Showing results: 3586 - 3600 of 9890 items found.
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780588-01 -
NI
Non-Enclosed, 300 Vrms, 50 kS/s/ch, 24-Bit, Simultaneous Input, 3-Channel C Series Voltage Input Module - The sbRIO‑9225 performs differential analog input. The wide measurement range is well suited for high-voltage measurement applications such as power metering, power quality monitoring, motor test, battery stack testing, and fuel cell tests. You can perform transient and harmonic analysis with high-speed simultaneous sampling. In addition, you can prevent ground loops and add safety to a system with 600 Vrms channel‑to‑channel isolation between the three sbRIO‑9225 channels. Non-enclosed modules are designed for OEM applications.
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781490-01 -
NI
204.8 kS/s, 113 dB, 2 Gains, 0.5 Hz AC/DC-Coupled, 8-Input PXI Sound and Vibration Module - The PXIe‑4492 is designed for sound and vibration applications. With 24-bit analog inputs and IEPE constant current signal conditioning, the module is ideal for making precision measurements with microphones, accelerometers, and other transducers that have very large dynamic ranges. The PXIe‑4492 delivers simultaneous sample on all channels. In addition, it includes built-in antialiasing filters that automatically adjust to your sample rate, software-selectable input gains, and TEDS smart sensor support for error-free setup. Common applications include noise, vibration, and harshness (NVH) analysis; large microphone arrays; and dynamic structural test.
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783000-01 -
NI
The sbRIO‑9482 directly connects to a wide array of industrial devices such as motors, actuators, and DC devices. Each channel provides access to an electromechanical relay for switching signals up to 60 VDC (1 A) or 250 Vrms (1.5 A), features channel‑to‑channel isolation, and has a LED that indicates the status. Non-enclosed modules are designed for OEM applications.
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CEM313 -
Axiomtek Co., Ltd.
The CEM313, a COM Express® Type 6 compact module, is built with the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the COM Express® type 6 module prevails in its excellent graphics performance while supporting DX12.0, OCL 2.0, OGL 4.3 with resolution up to 4K (3840 x 2160 @ 30 Hz). Furthermore, two 204-pin SO-DIMM DDR3L-1600 have been deployed in the CEM313 up to a maximum of 8 GB Overall. With the innovative design of low power consumption, wide temperature range, and seismic resistance, the CEM313 can be served as an excellent solution for graphics-intensive applications over the IIoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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778771-01 -
NI
8 AI (14-Bit, 2.5 MS/s/ch), Buffer Size 16MS, 8 DIO, PXI Multifunction I/O Module—The PXI‑6133 is a simultaneous-sampling, multifunction data acquisition device. It offers analog input, digital I/O, two 24-bit counters, and digital triggering. The PXI‑6133 is ideal for a variety of applications, such as IF digitization; transient recording; ISDN, ADSL, and POTS manufacturing test in the telecom industry; ultrasound and sonar testing; and high-energy physics.
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779129-01 -
NI
8 AI (14-Bit, 2.5 MS/s/ch), Buffer Size 32MS, 8 DIO, PXI Multifunction I/O Module—The PXI‑6133 is a simultaneous-sampling, multifunction data acquisition device. It offers analog input, digital I/O, two 24-bit counters, and digital triggering. The PXI‑6133 is ideal for a variety of applications, such as IF digitization; transient recording; ISDN, ADSL, and POTS manufacturing test in the telecom industry; ultrasound and sonar testing; and high-energy physics.
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cExpress-AR -
ADLINK Technology Inc.
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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COM-HPC-sIDH -
ADLINK Technology Inc.
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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CEM311 -
Axiomtek Co., Ltd.
The CEM311 is designed to support the Intel® Pentium® N4200 quad-core and Celeron® N3350 dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the CEM311 with the support of DX12.0, OCL 2.0, OGL 4.3 delivers outstanding graphics computing, 4K resolutions and media performance. The rugged system on module supports a wide operating temperature range from -20°C to +70°C to ensure stable operation in harsh environments. The embedded platform offers onboard 4GB or 8GB of DDR3L memory and an optional eMMC flash up to 64GB. Overall, the CEM311 can be served as an excellent solution for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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SKU-086-32 -
Amfeltec Corp.
PCI Express Carrier board was designed to expand modern motherboards that have PCI Express interface. It allows connection of up to 2 M.2 PCI Express SSD modules.PCI Express Carrier board is one-slot-wide, half-height and it compliant with PCI Express Specification 3.0 and M.2 Specification 1.1.
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AMSTX-CF Series -
ADLINK Technology Inc.
Embedded graphics enables system developers to boost the performance of a wide range of workloads, including medical imaging, image analysis, compute acceleration, and artificial intelligence (AI). Leveraging graphics processing units (GPUs), embedded graphics can be used to increase application speed and accuracy, as well as decrease latency. Many embedded system developers are using embedded graphics solutions in real-world applications, such as medical, manufacturing, and traffic management, along with other embedded segments.
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DLAP-3000-CF Series -
ADLINK Technology Inc.
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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SKU-086-01 -
Amfeltec Corp.
The Squid PCI Express Carrier board for M.2 SSD modules is the second product in the Squid PCI Express Carrier Board™ family. PCI Express Carrier board was designed to expand modern motherboards that have PCI Express interface. It allows connection of up to 4 M.2 PCI Express SSD modules. This product is recommended for use in Mac Pro Desktop computers.
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510143003 -
Virginia Panel Corporation
Signal, Module Insert, Receiver, i2 MX, 84 Position, QuadraPaddle, Fully Loaded w/ Twin Female Contacts (p/n 610138200)
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AMCX1553-xT -
AIM GmbH
MIL-STD-1553 Test and Simulation modules for PMC with 1 or 2 Dual Redundant streams plus 8 Discrete I/O’s (on Rear-I/O).