Showing results: 4861 - 4875 of 8242 items found.
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ESP -
ARC Technology Solutions
ESP, or Engineering Support Platform, is a low cost, powerful and versatile platform for the development, deployment and support of FPGA Applications. ESP is powered by DSX core, ARC’s core element for the development and deployment of digital and mixed signal systems. The standard system contains 2 custom FPGA system, often configured in combination where one acts as the application firmware, and the other is used for test. But the system is expandable and configurable in any combination to solve any problem in a digital, analog or mixed signal system. The FPGAs can be configured to generate, analyze, process and/or output complex signals at a wide range of voltages, frequencies and serial protocols. It has been used to develop solutions for Radar systems, testers, Pattern Generation, digital signal processing and generating, Video processing, and many more. ESP comes as a desktop or rack mounted solution, and no special interfaces are needed.
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QT55 -
Qmax Test Technologies Pvt. Ltd.
Signature Method of Testing is also known as VI Trace Characteristics, is a proven fault diagnostics technique in Power-Off state while testing a board. By applying known wave from signal with desired Voltage, Source impedance and Frequency of the stimulus signals, depending upon the test node and its characteristics, a Voltage (V) vs Current (I) graph is plotted and studied.
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EMC Instruments Corporation
Anechoic chamber, radio isolation room construction, removal, maintenance and repair. System Integration of complete Test System. Development team has the expertise and technical experience and provide a customized service demand, the project includes a full range of EMI / EMS / RF test equipment with neighboring sell and repair reference signal source Noise Generators Signal Generators
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782356-01 -
NI
40 GHz, 50 Ω, Dual 6x1 (SP6T) PXI RF Multiplexer Switch Module—The PXI‑2796 offers a high-density, unterminated multiplexer with dual 6x1 multiplexer banks in the same module. It is ideal for passing high-order harmonics from PXI RF Signal Upconverter modules or routing multiple sources to PXI RF Signal Downconverter modules.
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Teledyne LeCroy
Teledyne Test Tools generate fixed or arbitrarily defined waveforms and signals for use in the development, testing and repair of electronic systems.
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Teledyne LeCroy
Teledyne Test Tools generate fixed or arbitrarily defined waveforms and signals for use in the development, testing and repair of electronic systems.
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ERAVANT
A measurement device that is inserted into the transmission line between an RF source—such as a signal generator, vector network analyzer, or transmitter—and a load.
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MODEL DPM-3 -
Transducer Techniques, Inc
The DPM-3 is a smart Plug & Play TEDS IEEE 1451.4 compliant Digital Panel Mount Load Cell meter. Just plug in a TEDS compatible Load Cell or Torque Sensor and the DPM-3 will automatically self-calibrate. When used with a non-TEDS Load Cell or Torque Sensor, the DPM-3 can be set up by simple front panel push buttons. The DPM-3 can be scaled to a full 5 digit display from 0 to 99,999 counts to read directly in engineering units such as grams, ounces, pounds, etc. The DPM-3 samples 60 readings per second (50 for 50Hz operation) for fast control response and true peak/valley reading capability. The meter has an adaptive digital filter that can automatically select the best time constant for minimum noise, yet respond rapidly to an actual change in signal level. The peak and valley values can be displayed by a push of a button on the front panel. Auto-tare allows the meter to be set to zero for any input signal level. Available options include dual relays, analog output, serial communications, and low voltage power supply.
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ICS Electronics
ICS's Ethernet Parallel Digital Interface boards provide the user with a wide range of IO signals that can be user configured to match virtually any application. These Ethernet boards are available with high power relay driver boards and with optional firmware designed to simplify switching applications. The 80x3 boards have high-power TTL signals that can sink 48 mA and source 24 mA. Pullup resistors make it easy to interface with CMOS logic and to sense contact closures. User configures data byte direction and polarity. The 80x3 boards are VXI-11 compliant for operation with NI or Agilent VISA, LabVIEW and VEE and support raw socket connections. The new 8113 board is a CMOS close of the 8013 board with user set 3.3 or 5 V logic levels. Pinouts and command set is the same as the 8013 board. The 8113 communicates with TCP/IP(Raw Socket) protocoland and also has a RS-232 Serrial Port. All boards are designed for mounting against the rear panel or inside a chassis and use our Ethernet Wiring Kit for easy connection to a Ethernet Connector on the rear panel.
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SEN-30103-J0 -
Playing With Fusion Inc
Analog thermocouple amplifier board based on the AD849x from Analog Devices (successor of the AD597). This quad-channel thermocouple board converts the very low voltage signal from a thermocouple to a highly-linear, 0.005V/C output with either 0V or 1.245V offset (both configurations stocked) while removing unwanted noise from the signal. Many supply and output configurations are available with this board, though the PCB was designed with Arduino in mind. Specifically, the output header will plug directly into a standard Arduino Uno or Mega, with a pin-for-pin match for power supply, ground and analog outputs. With a 5V Arduino, temperatures from 0C to 1,000C are possible with the 0V offset board and -249C to 750C with the 1.245V offset board. If using a 3.3V microcontroller (Due, etc), the board must be supplied with no more than 3.3V to avoid damaging the microcontroller. Temperature measurement range is dependent on the supply voltage. It is possible to supply the board with higher voltages to allow temperature measurement over the entire operating range of the K-Type and J-Type thermocouples, allowing use with more capable data acquisition equipment.
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SEN-30103-J1 -
Playing With Fusion Inc
Analog thermocouple amplifier board based on the AD849x from Analog Devices (successor of the AD597). This quad-channel thermocouple board converts the very low voltage signal from a thermocouple to a highly-linear, 0.005V/C output with either 0V or 1.245V offset (both configurations stocked) while removing unwanted noise from the signal. Many supply and output configurations are available with this board, though the PCB was designed with Arduino in mind. Specifically, the output header will plug directly into a standard Arduino Uno or Mega, with a pin-for-pin match for power supply, ground and analog outputs. With a 5V Arduino, temperatures from 0C to 1,000C are possible with the 0V offset board and -249C to 750C with the 1.245V offset board. If using a 3.3V microcontroller (Due, etc), the board must be supplied with no more than 3.3V to avoid damaging the microcontroller. Temperature measurement range is dependent on the supply voltage. It is possible to supply the board with higher voltages to allow temperature measurement over the entire operating range of the K-Type and J-Type thermocouples, allowing use with more capable data acquisition equipment.
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SEN-30103-K0 -
Playing With Fusion Inc
Analog thermocouple amplifier board based on the AD849x from Analog Devices (successor of the AD597). This quad-channel thermocouple board converts the very low voltage signal from a thermocouple to a highly-linear, 0.005V/C output with either 0V or 1.245V offset (both configurations stocked) while removing unwanted noise from the signal. Many supply and output configurations are available with this board, though the PCB was designed with Arduino in mind. Specifically, the output header will plug directly into a standard Arduino Uno or Mega, with a pin-for-pin match for power supply, ground and analog outputs. With a 5V Arduino, temperatures from 0C to 1,000C are possible with the 0V offset board and -249C to 750C with the 1.245V offset board. If using a 3.3V microcontroller (Due, etc), the board must be supplied with no more than 3.3V to avoid damaging the microcontroller. Temperature measurement range is dependent on the supply voltage. It is possible to supply the board with higher voltages to allow temperature measurement over the entire operating range of the K-Type and J-Type thermocouples, allowing use with more capable data acquisition equipment.
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SEN-30103-K1 -
Playing With Fusion Inc
Analog thermocouple amplifier board based on the AD849x from Analog Devices (successor of the AD597). This quad-channel thermocouple board converts the very low voltage signal from a thermocouple to a highly-linear, 0.005V/C output with either 0V or 1.245V offset (both configurations stocked) while removing unwanted noise from the signal. Many supply and output configurations are available with this board, though the PCB was designed with Arduino in mind. Specifically, the output header will plug directly into a standard Arduino Uno or Mega, with a pin-for-pin match for power supply, ground and analog outputs. With a 5V Arduino, temperatures from 0C to 1,000C are possible with the 0V offset board and -249C to 750C with the 1.245V offset board. If using a 3.3V microcontroller (Due, etc), the board must be supplied with no more than 3.3V to avoid damaging the microcontroller. Temperature measurement range is dependent on the supply voltage. It is possible to supply the board with higher voltages to allow temperature measurement over the entire operating range of the K-Type and J-Type thermocouples, allowing use with more capable data acquisition equipment.
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Ironwood Electronics
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Meter MEGA-CHECK -Basic -
List Magnetik GmbH
The new generation of MEGA-CHECK devices first used probes in which an own microcontroller, the analog sensor signals are digitized to the device outputs. This new technique is extremely trouble-free and even allows accurate and repeatable readings. The probe cable is both sides (control unit and probe) and therefore particularly service-friendly, as if a cable breaks, the device must not be returned, but only the cable is replaced. The units are equipped with a large, clear and illuminated graphic display. A variety of Fe, ferrous and dual