Showing results: 1 - 9 of 9 items found.
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Test Tooling Solutions Group
Probe pin is also known as pogo pin or spring probe. It is designed to test the connection between two circuit boards and devices or equipment under test.
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Robson Technologies, Inc.
Reduce your cost-of-test with our pogo pin blocks and interfaces that transform complex DUT boards or breakout boards into universal motherboard-style interfaces. Eliminate the need to purchase or build a new board for every unique device, unit, or package.
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PACC-ZD009 -
Teledyne LeCroy
Micro pogo pin tips for ZD differential probeQty 6
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Meltak Technology
Design ATE socket according to customer's requirementsUse on auto-test eqiupments and handler.Pitch range from 0.30 to 1.0mm.Pin amount: 2 and above.Key material: Peek,Torlon.etcContact with top pogo pin
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Meltak Technology
Design according to customer's requirementsUse on auto or semi-auto test eqiupments and handler.Pitch range from 0.30mm and above.Pin amount: 2 and above.Key material: Peek,Torlon,PPS,PEI.etcContact with top pogo pin
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Meltak Technology
Design for phone device test and system verify.Phone device: CPU,flash,baseband,LPDDR,power IC.etcPitch range from 0.30 to 1.27mmKey material: PEI,Peek,Torlon,PPS.etcContact with top pogo pin
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Test Electronics
Spring Loaded Test Probes for Circuit Board Testing, "Pogo Pins" Test Electronics sources and stockes a large variety of Test Probes and Spring Loaded Test Pins. Let our applications engineers help you find the correct pin for your test fixture application.
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Dynamic Test Solutions
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.