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Product
8GB SO-DDR5-5600 1GX16 1.1V SAM
AQD-SD5V8GN56-SC
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
16GB ECC DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GE56-SB
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SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
16G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V16GN56-SBH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
32GB DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-D4U32GN32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
32GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V32GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
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8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
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Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
Micron 8G DDR4 3200 288PIN 1GbX8 REG 1.2V
96D4-8G3200ER-MI
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DDR4-3200 Registered ECC DIMM, 1.2V power consumption, Supports ECC error detection and correction. Data bus inversion (DBI) for data bus, Low-power auto self refresh (LPASR).
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
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Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-SD4U16GN32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
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8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
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Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Wide Temperature Server DIMM
SQR-RD4M
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Original Hynix IC chip adopted, Wide operating temperature support -25~85oC, Data transfer rate up to 3200 MT/s.
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Product
16GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
8GB DDR4 SODIMM-3200 1GbX8 SAM
AQD-SD4U8GN32-SE
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
DDR5 Memory
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SQRAM DDR5 offers extreme high speed with 6400 MT/s data transfer rate and high efficiency power management.
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Product
PCMCIA Card
DAS-429PCMCIA/RT10
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Both cards contain 68 Kbytes of true dual-port RAM, for data blocks, control registers and Look-up table, mapped within the Common Memory space. The card also contains a FLASH-based Card Information Structure (CIS) within the Attribute Memory space.The cards comply with the Personal Computer Memory Card International Association (PCMCIA Release 2.1) standard, including Plug and Play. The card's small size and suitability for PCMCIA compatible notebook computers with Type II and Type III slots make it a complete solution for developing and testing ARINC-429 interfaces and for performing system simulation of the ARINC-429 bus, both in the lab and in the field.The cards are supplied with C drivers, including source code, Mystic Windows software and may be used with Exalt, Excalibur’s Analysis and Laboratory Tools, a Windows monitoring application.
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Product
Timing, Logic & Memory
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Offering an extensive portfolio of products for programmable clocks, clock generation and distribution, standard logic and memory (Flash, EEPROM and SRAM) across various applications.
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Product
Semiconductor Memory Tester
T5851
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Advantest Corporation has introduced the T5851 system, designed to provide a cost-effective test solution for high-performance universal flash storage (UFS) devices and PCIe BGA solid-state drives (SSDs) memory ICs in high demand by makers of low-power, mobile applications such as smart phones, tablets and ultra-portable laptops. The flexible T5851 tester is available in both production and engineering models. This allows the system to be used for reliability and qualification testing as well as test-program development or, when equipped with an automated component handler such as Advantest''''s M6242, high-volume production. As a fully integrated, system-level test solution, the T5851 provides multi-protocol support in one tool while its tester-per-DUT architecture and proprietary hardware accelerator allow it to achieve industry-leading test times.
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Product
Memory Analyzers
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Market drivers in the memory sector have changed. Gone are the days of simply pushing Moore’s Law to ever faster data rates. The memory designs of today and tomorrow must also be smarter than ever before. Today, handheld and wearable computers must draw from a limited battery reserve while serving up fast, responsive, and compelling mobile experiences. Meanwhile the cloud of data centers and server farms that feed us these compelling experiences must continuously grow while simultaneously reducing overhead and environmental impact. These two different markets have the same goals: smarter memory, smarter control systems, and lower power usage.
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Product
16GB SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
CXL Memory
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SQRAM launches next-gen CXL 2.0 Memory Expansion, offering high-speed, low-latency performance to meet the needs of large AI training and HPC clusters.
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Product
Memory
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Renesas offers MIL-STD-883-compliant CMOS random access memory (RAM) and CMOS programmable read-only memory (PROM) devices that are that are qualified to QML Class Q military standards.
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Product
Shared Memory Network
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Avionics Interface Technologies
AIT's Shared Memory Network (SMN) interface modules provide host systems with an interface to a high speed (2.125 Gbps) optical data network which can be used to share data, in real-time, between multiple distributed systems.
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Product
Memory Products
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The electronic systems we use today require some form of memory for data and software storage. As a leading supplier of high-quality memory products, we offer a broad portfolio of serial EEPROM, serial EERAM, parallel EEPROM, OTP EPROM, serial Flash, parallel Flash, serial SRAM, NVSRAM, and CryptoMemory® security ICs to meet your memory needs. We also offer the industry’s first commercially available serial memory controller for use in high-performance data center computing applications. Our extensive testing protocols have ensured industry-leading robustness and endurance along with best-in-class quality to provide you with reliable products, dependable technical support and a consistent supply of devices throughout your product’s lifecycle.
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Product
Memory Tester
SP3000
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CST is proud to offer a portable stand alone and affordable memory tester, combining DIMM and SODIMM testing capability all on the same universal base unit with optional easy plug-on test adapters.
