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Automated Optical Inspection

See Also: Automated Optical Inspection, PCB Inspection


Showing results: 76 - 78 of 78 items found.

  • DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers

    AMP-204C/AMP-208C - ADLINK Technology Inc.

    ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.

  • 2-port/4-port PCI Express GigE Frame Grabber Card

    AX92320 - Axiomtek Co., Ltd.

    The AX92320 supports PCI Express x4 lane, two or four independent Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports and GigE Vision camera compliance. The PCI Express x4 frame grabber can provide up to 30 watts at 54 VDC power to port which allows power to be supplied to connected PoE-based devices, such as GigE Vision cameras in machine vision systems. The intelligent GigE Vision card also supports IEEE 1588 (precise time protocol), enabling synchronization with multi-camera acquisition. Combining IEEE 1588 and PoE function, the card utilizes a single Ethernet cable for power, data, and synchronization. Furthermore, it supports jumbo frames up to 9.5KB. The AX92320 is ideal for PoE applications such as automated optical inspection (AOI), factory automation, and PC-based surveillance systems.

  • Packaging Manufacturing

    KLA-Tencor Corp

    KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.

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