mm x 0.61mm in a TO-5 package. The reduced height package functions as an internal aperture. Two thermistor options provide ambient package temperature measurement. Currently only available with 8-14um silicon window. Time constant of 18ms with Nitrogen encapsulation gas delivers a very low Temperature Coefficient of Responsivity of -0.4%C. This detector has a very short thermal shock response to ambient temperature change.
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AS7261 -
ams AG
Calibrated XYZ color sensor provides complete, integrated platform for handheld color analyzers, color calibration and mobile analysis devices. Tri-stimulus XYZ realized by silicon interference filters. UART or I²C slave digital Interface. 16-bit ADC with digital access. Programmable LED drivers. 20-pin LGA package 4.5mm x 4.7mm x 2.5mm, with built-in aperture. Compact true-color sensing. Applications; Color/CCT sensing, Fluid or reagent analysis, Color point comparison, Display calibration.
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aTCA-3430 -
ADLINK Technology Inc.
The aTCA-3430 is a high performance 10G Fabric switch blade for AdvancedTCAR platforms. This product is ideal for bandwidth intensive telecom applications such as wireless access controllers, DPI/security network, IPTV, IP multimedia subsystems, RNC/BSC, broadband access/bearer networks, data centers, and LTE/4G network applications. The aTCA-3430 provides 10GbE hub-to-node connectivity and integrated switch silicon that supports load balancing, priority queues, packet classification, and flow control to enable strict bandwidth management for implemented applications.
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NEX QC Series -
Applied Rigaku Technologies, Inc
NEX QC is the lowest cost variant of a line of affordable benchtop EDXRF spectrometers designed for rapid qualitative and quantitative analysis of elements from sodium (Na) to uranium (U) in solids, liquids, alloys, powders, and thin films. For more demanding applications, or for situations where short analysis time is critical, we recommend the NEX QC+ spectrometer. Employing the next generation silicon detector technology, the enhanced NEX QC+ affords significant improvement in elemental peak resolution and counting statistics.
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Bourns
a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100 % Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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CS-153N -
HORIBA, Ltd.
The CS-153N is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use HF/HNO3 solution to etch silicon oxide and remove particles from the wafer surface. The CS-153N continually monitors each component of the HF/HNO3 solution (HF/HNO3/H2O), alerting the user each time the solution is replaced or replenished. This allows you to maintain the concentration of the HF/HNO3 solution within the tolerance range, while eliminating unnecessary solution replacement.
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CS-137 -
HORIBA, Ltd.
The CS-137 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use BHF solution to etch silicon oxide and remove particles from the wafer surface. The CS-137 continually monitors each component of the BHF solution (NH4F/HF/H2O), alerting the user each time the solution is replaced or replenished. This allows you to maintain the concentration of the BHF solution within the required component ranges, while eliminating unnecessary solution replacement.
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NaPiCa -
Panasonic Industrial Devices Sales Company of America
Visible light sensor (Silicon Photo IC) that detects light and converts into electrical current. Consists of a photodiode and built-in amplifier. Optical filter provides spectral response similar to human eye sensitivity. Applications include: LCD Backlight Control, Commercial and Residential Lighting Brightness Control, Security Lighting.
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STAr Technologies, Inc.
The silicon photonics and optronics market is growing fast in data centers, and more applications are looming on the horizon. STAr has over 20 years of integration test system experience and is able to design and manufacture test solutions to meet customer requirements for R&D, engineering, high-volume production, and reliability qualification.
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Active Silicon
Active Silicon computer vision products are supported by a variety of software tools. We provide powerful user software and SDKs for CoaXPress and Camera Link frame grabbers with support across several operating systems. Additionally, a wide range of drivers for third-party machine vision and scientific imaging packages is available.
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FS4500 -
FuturePlus Systems
The FuturePlus FS4500 DisplayPort Analysis Probe provides a mechanical, electrical and software interface to the DisplayPort bus, a digital display interface standard supported by the Video Electronics Standards Association (VESA). The FS4500 is used to design and debug computer motherboards, monitors, home theater systems, and silicon chips incorporating DisplayPort technology.
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Chroma ATE Inc.
Adjustable criteria for different process application or modelFlexible algorithms programming editor for mono-crystalline and multi-crystalline silicon solar cellsMultiple interface to communicate with manufacturing equipment or information systemVarious defects inspection capability from multilayer LED lighting designFlexible design that can be easily integrated to your in-line printing system and sorting system
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AML -
OAI
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Zero Defects International LLC
ZDI utilizes a Seica flying probe tester in order to provide test program development and testing services to customers in Silicon Valley and throughout North America. This is a very cost-effective solution for printed circuit assembly manufacturers who do not have in-house equipment of their own but have customers who require test services.
