The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
The Omron VT-X700 is the perfect solution to manufacturers desiring high-speed, in-line, automated X-Ray inspection on PCBs containing components such as BGAs or CSPs with hidden solder joints. Traditional AOI technology is incapable of inspecting these types of components but the VT-X700 uses revolutionary, high-precision, X-ray, CT imaging to perform precise and reliable analysis of these hidden areas.
Our latest innovation in 3D In-Line Advanced X-ray Inspection System (AXI) is designed to specially cater to different sizes of PCB assembly to be examined at micron level with maximum throughput. This translates to increased production efficiency and cost savings for manufacturers.
Designed for in-line inspection, the VT-RNSII is an ideal solution for smaller manufacturers running low volume to customers with large volumes. The inspection algorithms used in the VT-RNSII are identical to the fully automated in-line machine, the VT-RNSII-PTH benchtop machine.
Nordson YESTECH's advanced 9 megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewingcamera and four side viewing cameras, the FX-940 inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
The next generation fastest in-line Solder paste inspection system in the market. The measuring speed is 100cm2/sec at 13x13um resolution, and 80cm2/sec at 10x10um resolution. It can inspect smaller than 01005 pads and sizes as small as 100um. The HS70 inspection cycle time has been greatly reduced based on PARMI’s development of the RSC-6 sensor. Furthermore, there are two kinds of magnification of Camera Lens for the RSC Sensor delivering – 0.42x to 0.6x magnifications providing more control to the engineer.
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
Quality Inspection Systems for in-line quality and completeness control for assembly are used for fast and reliable inspection of all visible components in complex assembly, packaging, and production lines.
The Saber3D is the latest major advancement from Coherix for semiconductor inspection and metrology. Coherix provides high-speed, in-line inspection products for the electronics and semiconductor industries, eliminating the need for handlers to stop the assembly process for inspection. This solution streamlines the process, increases throughput and enhances accuracy.
Designed for off-line inspection, the VT-RNSII-ptH is an ideal solution for smaller manufacturers running low volume or prototyping assembly lines. The inspection algorithms used in the VT-RNSII-ptH are identical to the fully automated in-line machine, the VT-RNSII.
We are offering inline solutions for the integration into production lines and as well stand-alone systems for the labatory or incoming inspection in the warehouse. Our Solutions can be integrated into sun simulators. In addition we have systems specialized for thin film inspection.