Showing results: 106 - 120 of 141 items found.
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Renesas Electronics Corp.
Wide band gap semiconductor technologies such as Gallim Nitride Field Effect Transistors (GaN FETs) have been gaining interest for power management and conversion in space applications. These devices feature higher breakdown voltage, lower RDS(ON) and very low gate charge enabling power management systems to operate at higher switching frequencies while still achieving higher efficiency and a smaller solution footprint. There is an additional benefit from GaN devices that make them attractive to the space market. These devices are inherently immune to total ionizing dose radiation.
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Renesas Electronics Corp.
The space market has been driving towards more efficient power management solutions. Part of the drive includes the use of Gallium Nitride Field Effect Transistors (GaN FETs) for power conversion. GaN FETs have higher power conversion efficiency and have more natural immunity to radiation, due to them being wide-bandgap semiconductors. Equally important is the use of the correct driver that will allow reliable operation and maximize the benefits of the GaN FETs. Some of the key driver requirements are: a well-regulated gate drive voltage; high source/sink current capability and a split driver output stage.
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Cadence Design Systems
A major new challenge at 20nm/14nm is the requirement for extra masks (double patterning technology, or DPT) to make existing lithography work at this advanced node. Read 20 questions on 20nm - a Q&A document. Escalating data volume and denser, more complex chips are testing the limits of traditional routing architectures. Even the slightest perturbations in the design flow can cause dramatic swings in design integrity. Engineers face a predictability crisis riddled with silicon failures, performance degradation, and prolonged design schedules. And new process and design innovationshigh-k metal gate, SOI, 3D-IC packagingare intensifying the pressures of adoption and rapid deployment.
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MASER Engineering B.V.
MASER Engineering has automatic test equipment for the most common ESD test pulse models. MIL - JEDEC - ESDA - IEC standards. IC level Human Body Model. IC level Machine Model. IC level Charged Device Model. System level IEC 61000 HBM. AEC-Q100 Field Induced Gate Leakage test. Static Latch-Up test. Dynamic Latch-Up test.
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DT5790 -
CAEN S.p.A.
The DT5790 operates upon the DPP-PSD firmware, specially developed for Charge Integration and Pulse Shape Discrimination. DPP-PSD is based on an advanced on line Digital Dual Gate Charge Integration allowing an effective data analysis even at high count rate. It performs input signal baseline calculation, self-triggering and double-gate charge integration with programmable parameters, double integration of both prompt and total charge for Pulse Shape Discrimination and pedestal subtraction for energy calculation.
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TL2 -
North Atlantic Industries
Function module TL2 provides 24 channels of TTL/CMOS transceiver functionality as either inputs or outputs. The transistor-transistor logic (TTL) employs transmitters with multiple emitters in gates having more than one input. TTL offers high switching speed and relative immunity to noisy systems. CMOS sensors provide image sensing technology by converting light waves into signals that are small bursts of current. These waves can be light or other electromagnetic radiation.
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TL1 -
North Atlantic Industries
Function module TL1 provides 24 channels of TTL/CMOS transceiver functionality as either inputs or outputs. The transistor-transistor logic (TTL) employs transmitters with multiple emitters in gates having more than one input. TTL offers high switching speed and relative immunity to noisy systems. CMOS sensors provide image sensing technology by converting light waves into signals that are small bursts of current. These waves can be light or other electromagnetic radiation.
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SCANIO Family -
Corelis, Inc.
The Corelis family of SCANIO™ modules turn any IEEE standard 1149.1 boundary-scan controller into a powerful digital boundary-scan tester. The SCANIO family of products use boundary-scan gate arrays to add control and visibility to connectors, traces, and logic that can not be tested using traditional boundary-scan techniques.The SCANIO products, when combined with a boundary-scan controller, operate as a traditional “bed-of-nails” tester except access to the stimulus and response I/O’s is achieved via boundary-scan.
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HMC7748 -
Analog Devices Inc.
The HMC7748 is a multistage power amplifier (PA) that provides 25 W of saturated output power across the band of 2 GHz to 6 GHz. It draws 0.7 A from a 12 V supply and up to 4 A from a 28 V supply. Input signals of as much as −8 dBm are acceptable, and the module has small signal gain of 60 dB. The 12 V supply is regulated internally and generates the negative voltage required for the gate bias. Built-in bias sequencing prevents the drain voltages for the amplifier stages from being applied without the negative voltage present, which protects the amplifiers if 28 V is applied without 12 V supply applied.
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ADQ32-PDRX -
Teledyne SP Devices
ADQ32-PDRX acquires the input signal via a single connector and uses an onboard splitter to separate the signal into two paths with different gain settings. The high gain path is used to accurately capture low-amplitude portions of the input signal whereas the low gain path ensures the acquisition of high-amplitude peaks without causing saturation. The two signal paths are then combined in real-time inside the onboard field-programmable gate array (FPGA) to create a digitized output with improved performance.PDRX increases the dynamic range by 3 bits and is fully integrated into the digitizer for fast and easy system-level integration. ADQ32-PDRX is therefore comparable with a 16-bit digitizer in terms of dynamic range, but with the benefit of offering a higher sampling rate.
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FC2000 Series -
ACECO Electronics Corp.
A professional frequency counterFrequency range: 1 Meg ohm and 50 ohm input for full range 10 Hz - 3 GHzWeight: 250 gCase: 100 mm * 68 mm * 31 mm stamped aluminum with black anodized finishBattery: Internal 4 * AA 600 mAH NiCd pack10 digit liquid Crystal DisplayLow power consumption (Average 6 hour battery life)Hold switch to lock displayLow battery indicatorUltra sensitive synchronous detector 16 section bargraph to show RF signal strengthHigh speed 300 MHz direct counter with 0.1 Hz resolution4 selectable gate speedsAutomatic holdMeasure frequency and periodBeeper and LED back light with black anodized finis
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Silicon Labs
Silicon Labs' innovative digital isolation and power product portfolio includes CMOS digital isolators, isolated gate drivers, isolated current sensors, isolated system products and Power over Ethernet (PoE) families. These mixed-signal IC solutions leverage Silicon Labs' superior isolation and high voltage expertise to enhance power system performance, flexibility and reliability while reducing system size and cost. The entire isolation portfolio supports isolation voltages up to 5 kV.
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LA-2000 -
Rotork plc
The LA-2000 Series are self-contained, bi-directional, linear actuators internally geared to produce up to 1,600 lbf. (7,117 N) of thrust. Some models also offer continuous modulating duty up to 2,000 starts per hour. A variety of speeds, thrusts, motors, voltages and control options are available which make the LA-2000 Series ideally suited for reliable positioning of dampers, combustion controls, gates, diverters, hydraulic variable speed drives, or other linear positioning applications.
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SiC/GaN -
Mornsun Guangzhou Science & Technology
MORNSUN offers high quality IGBT driver, LED driver and driver power module for IGBT driver and SiC/GaN gate driver, which feature a compact design, are energy-efficient and robust with high quality at an affordable price. Especially MORNSUN LED driver is a step-down constant current source for driving high-power LED providing high efficiency, wide input voltage range, high temperature working capacity and complete functions. All of these driver power modules are applicable for multiple commercial and industrial applications.
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Testek Solutions
A partnership with Testek Solutions fits into your business because we do business like youdo business. Our partnerships are built on open communication, process transparency, and trust – trust that is built on our proven engineering design process. We assign a dedicated team consisting of a program manager who will be your single-point-of-contact, an experienced project engineer to design and oversee all engineering on the project, and any supporting engineers and manufacturing team members necessary for every project. Each test stand goes through a series of stage gates including an initial review of requirements, preliminary design review, critical design review, final design and manufacturing review, and a quality review regardless of whether you request these reviews.
