Nordson YESTECH's advanced 5 megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewingcamera and four side viewing cameras, the FX Series inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
Nordson YESTECH's advanced 9 megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewingcamera and four side viewing cameras, the FX-940 inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
With higher measurement resolution than laser triangulation technology, wider measurement range than Moire technology and faster inspection speed by on-the-fly imaging technology, FAHP (Flying Absolute Height Profilometry) technology features outstanding 3D measurement performance beyond state of the art 3D technologies. True volume measurement of solder paste without pad offset effect.
Programming the M1 Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The M1 Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines.
Nordson YESTECH's versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCB's and packaged semiconductors. Ideal for in-line or off-line operation, the X2's proven algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.
Saki boosts up the inspection to another stage by this ultimate inspection system.The high-accuracy 3D image makes the detection of defects much easier.BF-X2 is our proudly offered 3D X-ray inspection system which provides a new standard of inspection system.
Our latest innovation in 3D In-Line Advanced X-ray Inspection System (AXI) is designed to specially cater to different sizes of PCB assembly to be examined at micron level with maximum throughput. This translates to increased production efficiency and cost savings for manufacturers.
Designed for in-line inspection, the VT-RNSII is an ideal solution for smaller manufacturers running low volume to customers with large volumes. The inspection algorithms used in the VT-RNSII are identical to the fully automated in-line machine, the VT-RNSII-PTH benchtop machine.
The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
The Omron VT-X700 is the perfect solution to manufacturers desiring high-speed, in-line, automated X-Ray inspection on PCBs containing components such as BGAs or CSPs with hidden solder joints. Traditional AOI technology is incapable of inspecting these types of components but the VT-X700 uses revolutionary, high-precision, X-ray, CT imaging to perform precise and reliable analysis of these hidden areas.
The next generation fastest in-line Solder paste inspection system in the market. The measuring speed is 100cm2/sec at 13x13um resolution, and 80cm2/sec at 10x10um resolution. It can inspect smaller than 01005 pads and sizes as small as 100um. The HS70 inspection cycle time has been greatly reduced based on PARMI’s development of the RSC-6 sensor. Furthermore, there are two kinds of magnification of Camera Lens for the RSC Sensor delivering – 0.42x to 0.6x magnifications providing more control to the engineer.
ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. Ideal for in-line or off-line operation, the X3's innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.