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Showing results: 661 - 675 of 1323 items found.

  • Camera Module

    XM Bond HR - Viscom AG

    Viscom AG offers the new XM Bond HR camera module for dependable inspection of wire bonds. Its characteristics include a 21 mm x 21 mm field of view size and exceptionally fine detail resolution. It is ideally suited for the most precise inspection of thin wires in the production line. With the new XM Bond HR camera module, Viscom advances the configuration possibilities in wire bond inspection for higher in-line inspection quality. This module is particularly recommended for safety-relevant electronics, where thin wires with diameters of e.g. only 20 µm are installed. Products of this kind find use, among others, in various types of signal processing in the automotive and aerospace sectors. The high-quality optical components and sensor chips with first-class resolution and sensitivity achieve superb image quality and sharp detail resolution. Together with its 21 mm x 21 mm field of view size, the XM Bond HR offers a resolution of 4.5 µm per pixel. A telecentric lens ensures that regardless of the distance to an object, an inspection window has the same image scale; for example, the end points of an inspected thin wire are always located at the same positions in the inspection window. In addition, the telecentric optics also prevent areas on the electronic assembly next to tall components from being hidden.

  • Constant Pressure Dual Head Pump

    ReaXus CP Class - Teledyne LABS

    The high performance CP Class consists of dual-headed, positive displacement piston pumps with constant pressure control, covering a wide range of flows, with pressures up to 25,000 psi. Standard fluid path material is Stainless Steel. Other available features include Hastelloy fluid path with jacketed pump heads for temperature controlled processes.The CP Class pumps are widely used for Liquid Chromatography Column packing for 4.6 mm columns, as well as many process applications. The constant-pressure feedback loop automatically adjusts solvent flow to maintain constant system pressure and allows the user to select a wide range of process parameters, including desired pressure set point, ramp rate, and upper flow rate limit.The CP Class is available as standalone ​units, and also with the Teledyne SSI Column Packing System (called Pack-in-a-Box). Features include:20 mL packing reservoir assembly4.6 mm pre-column assemblyTwo (2) 4.6 mm x 150 mm columns10 gram bottle of C18 stationary phaseBracket assembly to mount packing reservoir to pumpQuick-set disk to allow full control of the packing process through a computerTubing, cables and other necessary fittings for connectionsWith 5 mL/min, 24 mL/min, and 100 mL/min​ versions, the CP Class will meet most Liquid Chromatography Column packing and process needs.

  • Full-Size PCI Express Mini Module With SATA

    AX92907 - Axiomtek Co., Ltd.

    *Two independent SATA channels*Fully compatible with SATA revision 2.0 and 3.0 hard drives (HDD) and Solid State Drives (SSD)*Supports RAID 0,1*Two SATA power connectors with +5V*51 x 30 mm

  • ITO (Indium Tin Oxide) Electrode

    ALS Co., Ltd

    This quite unique material transmits only visible light whereas it does not transmit UV radiation. Our ITO electrodes consist of 100 nm thick of ITO layer deposited on quartz or borosilicate glass substrate (0.5 mm thick).

  • Sensors

    3D Fiber Probe - Werth Inc.

    Ultra high precision 3D measurements2D image processing combined with a laser distance sensorSelf illumination modeLowest contact force of 1 µNProbe sphere diameters from 0.040 mm to 0.250 mmControl and evaluation software for fully automatic measurements

  • 32-CH Sourcing Type Digital Ouput EtherCAT Module

    EPS-2032 - ADLINK Technology Inc.

    *32-CH sourcing type digital output*Quick removable European type connector*Slave module healthy monitoring*Wide operation temperature range*: -20°C - 60°CCompact size: 100 (L) x 100 (H) mm

  • Autonomous Data Collector

    DCX-16 (VG, SG) - KELLER AG für Druckmesstechnik

    The DCX-16 is an autonomous, battery-powered data collector in a stainless steel housing with a very small diameter of only 16 mm. In applications where a small probe diameter is an advantage, the logger can record the water level (pressure) and the temperature over long periods.

  • Linear Actuator

    PAX1 - Rotork plc

    The PAX1 is a flexible low voltage DC powered linear actuator featuring a 25 mm maximum thrust rod stroke moving at speeds up to 60 mm/min and a maximum thrust of 2,890 N (650 lbf) all in a flameproof enclosure.

  • 75/85/100 GHz, 1/2/4 Port, Electrical Remote Sampling Head Module

    N1046A - Keysight Technologies

    75 GHz, 85 GHz or > 100 GHz maximum available bandwidth (selectable option, upgradable)1, 2 or 4 channels per module User-selectable bandwidth settings starting at 60 GHz Electrical inputs: 1 mm female

  • 4- or 8-Port Serial Module

    Emerald-MM-8EL - Diamond Systems Corp

    The Emerald-MM-8EL-XT is a family of high performance PCIe/104 "OneBank" serial I/O modules offering 4 or 8 multiprotocol serial ports with software-controlled configuration and optional opto-isolation.

  • Cable Analyzer

    MM-HTDR MediaManifold - Crestron Electronics, Inc.

    The Crestron MM-HTDR MediaManifold Cable Analyzer is a portable handheld device used to determine the length and integrity of RG6 cable runs. Using "time domain reflectometry," the MM-HTDR can measure cable lengths up to 1099 feet.

  • Low-power, High-performance FPGA

    ICE40 LP/HX - Lattice Semiconductor

    *Available in three series with LUTs ranging from 384 to 7680: Low power (LP) and high performance (HX)*Integrated hard I2C and SPI cores that enable flexible device configuration through SPI*Match your preferred display to your application processor with interfaces such as RGB, 7:1 LVDS and MIPI DPI/DBI*Multi-source your image sensors by implementing flexible bridges supporting common interfaces such as HiSPi, subLVDS, LVDS and Parallel LVCMOS*Up to 128 kbits sysMEM™ Embedded Block RAM*Industry’s broadest range of 0.35 mm - 0.40 mm pitch BGAs fit in space-constrained applications

  • IR Sensor

    JonDeTech

    The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.

  • Digital Processor

    DP7000 - Guzik Technical Enterprises

    The DP 7000 Digital Processor with 40/100G Ethernet or 169G Interlaken protocol compatible MPO/MTP® Optics, designed for evolving markets such as Real-Time Stream Processing for High-speed Data-acquisition (DAQ), High Performance Computing (HPC), Machine Learning, Data Center Infrastructure, AI Processing and Network applications. The board is 8U form factor, 322.25 mm x 280 mm x 6 HP (L x W x H), single slot AXIe or AdvancedTCA® blade, ideal for multi-slot 19″ rack mount system integration. In AXIe form factor it provides up-to Gen3 PCIe® backplane connectivity.

  • Probecard testers

    MANAGER - Beijert Engineering BV

    Today more complex probe cards are being used. More pins,higher density and larger array requires a new approach inprobe card analysis. With the soaring cost of new generationprobe cards, repair of defective cards becomes an necessity.BE Precision Technology offers all capabilities with the newMANAGER V. Future proof, up to 450 mm full wafer contactprobe cards can be analyzed with up to 88.000 test channels.High-end materials are used to stand extra tough requirements—such as 500 mm diameter diamante viewing window,ultra stiff carbon flip-table, high power Z–stage to generate 600Kg of contact force

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