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Air Core Line & Load Reactors
Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Fanless Embedded System With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 4-CH PoE And MXM 3.1 Type A
eBOX671-521-FL
The eBOX671-521-FL is a GPU computing embedded system that comes with 4-CH PoE and MXM 3.1 Type A slot for applications in machine vision, edge computing, traffic vision, deep learning, and artificial intelligence of things. The outstanding eBOX671-521-FL with enhanced GPU computing performance is powered by the 9th/8th gen Intel® Core™ i7/i5/i3 processor with up to six-core, Intel® Pentium® processor, or Intel® Celeron® processor and comes with Intel® Q370 or optional Intel® C246 chipset. The fanless embedded GPU-based system is equipped with dual DDR4 ECC/non-ECC SO-DIMM slots for up to 64GB of system memory. The embedded vision system has an optional MXM type A slot for NVIDIA GTX1030 and GTX1050 graphics modules to enhance the performance of the visual display. Furthermore, this Intel® Coffee Lake-based embedded box PC is specially designed with four Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports with a total power budget of 60W, six USB 3.1 ports and two Gigabit LANs to connect different devices or sensors. It comes in great expansion possibilities, including one internal MXM 3.1 type A connector, two full-size PCI Express Mini Card slots and two SIM slots. For storage, it has two swappable SATA HDD drive bays with a height of up to 9.5 mm and one mSATA for RAID 0 and 1 feature. Besides, we have designed a flexible I/O window slot for incorporating application-oriented I/O functions to meet the requirements of various cases. This embedded vision computer can be mounted using wall or DIN-rail mounting for versatile use in various environments.
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Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
785270-01
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784970-01
The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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COM Express Type 6 Prototyping Kit based on Intel® 12th Gen Core™ i5-12600HE
COM Express Type 6 Alder Lake-P
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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3U 7th Generation Intel® Core™ i3-7100E Processor-Based PXI Express Gen3 Controller
PXIe-3937
The ADLINK PXIe-3937 PXI Express embedded controller, based on the 7th gen Intel® Core™ i3 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Mini-ITX SBC With LGA1150 Socket 4th Gen Intel® Core™ Processor, Intel® H81, HDMI/VGA/LVDS, Dual LANs And USB 3.0
MANO881
The MANO881 Mini-ITX motherboard with Intel® H81 Express chipset supports the 4th generation Intel® Core™ and Celeron® (Haswell) processors. This feature-rich Industrial SBC has two sockets for DDR3 system memory of up to 16 GB. The high-performance mini-ITX motherboard MANO881 supports one PCIe x16 slot and integrated with Intel® HD 5000 graphics supports powerful graphic processing and dual-display capability through HDMI, VGA and LVDS interfaces. The outstanding embedded board also includes rich I/O expansions which can help system integrators to develop solutions quickly at a more competitive price. The MANO881 is excellent for in-vehicle PCs, medical imaging and gaming devices, in-flight entertainment systems, industrial automation systems, and other portable devices.
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PICMG 1.3 Half-size CPU Card With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1, LAN And DVI-I
SHB250R
*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3, Xeon® E (C246), Pentium® or Celeron® processor*Intel® C246/Q370/H310 chipset*2 DDR4-2666/2400 SO-DIMM for up to 64GB of memory*Supports M.2 slot (C246/Q370)*Supports Intel® AMT and vPro (C246/Q370)*TPM 2.0 supported
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LGA 1151 Intel® Xeon® E3 v5/v6 & 6th/7th Generation Core™ Series Micro ATX Server Board with 4 DDR4, 1 PCIe x16, 3 PCIe x4, Quad LANs, USB 3.0
ASMB-585
- Supports LGA 1151 Intel® Xeon® E3-1200 v5/v6 and 6th/7th generation Core™ i7/i5/i3 processors- DDR4 ECC/non-ECC 2400/2133/1866/1600 MHz DIMM up to 64GB- One PCIe x16 slot (Gen3 x16 link), three PCIe x4 slots (2 Gen3 x4 link, 1 Gen3 x1 link)- Triple display - two DVI-D and one VGA ports- Supports up to ten RS-232 or six RS-232 and four RS-422/485 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C ambient operation temperature range
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Dual Quad Core Multiprocessor
DSP282A
Designed for size, weight and power (SWaP) sensitive applications, Abaco's high performance embedded computing (HPEC) platforms deliver expanded mission capabilities across a wide range of manned- and un-manned airborne, ground and naval platforms.
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Ultra-compact, uncooled thermal imaging core
Dione 640 CAM Series
The Dione 640 CAM series is based on the Dione 640 OEM thermal imaging core with 640 x 480 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 60 Hz.The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione 640 CAM is both lightweight and small. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 640 CAM versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional). The ultra-compact Dione 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Fanless Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Vision I/O, 4-CH PoE And 4-CH LED Output
MVS900-512-FL
The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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PICMG 1.3 Full-size CPU Card With LGA1151 8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1/Gen2, Dual LAN And DVI-I
SHB150
The SHB150 is based on the latest LGA1151 socket 8th generation Intel® Core™ processors (code name: Coffee Lake) and Intel® C246, Q370 or H310 chipset. The SHB150 features multiple I/O options and high-speed transfer interfaces as well as superior graphics capability (Intel® HD Graphics), making it an ideal solution for smart factory automation. The Intel® Core™-based full-size SBC, SHB150, comes with two 288-pin DDR4-2666/2400 Long-DIMM sockets with up to 32GB of system memory. The PICMG 1.3 single board computer has a maximum of six SATA-600 ports supporting software RAID 0/1/5/10 for data redundancy. It also has one M.2 Key M 2280 SSD slot with a PCIe x4 interface. The SHB150 with the Intel® HD Graphics brings a true high definition visual experience with triple display configurations (Intel® C246 or Q370) via DVI-I and DisplayPort (header) ports. Moreover, the Intel® Coffee Lake-based SHB150 supports optional Trusted Platform Module (TPM) 2.0 for optimum security, Intel® Active Management Technology (Intel® AMT) 12 for remote management, as well as Intel® vPro™ technology. The industrial single board computer provides significant advantages to customers in the fields of machine vision and industrial automation operations
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COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Renesas RA Family Of 32-bit MCUs With Arm® Cortex®-M Core
The flexible Renesas Advanced (RA) 32-bit MCUs are industry leading 32-bit MCUs with the Arm® Cortex®-M33, -M23 and -M4 processor cores and PSA certification. RA delivers key advantages compared to competitive Arm Cortex-M MCUs by providing stronger embedded security, superior CoreMark® performance, and ultra-low power operation. PSA certification provides customers the confidence and assurance to quickly deploy secure IoT endpoint and edge devices, and smart factory equipment for Industry 4.0.
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Mini Type COM-HPC Module With Intel® Core™ Ultra Processor (Meteor Lake)
COM-HPC-mMTL
Combining a power-efficient Intel® Core™ Ultra processor with up to 64GB LPDDR5 memory in a 95x70mm size makes this ideal for battery-powered, space-limited, high-performance edge applications like medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots.
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Fanless Embedded System With 7th/6th Gen Intel® Core™, Pentium® And Celeron® Processor For Railway And Vehicle PC
UST500-517-FL
The UST500-517-FL is powered by the LGA1151 socket 7th/6th generation Intel® Core™ and Pentium® processors up to 65W with the Intel® Q170 chipset. The integrated 16 PoE ports are available in RJ-45 or M12 connectors for IP cameras. It provides a full scope of power protection that includes intelligent vehicle power management technology for ACC on/off delay, shutdown delay, and over/under voltage protection. Enhanced by its robust structure and system design, the UST500-517-FL is able to operate under a wide temperature range from -40°C to +70°C and vibration endurance up to 3 Grms. This transportation embedded box is in compliance with ISO 7637-2 and EN 50155 for mobile surveillance applications. There are 16 Gigabit LAN ports which support 802.3at/af Power over Ethernet with a total power budget of 200W. Its DVI-D, HDMI and VGA interfaces support three surveillance monitors. Furthermore, its external accessible SIM card slot enables users to easily change SIM card for different telecommunication service. With wireless LAN modules, this user-friendly transportation embedded system can real-time transmits the video to the control center. The two built-in or four swappable SATA hard drives are used for mass storage of video files.
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Slim And Light All-In-One Medical Panel Computer Family With 11th Generation Intel® Core™ Processor Performance
MLC-M Series
MLC-M is a slim and light medical panel PC ideal for hospital information management at nursing stations or on medical carts. The MLC-M supports an 11th gen Intel® Core™ processor (Tiger Lake), providing the processing power needed to run high performance image processing software as well as hospital applications such as HIS, RIS, PDMS, and documentation software. The MLC-M has an IP54 rating courtesy of its screwless and fanless design, making cleaning easier, and protecting clinicians, nurses, and patients from possible infection. For superior user experience, the MLC-M has a highly flexible IO function module that can be customized for dedicated applications, four control keys for straightforward operation, a touch panel, and a selection of optional accessories.
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PICMG 1.3 Full-size CPU Card With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1/Gen2, Dual LAN And DVI-I
SHB150R
*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3, Xeon® E (C246), Pentium® or Celeron® processor (up to 95W)*Intel® C246/Q370/H310 chipset*2 DDR4-2666/2400 Long-DIMM for up to 64GB of memory*Supports Intel® AMT and vPro (C246/Q370)*TPM 2.0 supported (optional)*Supports M.2 Key M (C246/Q370)
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Ultra Compact, Uncooled Thermal Imaging Core
Dione 640 OEM Series
The Dione 640 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution. The NETD is less than 40 mK (available upon request) or 50 mK. The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low. All Dione 640 versions have the same SAMTEC ST5 connector and are GenICam compliant.The ultra-compact Dione 640 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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4-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC964-512-FL
The IPC964-512-FL is a 4-slot fanless barebone system with modular design and optimized expandability. The rugged industrial PC supports the high-performance 7th/6th generation Intel® Core™ and Celeron® processors with the Intel® Q170 chipset. The IPC964-512-FL features dual DDR4-2133 SO-DIMM slots with up to 32GB memory. For easy cabling and maintenance, the IP40-rated embedded system features a wide choice of front-accessible I/O interfaces, including two Gigabit LAN ports, four USB 3.0 ports, one VGA, one HDMI, one audio (Mic-in/Line-out), and three optional I/O modules - a 4-port isolated RS-232/422/485 module, an isolated 8-in/8-out DIO module, and a 2-port isolated RS-232/422/485 and 4-in/4-out DIO module. The compact industrial PC also provides four flexible PCI/PCIe expansion slots with three different combinations of expansion kits: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; and two PCI. Additionally, it has a full-size PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections, and comes with two easy-swappable 2.5” HDD trays for storage. To fit various industrial environments, the rugged modular industrial PC supports 24VDC (uMin=19V/uMax=30V) power input with a lockable terminal block-type connector and a wide operating temperature range of -10°C to +60°C.
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LGA 1200 Intel® Xeon® W & 10th Gen. Core™ ATX Server Board with 4 x DDR4, 5 x PCIe, 2 x PCI, 6 x USB 3.2, 5 x SATA 3, Quad/Dual LANs, and IPMI
ASMB-787
- LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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PICMG 1.3 Full-Size SBC With 14/13/12th Gen Intel® Core™ Processors And Intel® Q670E Chipset
NuPRO-E47
The NuPRO-E47 is a high-performance embedded single board computer that features with 14/13/12th Gen Intel® Core™ i7/i5/i3 processor and an Intel® Q670E Express chipset, which supports PCIe Gen 3. It comes equipped with 2 DIMM sockets that can support up to 64GB of Non-ECC DDR5 memory running at 4800MHz. The NuPRO-E47 also includes 6 SATA 3.0 ports with RAID support and 4 COM ports (including RS-232/422/485) for increased connectivity options. Additionally, the NuPRO-E47 supports Intel® PCIe bifurcation, allowing for flexible and efficient use of PCIe lanes. This single board computer is designed for use in a variety of industrial applications that require high-performance computing and reliable connectivity
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Expandable ROS2 Robotic Controller With Intel® 9th Gen Core Processor
RQI-53/55/57/58
ADLINK ROScube-I is a real-time ROS 2 enabled robotic controller based on Intel® Xeon® 9th Gen Intel® Core™ i7/i3 and 8th Gen Intel® Core™ i5 processors featuring exceptional I/O connectivity supporting a wide variety of sensors and actuators for unlimited robotic applications. Also supported are Intel® VPU and NVIDIA GPU cards for computation of AI algorithms and inference. The extension box allows for convenient functional and performance expansion. ROScube-I supports the full complement of resources developed with ADLINK Neuron SDK, a perfect platform for development of industrial use service robotic applications such as autonomous mobile robots (AMR) and autonomous mobile industrial robots (AMIR).
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SC9-TOCCATA, CompactPCI® Serial CPU Card Equipped With 11th Generation Intel® Core™ & XEON® W Processors (Tiger Lake H45 Platform)
EKF-SC9-TOCCATA
SC9-TOCCATA is a rich featured high performance 4HP/3U CompactPCI® Serial CPU board, equipped with an Intel® 11th Generation XEON® Processor (Tiger Lake H45 platform) for demanding industrial applications.
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3U Intel® Core™ i7-4700EQ Quad-Core Processor-Based PXI Express Controller
PXIe-3985
The ADLINK PXIe-3985 PXI Express embedded controller, based on the fourth generation Intel® Core™ i7 processor is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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4-slot Fanless Industrial System With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor (up To 3.3 GHz), Intel® Q87 Chipset, And Front-access I/O And PCIe/PCI Slots
IPC934-230-FL
To provide excellent computing capability, the high performance IPC934-230-FL industrial PC is equipped with the newest 4th generation Intel® Core™ i7/i5/i3 or Celeron® processor in 22nm process and Intel® Q87 Express chipset. Total four PCI/PCIe expansion slots allow installation of a variety of off-the-shelf PCI/PCIe cards for configurable applications. The rugged Intel® Hasewell fanless industrial computer is an ideal fit for automatic optical inspection, digital signage appliance, POS/kiosk, embedded controller, factory automation and many more applications.The 4-slot industrial PC is guaranteed to operate reliable in temperature ranging from -10°C to +50°C and is equipped with a 10~30 VDC 150W wide range power supply for mission-critical environments. It supports an easy-to-install fan module to dissipate heat generated within the system when high power consumption PCI/PCIe cards are installed. The all-in-one industrial embedded computer provides rich I/O connectors include two 2.5” SATA HDD, one CFast™ socket, four COM ports (one RS-232/422/485, three RS-232), two USB 3.0 ports, four USB 2.0 ports, dual Gigabit Ethernet, PS/2 ports, one DIO, audio and DVI-I. Moreover, the IPC934-230-FL supports various power protection including OVP (Over voltage protection), OTP (over temperature protection), OPP (over power protection) and SCP (over circuit protection) for more system safety.
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COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
