Showing results: 136 - 150 of 155 items found.
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Pasternack Enterprises, Inc.
a High Reliability Low Noise Voltage Controlled Oscillator (VCO) which covers a 10 MHz to 20 MHzfrequency band with a voltage tuning range from 0V to 20V. This design features exceptional phase noise performance of -120dBc/Hz @ 10 kHz offset. Supply Voltage is +15V with a generated output power level of +10 dBm and 2nd harmonic output of-11 dBc typical. The assembly is RoHs compliant and available in a compact 0.5 inch SMT package with an industry standardmounting footprint. The bottom surface is copper clad with 2-5 micro inches of immersion Gold over 150 - 250 micro inchesof Electro less Nickel which makes it resistant to oxidation for ease of soldering. The VCO operates over a temperature rangeof -40°C to +85°C and is designed to meet a variety of MIL-STD-202 test conditions including Humidity, Shock, and Vibration.
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Spinnaker Contract Manufacturing, Inc.
As standard practice, all of our SMT assemblies are washed and tested through our Automated Optical Inspection and pass through our stringent internal QA/QC policies. In Cables and Wire Harnesses, pretests, such as pull tests and crimp type tests, are performed on all builds before being tested for continuity, hi-pot, shorts and mis-wires, to name a few. Our electromechanical assemblies are capable of receiving full functional testing through custom test fixtures and RF test. Some RF tests include Gain/Loss, Frequency Response, VSWR (Voltage Standing Wave Ratio), Inter-Modulation Distortion and Output Power.
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AATA Japan Co., LTD.
Our ARFC type Film Flat Chip Resistor & ARFCN type Thin Film Chip Resistor Network are high precision Metal Film resistors produced with high purity. Alumina Substrate and Ni-Cr-Si Resistor Film based on high precision Etching Technology. The electrode Terminals are made with Spattering Film and Nickel-Solder Plating, and solderability is very good in all Flow, Reflow and Dipping type soldering for Hybrid IC, SMT, PCB etc. Our ARFC Metal Film Resistor & ARFCN type Thin Film Chip Resistor are being produced under the thorough quality control, and are being used widely in high precision and high reliability electronics circuit such as Measuring Instrument, Medical Instruments, Communication and other Industrial Instruments.
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Teledyne Defense Electronics
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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HA/HP Series -
Semiconductor Circuits, Inc.
The HA/HP series features the latest in MOSFET design, state of the art surface mount technology, and offers a 4:1 ultra-wide input range, and efficiencies greater than 75% (typ). Features include Pi input filter to reduce input reflected ripple, continuous short circuit protection, and excellent line and load regulation of ±0.25% for line and ±1.0% load. Additional standard features include, 500 Vdc I/O isolation, and an operating temperature range of -25°C to +71°C with no derating. All models are packaged in a six-sided shielded miniature case measuring only 2.0” x 2.0” x 0.375” high.
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QQA Series -
Semiconductor Circuits, Inc.
The QQA series features the latest in MOSFET design, state of the art surface mount technology, and offers a 4:1 ultra-wide input range, and efficiencies greater than 80% (typ). Features include continuous short circuit protection, 500 Vdc I/O isolation, and an operating temperature range of -25°C to +71°C with no derating. All models are packaged in a six-sided shielded miniature case measuring only 1.0” x 2.0” x 0.4” high.
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CAES
CAES provides high performance, compact, rugged, DREX modules utilizing surface mount and hybrid chip and wire technology as required by the end application. End applications span radar, electronic warfare, missile, and space applications.
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WSD-2A -
Langeo Co., Ltd.
WSD-3 system is developed on the basis of years’ research and integrated with the latest technologies, such as 14bit A/D, surface mount technology and multi-layer PCB, etc.
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Amitron Corp.
Double Sided PCBs (also known as Double-Sided Plated Thru or DSPT) circuits were the gateway to higher technology applications. The advent of the plated thru hole was quickly adapted and allowed electronic designs to expand in capability and shrink in physical size. Today the double sided printed circuit board technology remains the workhorse of the assembly industry. There are near limitless applications for old and new designs. Fine line surface mount, ultra high copper build, high and low temperature, Solder coated, Silver, and Gold finishes are just a few examples of DSPT applications.
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AP430 -
Manncorp
With the features, performance, and build-quality of systems twice its price, Manncorp's AP430 Fully-Automatic Inline Stencil Printer brings affordability to leading-edge, solder paste printing technology. Capability for 01005 chips, µBGAs, and 12-mil ultra-fine-pitch components is now at a price point that will fit even the most modest budgets of surface mount manufacturers who require full automation and high throughput.
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VIP2 -
MISCO Refractometer
The MISCO VIP2 (“Very Important Process”) inline process refractometer showcases the latest advancements in smart-sensor technology. Housing the intelligence for processing and communication in the sensor itself, the VIP2 refractometer eliminates the need for an external control box. The stainless steel sensor head and sapphire measuring surface are designed to survive the toughest environments. The sensor mounts to your processes using an industry standard 2” Tri-Clamp fitting.
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Series CD -
Teledyne Defense Electronics Relays & Coax Switch
The CD series Solid-state Relay utilizes the latest technology to provide a low ON resistance. The control circuit is buffered to enable the relay to be driven directly from standard CMOS or open collector TTL logic circuits. Available options include short circuit protection and current overload protection or a status output line.MSL 1CD relays are controlled by 3.8-6VdcC = Through-hole mount SC = Surface mountAvailable options include:CD00CF 2A, 60Vdc LoadSCD00CF 2A, 60Vdc LoadCD01CF 2A, 60Vdc Load; control statusSCD01CF 2A, 60Vdc Load; control statusCD20CD 1A, 60Vdc Load; short-circuit protectionSCD20CD 1A, 60Vdc Load; short circuit protectionCD21CD 1A, 60Vdc Load; short-circuit protection & control statusSCD21CD 1A, 60Vdc Load; short circuit protection & control status
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Series HSF -
Kepco, Inc.
- Hot-swappable plug-in power supplies.- Designed to be combined in an N+1 fault-tolerant power system.- Front panel voltage adjustment trimmer for adjustment of output voltage.- Built-in forced current sharing and or-ing diodes.- May also be used independently as a multi-output power supply.- Designed to be sustainable - new models are backward compatible with existing racks.- Available in 1U and 3U sizes. Mounts in 19-, 23-, and 24-inch equipment racks.- All models include power factor correction (PFC).- Full service customized DC power distribution systems can match power supply output(s) with your load(s).- I/O connections via 24 pin connector that plugs into rack adapter. External connections are made via rack adapter.- Surface mount technology permits minimum mounting space.- Entire RA 19 racks populated with HSF power supplies can be connected in parallel, parallel-redundant or series.- HSF are CE Marked per per the LVD, EMC and RoHS 2 Directives. See applicable Declaration of Conformity.- Compliant with UL 8750, Standard for LED Equipment,- Watch video of NEBS GR-63-CORE earthquake and office vibration testing.
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Teledyne RF & Microwave
Teledyne’s Bulk Acoustic Wave (BAW) Product Line has been producing BAW delay devices since the early 1960’s. Over the years, Teledyne Microwave Solutions (TMS) has constantly improved BAW technology and is currently the world’s only supplier of microwave bulk acoustic wave delay devices. Markets for BAW devices include instrumentation and radar altimeters and are available in connectorized, pin and surface mount configurations.
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AWMF-0129 -
Anokiwave Inc.
The AWMF-0129 is an active array for 5G wireless applications developed using planar antenna technology resulting in a very low profile, lightweight unit. The surface mount assembled antenna board is based on Anokiwave’s AWMF-0108 Silicon Quad Core IC and demonstrates the performance achievable using low power silicon integration and efficient antenna layout and design. Using the AWMF-0108, the antenna provides +50dBmi output power while consuming just 12W DC power in the RF circuits and has achieved Gb/s data rates in OTA trials. The electronic 2D beam steering is achieved using analog RF beam forming, with independent phase and gain control in both Tx and Rx operating modes. The AWMF-0129 antenna leads the way in showing how 5G coverage can be rolled out by network operators using the mmW bands, with low power footprint and high energy efficiency, while meeting key operating specifications for data rate, latency, coverage, and reliability.
