Showing results: 901 - 915 of 1323 items found.
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BE70A -
Samtec Inc.
The BE70A Series uses a single block design for ganged cabling and compression mount to the PCB, making it easier to install and eliminates soldering. The block consists of two rows, with up to 16 contacts, and is available for both microstrip and stripline transmission types. This proprietary cable design offers superior grounding (360-degree grounding with stripline) around a spring-loaded signal contact and provides a 1.85 mm connectors for RF device interfacing.
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Kontron AG
COM Express defines standardized footprints and pin-outs for Computer-on-Modules. With the Revision 2.0, PICMG added the compact footprint (95x95mm) to the basic footprint (125x95mm) and extended the pin-outs being future-proof. New Digital Display Interfaces (DDI) and super-fast USB 3.0 are available. The new Pin-out Type 10 in COM Express Revision 2.0 supports perfectly modules in the COM Express mini footprint (84x55 mm).
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Educated Design & Development, Inc.
1250 g body includes release mechanism and striking element guide.250 g striking element comes with cocking knob and hammer head, polyamide face, is hemispherical with a radius of 10 mm, has a hardness of HR85-100.60 g release cone with a 10N release force.Single Impact Force models range from a 0.2 J Hammer to a 2.0 J Hammer.Custom padded carrying case included.
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Bio-Logic Science Instruments
Scan range : X&Y = 200 μm; Z = 100 μm• Practical minimum step size : 50 nm with <10 nm resolution• Max scan speed : 200 μm/s• Max discrete data acquisition for line or area scan : 20 points/s• Micrometer macro positioning : 13 mm range – the smallest graduation is 10 μm• Max area scan point density : >4,000,000
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Teledyne Labtech
Teledyne Labtech is at the forefront of complex metal-cored PCB design and manufacture. The PCB use a thin metal core <2 mm, which acts as isolation between the RF/Microwave circuit and the Analogue/Digital circuitry and creates an excellent thermal path.The major advantages are reduced size and no need for complex microwave feed-thru's. The ability to laser cut pockets allows the designer engineer to mount the high power MMIC directly on to the metal core.
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ESDdoctor -
Sofics
ESDdoctor consulting service can identify, diagnose, and solve any ESD/EOS problem quickly and definitively, at a surprisingly low entry cost. You can choose testing and diagnosis only, or add ESD design services to the consulting package. ESD, Latch-up testing: HBM (ANSI/ESDA and JEDEC) on packaged dies. MM (ANSI/ESDA and JEDEC) on packaged dies. Latch-up JEDEC on packaged dies TLP on packaged and bare dies.VF-TLP on bare dies.
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CX-104 -
Shenzhen Chuangxin Instruments Co., Ltd.
IEC60335-2-9 clause 3 figure 104 Vessel for testing induction hotplates Parameter : Pot and lid material is mainly Q235, carbon mass fraction <0.08%; 2. The thickness of the wall material is 2 mm;3. The bottom of the pot body can not be outward convex, can not exceed 0.05mm; 4. Pot body and lid surface to be clean 5, size: 110, 145, 180, 220, 300mm each one
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ZET 7052-N -
ZETLAB Company
Digital accelerometer ZET 7052-N is equipped with a compact sensing element and is designed for linear acceleration and vibration acceleration variable constituent measurement via three mutually perpendicular planes. Small weight of sensing element (1,5 g) considerably reduces self-mass load and compact dimensions (8,5×8,5×8,5 mm) enable use of the digital accelerometer ZET 7052-N for vibration measurements in systems with small active area.
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CSI 280-F3 Series -
Absopulse Electronics Ltd.
ABSOPULSE Electronics has released the CSI 280-F3 Series of ultra-compact, high-performance dc/ac sine wave inverters. The units introduce new semiconductor technology and a unique design topology that simplifies the circuitry and enables significantly more compact construction, lower weight and cost, and higher MTBF than previous 300VA inverter designs. The total footprint of each unit is 132 x 64 x 300 mm.
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618 -
Electronic Specialties Inc.
*Great for backprobing weather pack style connectors used with numerous automotive sensors *Also very handy for piercing and tapping readings on smaller gauge wires - using the included probe adapters *Works with most Test Lead Kits in the field - with standard 4mm banana plug test lead *Set includes four probes - red, black, green, yellow Test probes 21 mm length
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CAL1 -
Image Engineering GmbH & Co. KG
The one light source solution in the field of camera characterization and calibration. CAL1The CAL1 calibration light source is designed to characterize and calibrate cameras in the lab or on the production line. Its compact design consists of one iQ-LED element in a 0.3 m integrating sphere that illuminates a 70 mm opening. Because of the non-reflective special diffusor filter on the sphere opening, a uniformity of more than 98% could be reached
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cBP-6614A -
ADLINK Technology Inc.
*PICMG:2.0 R3.0, 2.1 R2.0, 2.9 R1.0, 2.11 R1.0, 2.16 R1.0*Dimension:Dimension 420.6 x 262.05 (mm, WxH)*2.16 Node Slot:12*2.16 Fabric Slot:2*cPCI Bus:None
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11PD100-Si -
Standa
Silicon detectors provide a generous aperture for laser beams up to 10 mm in diameter. The threaded aperture allows you to install filters, attenuators, fiber optic adapters or other optics that suit your specific needs.
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TinyUSB -
Coptonix GmbH
*Very small and compact dimensions, only 40 x 30 mm²*High speed, up to 9kHz line rate*Programmable amplifier and offset*Supported operating systems:****Windows**Linux**Linux ARM32 (Raspberry PI)
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M8049A -
Keysight Technologies
The M8049A ISI channel boards can be used to emulate channel loss in receiver test setups. The boards are used to emulate channel loss for data rates of 32 Gb/s and higher. A choice of 21 PC board traces with different lengths can be inserted into the signal path. The trace lengths range from 0.8 inch (20.3 mm) to 22.3 inch (566.4 mm). By cascading the traces within one board or with another board, a wide range of channels can be emulated with very fine resolution of insertion loss steps. With their small size the ISI channel boards can be located closely to the device under test.