Showing results: 1 - 15 of 70 items found.
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Dynamic Test Solutions
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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PS-5026B -
High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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STI3000 -
Solidus Technologies, Inc.
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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WS-8800 -
NAPSON Corp.
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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UF3000EX-e -
CSE Co.,Ltd
Wafer Probe Station is used in connection with test system in Wafer Test process.It is a device to move wafer automatically to examine fair quality of individual chip on the wafer. Probe Station is seperated depending on purpose. For analysis, for mass production as well as manual, semi-automatic, full-automatic.
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MICRONICS JAPAN CO.LTD.
Full Automatic Wafer Prober. Semi Automatic Wafer Prober. High Current Probe Block. 6-inch Manual Prober. 8-inch Manual Prober. 12-inch Manual Prober.
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Creative Design Engineering, Inc.
*Type: Floor Standing*Wafer load: FOUP LoadPort*Wafer size: 300mm, 8" and 300mmopen cassette with adapter*Mini Environment: yes*Probe Changer: 1,2 or 4 probes*Aligner: yes*Range: 1m/ to 10M/*Accuracy:0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Creative Design Engineering, Inc.
*Type: EFEM*Wafer load: FOUP*Wafer size: 300mm*Mini Environment: yes*Probe Change: 1, 2 or 4 probes*Aligner: yes*Size: depends on configuration*Range: 1mΩ/☐ to 10MΩ/☐*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Japan Electronic Materials Corp.
The probe card is a tool for testing semiconductors used at "Wafer Test" to check quality of IC or LSI in the first process of semiconductor manufacturing. The probe card is expendable.
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MTI Instruments
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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S-1160 -
Signatone Corp.
S-1160 Probe Station 100mm, 150mm and 200mm wafer stage's completely manual and user friendly.
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Direct Dock -
SV Probe, Inc.
Direct dock style wafer probing allows for a higher bandwidth, increased pin density and testing more devices in parallel. Direct dock probe cards also support the growing movement of traditional final test to wafer probe which allows for known good die (KGD) and reduced cost of ownership.
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VC Series -
Japan Electronic Materials Corp.
*Vertical contact Probe Card*No limitation by Pad layout*Large probe area (Suitable for 200mm wafer 1-shot)*Small scrub mark*Suitable for High/Low Temperature Test
