Showing results: 271 - 276 of 276 items found.
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Teledyne LeCroy
Fibre Channel continues to evolve as the preferred communications standard for mission critical and time sensitive Storage Area Network (SAN) applications. Fibre Channel supplies over 80% of the datacenter and enterprise interconnections where lossless delivery of data is required and will be used for many years to come. Gen 6 (32GFC) products and solutions are rapidly being deployed ubiquitously across key markets today.The Fibre Channel industry is now focusing efforts on the development of Gen 7 – 64GFC utilizing PAM4 signaling – and will continue to serve those applications needing higher bandwidth and guaranteed delivery of time and content sensitive data.The SierraNet Family of Fibre Channel test platforms provides best in class traffic capture, analysis, and manipulation for testing physical link characteristics and application operations. SierraNet is designed for addressing today’s high-speed storage and communications fabrics problems and compliments other tools offering industry leading visibility and utility.
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AIM GmbH
AIM’s Fibre Channel test, simulation and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive and scalable DDR3 memory and IRIG-B time encoder/decoder functions are standard. The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for Fibre Channel networks. The dual core processor provides onboard processing and data transfer capabilities for the most demanding Fibre Channel applications including upper layer protocol support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized Fibre Channel interfaces enabling the board to analyze incoming and modify outgoing data in real time. Each module provides 2 Fibre Channel compliant full duplex ports, implementing the full link level services. SFP cages make it suitable for different media types as optical or electrical network technologies. Ports operate either in Traffic Simulator or Analyzer/Monitor mode with support for port related Frame Statistics. Sophisticated packet capturing mechanism and monitoring features are complimented with powerful triggering and filtering capabilities.
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Teledyne LeCroy
Ethernet, arguably the most common communication protocol on the planet, continues to spread into new markets and incorporates new protocols; it presents today’s Ethernet engineers with host of new test and validation challenges. Specifically, the increasing adoption of lossless Ethernet standards like FCoE, RoCE, and NVMf and increases in the line-rates of Ethernet from 10GbE and soon to 100Gb/s to name a few.These new physical and logical communications standards have exposed legacy test tools as outdated and incomplete for Ethernet product developers and the ecosystem. Teledyne LeCroy is addressing these needs by leveraging our extensive experience in high-speed serial data analysis tools currently used by many of the same companies developing products for NAS, SAN, LAN, and other high-speed protocol environments.The SierraNet Family of Ethernet test platforms provides best in class traffic capture, analysis, and manipulation for testing physical link characteristics and application operations. SierraNet is designed for addressing today’s high-speed storage and communications network problems and compliments other tools offering industry leading visibility and utility.
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AIM GmbH
> ARINC818 is a specification which has become an Industry standard for the transmission of uncompressed digital video. This commercial standard uses Fibre Channel as a point-to-point communication link for low latency with the ARINC818 defining the packetized protocol for transmission of the digital video information. It is highly flexible and can be used for a variety of onboard display systems in both commercial and military applications. AIM’s ARINC818 cards use our field proven Common Core hardware design giving the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with one dual core RISC processor per port, massive DDR3 memory and IRIG-B time encoder/decoder functions are standard. The ARINC818 modules are available in PCIe formats.The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for ARINC818 interfaces. The dual core processor provides onboard processing and data transfer capabilities for the most demanding applications including ARINC818 support done on board level. Large and high data throughput DDR3 RAM is accessible for the onboard processor as is a high performance FPGA implementing the customized ARINC818 Interfaces enabling the board to analyze incoming data in real time. Each module provides 2 ARINC818 compliant ports. SFP cages make it suitable for different media types as optical or electrical network technologies. Each module is delivered with a Board Support Package (BSP) containing the onboard driver software, a full Application Programming Interface (API) and detailed getting started and programming guides. Powerful PBA.pro databus test and analysis software is optionally available for all our ARINC818 cards.
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Model 71821 -
Pentek, Inc.
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Exceptional dynamic range and analog signal integrity- Xilinx® Kintex® UltraScale" FPGA- Three 200 MHz 16-bit A/Ds- Three multiband DDCs (digital downconverters)- One DUC (digital upconverter)- Two 800 MHz 16-bit D/As- 5 GB of 2400 MHz DDR4 SDRAM- Programmable frequency synthesized sample clock generator- Sample clock synchronization to an external system reference- Powerful DMA controllers for moving data- PCI Express (Gen. 1, 2 & 3) interface up to x8- Multi-channel synchronization with clock/sync bus- Optional clock/sync generator for multi-board systems- Optional LVDS port for custom FPGA I/O- Optional gigabit serial links for custom FPGA I/O- Ruggedized and conduction-cooled versions available- Navigator® BSP for software development- Navigator® FDK for custom IP development- SPARK® fully-integrated development system- Free lifetime applications support- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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MIC-6030 -
Advantech Co. Ltd.
The MIC-6030 is a ruggedized single-slot 3U OpenVPX switch providing high-speed, low-latency interconnects between VPX blades connected to PCI Express and Ethernet backplane fabrics. An ExpressLane™ PEX8733 PCIe Gen3 switch connects to six PCIe Gen3 x4 ports enabling non-transparent and transparent bridging of processor blades for highly flexible multi-host and legacy configurations. A Marvell® Link Street® 88E6390X Ethernet layer 2 switch with VLAN support switches gigabit Ethernet traffic between VPX blades connected to the Ethernet fabric enabling a linerate control plane. When configured with optional Mellanox ConnectX®-4 Multi-Host™ Technology and drivers, the MIC-6030 enables high speed communication of up to 10Gbps bandwidth between up to 4 processor VPX blades VPX by transforming the PCIe bus into a programmable network interface, facilitating the development of data communication between boards and eliminating the need to program a more complex DMA interface. The onboard BMC firmware based on Advantech’s IPMI core technology brings an advanced set of system management features and can be customized when unique features are required. Lightweight switch management is available via the BMC, supporting tagged and untagged VLANs, port-based VLAN, and port status reporting. Advantech offers standard designs with either convection or conduction-cooling. A conduction-cooled heatsink ensures operation in harsher environments, providing a reliable solution for operation in extended temperatures, and where extreme shock and vibration requirements must be met. The MIC-6030 is compact, light and robust, meeting stringent size, weight, and power (SWAP) demands.
