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COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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IP Core and FPGA Products
Our FPGA offerings include development boards and IP cores for Altera FPGA devices. The IP cores include: I2C, PCIe, JPEG-LS, LVDS Camera Link and memory controllers.
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Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor, DisplayPort, LVDS And 2 GbE LAN
PICO51R
The PICO51R is powered by the 7th generation Intel® Core™ i7/i5/i3 or Celeron® processor (code name: Kaby Lake). With the onboard CPU attached on the rear side of the board, the PICO51R can aid the heat-extraction process to make fanless design possible and make system integration fast. The pico-ITX embedded board also provides practical expansion interfaces within its limited dimensions including one M.2 Key E slot for wireless modules and one M.2 key B slot for storage cards. This powerful 2.5-inch Pico-ITX embedded motherboard is designed for minimum maintenance and maximum ruggedness. In addition to two USB 3.0 (USB 3.1 Gen1) ports in support of industrial cameras for machine vision applications, the PICO51R also comes with an M.2 Key E slot for wireless communication capabilities and two Gigabit Ethernet ports for mass data transmission or LAN port teaming functions.The Intel® Core™-based PICO51R supports one 260-pin DDR4-2133 SO-DIMM for up to 16GB of system memory. Moreover, the pico-ITX single board computer utilizes Intel® HD graphics engine to bring a true high definition visual experience with dual display configurations through DisplayPort and 18/24-bit single/dual channel LVDS. In addition, this industrial motherboard can withstand a wide operating temperature range from -20°C to +60°C (-4°F to 140°F) for use in rugged and harsh environments.
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Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor, LVDS And LAN
PICO511
The PICO511 is an extremely compact Pico-ITX motherboard featuring the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U (codename: Kaby Lake). The feature-rich 2.5-inch embedded board is building flexible I/O interfaces through board to board connectors, wide temperature range in a small-form factor motherboard to fit different needs of many demanding applications in various industries. The PICO511 is perfect for system integrators who require an extremely compact embedded motherboard with great processing power and expansion capabilities. Its compact size form factor has ensured that it can fit into a variety of space constricting environments. In addition, the Intel® Kaby Lake-based motherboard was designed to withstand extreme temperatures, ranging from -20°C to +70°C (0°F to +158°F).
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COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Radar Core Chips
Macom Technology Solutions Holdings Inc.
Multifunction GaAs and Silicon MCM designed for communication radar and weather applications. MACOM Core Chips deliver a complete transmit/receive function with phase and amplitude control.
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3U CompactPCI 9th Gen Intel® Xeon®/Core™ i7 Processor Blade
cPCI-3520 Series
The cPCI-3520 Series is a 3U CompactPCI blade available in single-slot (4HP), dual-slot (8HP) or triple-slot (12HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O in the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O in the dual-slot (8HP) version includes additional 2x USB 2.0, 1x COM, 1x KB/MS and Line-in/Line-out on the cPCI-3520D or additional 2x DisplayPorts, 1x COM in RJ-45 connector, 1x KB/MS and 1x additional USB 2.0 port on the cPCI-3520G. Two more dual-slot options are the cPCI-3520L with additional 2x GbE, 1x COM and 2x USB and the cPCI-3520M with one 100-pin high density connector supporting additional 2x DVI-D, 2x USB 2.0, 2x COM, 2x KB/MS and Line-in/Line-out ports.
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LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ ATX Server Board with 4 DDR4, 7 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-786
- LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 128 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60° C ambient operating temperature range
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Ultimate Performance Gaming Platform Based on 7th Generation Intel® Core™ Processors Supports up to 11x Independent Displays Including 4K UHD
ADi-SA1X-SL
- Ultimate " all-in-one" gaming platform- The best-in-class graphics capabilities in games with high levels of detail- Up to 11x independent HD monitors supporting 4K UHD- Advanced security feature set and software solutions- Intelligent middleware shortens development time- Various power supply options- Low-power consumption
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC
eBOX640-500-FL
The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.
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LGA 1151 Intel® Xeon® E3 v5/v6 & 6th/7th Generation Core™ ATX Server Board with 4 DDR4, 4 PCIe, 3 PCI, 6 USB 3.0, 6 COM, 6 SATA3, Quad/Dual LANs, IPMI
ASMB-785
- Supports LGA 1151 Intel® Xeon® E3-1200 v5/v6 and 6th/7th Generation Core™ i7/i5/i3 processors- DDR4 2400/2133/1866/1600/1333 MHz ECC/Non-ECC UDIMM up to 64 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCI slots- Triple display - two DVI-D and one VGA ports- Supports up to ten RS-232 or six RS-232 and four RS-422/485 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C ambient operation temperature range
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NXP I.MX8M Plus Quad Core Processor Based IIoT Gateway Platform
MXA-200
MXA-200 is an i.MX8M Plus based high-performance IoT gateway, which has an open platform design with Quad Core processor, two RS-232/422/485 isolated serial ports, two 10/100/1000 Ethernet ports, two USB 3.0 port and operating temperature range of -20~70°C. It offers two M.2 slots for integrating Wi-Fi/4G/5G modules. MXA-200 enables system integrators to develop applications precisely for renewable energy, EV charger, smart city and factories which require massive data collection, cloud based application and video related monitoring solutions.
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6U CompactPCI Intel® 6th Gen. Core™ i3/i5/i7 Processor Blade with ECC support
MIC-3399
- Supports 6th Generation Intel® Core™ i3/i5/i7 processors and Intel® CM236 PCH with embedded graphic (up to 3 independent displays)- Up to 32GB (DDR4-2133) memory (max 16GB on board, socket SO-DIMM x1, max 16GB)- Optimized dual-slot SBC with 2.5" SATA-III HDD/SSD, 2240 or 2280 M.2 socket, on-board Nandflash (optional)- Two SATA ports, two USB 3.0, six USB 2.0 ports, two DP ports, two COM ports, one PS/2, one Audio, one VGA and PCIe x8 interfaces to the Rear Transition Module (RTM)- Five Gigabit Ethernet ports including two PICMG 2.16 for front and rear connectivity- PICMG 2.16 R1.0, PICMG 2.1 R2.0, PICMG 2.0 R3.0, PICMG2.9 R1.0 compliant
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6th Generation Intel® Core™ i7/i5/i3 Fanless Computer
MVP-6010/6020 Series
ADLINK's newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
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Fanless Ultra Compact Embedded System With Intel® Core™ I5-7300U &Intel® Celeron® 3965U Processor, DisplayPort++, 2 COM, 4 USB And 2 GbE LAN
eBOX100-51R-FL
The eBOX100-51R-FL is a fanless ultra-compact embedded system with weight 600 grams only. As the smallest embedded system with Intel® Core™ ULT processor onboard, the eBOX100-51R-FL continues the design elements of eBOX100 series – ultra-slim form factor, rugged design, and rich I/O connectivity, allowing greater flexibility and a wider range of application in edge computing, IIoT gateway and extended fields. The eBOX100-51R-FL is powered by the high-performance Intel® Core™ i5-7300U or Intel® Celeron® 3965U processor. The front-facing I/O connectivity design provides convenient access for easy installation and maintenance. It comes with one DDR4-2133 SO-DIMM slot with system memory up to 16 GB. The eBOX100-51R-FL offers two RS-232/422/485, two USB 3.0 ports, two USB 2.0 ports, two Gigabit Ethernet ports, one DisplayPort++, one AT/ATX quick switch, and two SMA type antenna openings; moreover, the embedded system is equipped with one M.2 Key E 2230 slot for Wi-Fi, one M.2 Key B 2242 for SATA storage, and one screw-type 12VDC power input connector.
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Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H310 And TPM 2.0
OPS500-520-H
The OPS500-520-H is powered by the newest 8th generation Intel® Core™ i7/i5/i3 and Celeron® processors (code name: Coffee Lake S) with the Intel® H310 chipset. The smart cableless digital signage module has two DDR4-2400 SO-DIMMs for up to 32GB of system memory. Axiomtek's OPS500-520-H supports the LGA1151 socket-type processors offering greater flexibility for CPU selections, which is easily configured to meet various performance requirements. The OPS signage module is connected to OPS-compliant display via a standardized JAE TX-25A plug connector interface which supports DisplayPort, HDMI 2.0, USB 2.0, USB 3.1, audio and UART signals. It also has one M.2 Key E for Wi-Fi modules and one M.2 Key M supporting PCIe, SATA and SSD interfaces for storage. We believe that this new smart cableless open pluggable signage module with simplified installation, maintenance and upgrade can help you develop creative display solutions that increase your sales and improve your customers' experiences. With the enhanced multimedia performance, the Intel® Coffee Lake S-based OPS500-520-H is well suited for a wide range of digital signage applications in retail, transport, entertainment, education, and more.
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, HDMI, DVI-D, VGA, 8-CH PoE, 6 USB And 24 VDC
eBOX671-517-FL
The eBOX671-517-FL supports 8-port Gigabit PoE and able to work under harsh temperatures. Its eight Gigabit PoE ports allow multiple cabling to cameras and any PoE power device; and, the eBOX671-517-FL is specifically designed for security surveillance, optical inspection, and edge computing applications. This rugged NVR embedded box PC is powered by the 7th/6th generation Intel® Core™ (Kaby Lake/Skylake) or Intel® Celeron® processors with a 35W/65W TDP and comes with Intel® Q170 chipset. The eBOX671-517-FL comes in great expansion possibilities, including a flexible I/O module slot with a wide selection of PCIe Mini modules and four PCI Express Mini Card slots. It also has two front-accessible SIM slots and four SMA-type antenna connectors. For storage, this high performance fanless embedded system has two SATA HDD drive bays with a height of up to 15 mm and one optional mSATA for RAID 0 and 1. Moreover, the embedded device supports two non-ECC 260-pin DDR4 SO-DIMM slots for up to 32GB of system memory.
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Open Pluggable Specification (OPS) Digital Signage Player With Socket G2 Intel® Core™ I5/i3 & Intel® HM65
OPS860-HM
The OPS860-HM Open Pluggable Specification (OPS) compliant signage player delivers high performance without the high cost of installation and maintenance. This signage player supports 2nd generation Intel® Core™ i5/i3 processors with Intel® HM65 Express chipset and has a DDR3-1333 system memory that can expand up to 4GB. The OPS860-HM connects to any OPS compliant display via a standardized JAE TX-25 plug connector, and includes HDMI/DVI, DisplayPort, UART, audio, and USB 2.0 signals. Compliant with standard OPS architecture, the OPS860-HM delivers greater interoperability and allows for easy upgrade and replacement without the need to dismantle the entire signage system.
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Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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PICMG 1.3 Half-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, SATA3, USB 3.0, DVI-I/LVDS And Dual LANs
SHB230
The SHB230 is high-performing PICMG 1.3 half-size single board computer.The SHB230 based on the Intel® Q87 PCH is designed to support 4th Generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Haswell/Haswell Refresh) in the LGA1150 socket.The slot CPU card is equipped with two DDR3-1333/1600 SO-DIMM sockets with up to 16 GB memory capacity to meet customers needs.The PICMG 1.3 specification brings advantages of PCI Express to this single board computer that offers four PCIe x1 or one PCIe x4, and one PCIe x16 routed to the backplane.The onboard two SATA interfaces support RAID 0/1 functions to ensure reliable storage for multiple applications.Utilizing with the latest Intel® technologies, this PICMG 1.3 system host board is an ideal solution for DVR, medical equipment, industrial automation, process control, and network security market.
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3U OpenVPX™ SOSA™-Aligned SBC with Intel® Core™ i7-1186GRE Processor (Tiger Lake)
68INT6
The 68INT6 is a SOSA™-aligned 3U OpenVPX Intel® Core™ i7-1186GRE Processor / integrated PCH-LP (Tiger Lake) w/ 4 Cores & 12M Smart Cache running up to 2.8 GHz Single Board Computer that can be configured with up to two Smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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3.5" Embedded SBC With LGA1151 Socket For 7th/6th Gen Intel® Core™ I7/i5/i3 Processor, LVDS, VGA, HDMI, 2 GbE LANs And Audio
CAPA500
The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Embedded Real-Time Robotic Controller with 11th Gen Intel® Core Processor
ROScube Pico TGL
ADLINK’s ROScube Pico TGL is a real-time ROS 2 enabled robotic controller based on the 11th Gen Intel® Core™ i7/i5/i3 processors with Intel® Iris® Xe Graphics featuring exceptional I/O connectivity and supporting a wide variety of sensors and actuators for unlimited robotic applications. The ROScube Pico TGL supports the full complement of resources developed with ADLINK Neuron SDK. Bundled with AI features and capabilities and developed with the Intel® distribution of OpenVINO™ toolkit, the ROScube Pico TGL is a perfect platform for industrial service robot applications such as autonomous mobile robots (AMR) and autonomous mobile industrial robots (AMIR).
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3.5" Single Board Computer With Intel® Core™ Ultra Processors
SBC35-MTL
ADLINK SBC35-MTL, a compact 3.5" Single Board Computer equipped with Intel® Core™ Ultra Processors for efficient, high-performance computing. It features an integrated NPU to boost AI processing capabilities and includes a reserved MIPI-CSI signal pathway for easy camera integration, making it ideal for real-time and vision-based applications. The SBC35-MTL is designed to meet the needs of modern embedded systems, delivering cutting-edge performance in a compact form factor
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COM Express R3.1 Type 6 Compact Size Module Based On Intel® Core™ Ultra Processors
cExpress-MTL
Featuring Intel’s latest Intel® Core™ Ultra processors (formerly “Meteor Lake-U/H”), the cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel’s modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.
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9th Gen Intel® Xeon®, Core™ i7/i5/i3-Based Compact Industrial GPU Workstation
DLAP-8000 Series
- 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset- Dual SODIMMs for up to 64GB DDR4 / ECC options*- Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0- Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM- Front accessible I/O and adaptive Function Module v.2 option- Flexible and powerful PCIe expansions via backplane
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Fanless Embedded System With Intel® Core™ I7-6600U/i5-6300U/i3-6100U & Celeron® 3955U, 2 HDMI, 2 GbE LAN, 4 USB 3.0, 2 COM And PCI Express Mini Card Slot
eBOX560-500-FL
The eBOX560-500-FL is an Intel® Skylake-based fanless embedded system with compact size and full-featured I/O interface. To bring both excellent performance and ultra-low power consumption, the palm-sized embedded box PC is powered by the 6th generation Intel® Core™ i7-6600U or Celeron® 3955U processor (formally codename: Skylake). One 260-pin DDR4-2133 SO-DIMM socket with system memory up to 16 GB is available. The power efficient IP40 embedded system supports 12V DC input with screw-lock and features a user-friendly AT/ATX DIP switch. The compact eBOX560-500-FL is suitable for Industrial Internet of Things (IIoT) solutions, digital signage, retail equipment, smart factory automation, thin clients, industrial controller systems and many more.
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Fanless Embedded System With Socket G2 Intel® Core™ I7/i5/i3 & Celeron® Processor And 4 GbE LANs
eBOX660-872-FL
A high-performance fanless embedded system with 3rd Generation Intel® Core™ processor (Ivy Bridge), the eBOX660-872-FL, is presented by Axiomtek earnestly. It incorporates the 3rd Generation Intel® Core™ processor (i7/ i5/ i3) or Intel® Celeron® processor with Intel® HM76 Express chipset, propelling computing with better processing. With the great graphics computing capability and dual view support, this fanless embedded box computer is especially suited for automatic optical inspection, digital signage (DS), digital surveillance, gaming, automation control and POS/Kiosk. In addition, this application-ready compact rugged platform also targets for nearly any field of industrial embedded applications like embedded controller, factory automation and more fields.
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
