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Product
Semiconductor Package Wind Tunnel
WT-100
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Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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Product
Semiconductor Curve Tracer
CS-3000 Series
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*Max. Peak Voltage : 3,000V（HV mode）*Max. Peak Current : 1,000A（HC mode）*Equipped all models with LEAKAGE mode (Cursor resolution 1pA）*USB port for display hardcopy, waveform data (CSV format) and measurement setup SAVE/RECALL*LAN interface for Remote Control
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Product
Parametric Test Fixture
U2941A
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The Keysight U2941A is a parametric test fixture that is designed to complement the usage of U2722A USB source measure unit in the testing of semiconductor components, including SMT and DIP ICs.
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Product
Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Product
Functional Test Fixtures
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Reliable connections to device under test (DUT) test points are essential for robust functional test. Bloomy provides rugged fixtures and cable sets (ITAs) built for thousands and thousands of cycles in manufacturing environments. With the industry’s best mass interconnects and internal electronic keying, our fixtures are easy to change out and are automatically recognized by the test system.
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Product
Trusted Semiconductor Die/Wafer Source
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To offer a complete Turn-Key Solution requires the ability to source both leading edge high density and older die/wafer products. DPACI has factory direct access to Static Ram, Flash and DRAM Die/Wafer. For obsolete parts, DPACI can assist you with sourcing or recommend an upgrade. DPACI has access to roadmaps, data sheets and die maps to assist you with your choices.
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Product
Parallel Electrode SMD Test Fixture, DC To 3 GHz
16196C
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The 16196C surface mount devices (SMD) test fixture offers excellent repeatability and usability, with accurate correlation up to 3 GHz. 16196 series fixtures are custom designed to fit specific SMD sizes (see table below), and provide repeatable DUT positioning with reliable contacts to enable stable measurement results - reducing the possibility of operator-induced error. Traditionally, SMD inductor evaluation up to 3 GHz has been difficult to implement - now with the 16196 series, it’s easy to perform accurate and repeatable measurements.
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Product
Memory Test Systems
T5503HS2
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Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Product
Semiconductor
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Copper Mountain Technologies USB VNAs provide a low-cost semiconductor testing option, offering measurement speeds on the order of 10,000 points per second while maintaining 80-90 dB dynamic range, are uniquely suited for deployment into such demanding scenarios. Additional considerations for these applications include availability of external trigger inputs and outputs, amenability to external program control, size of the instrument, and parallel processing capability.
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Product
Emulates Dallas Semiconductors DS89C420
FE-C420
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* Emulates Dallas Semiconductors DS89C420 * 16K Code Memory * Real-Time Emulation * Frequency up to fmax at 3V and 5V * ISP Support * MS-Windows Debugger For C And Assembler * Emulation Headers and Signal Testpoints * Target Board and Programmer Included * Serially Linked to IBM PC at 115Kbaud
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Product
Semiconductor Assembly
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With the know-how that we have cultivated over many years in the semiconductor manufacturing process, we respond to the diverse needs of our customers regardless of prototype production and mass production.
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Product
Bluetooth RF Test System
FRVS
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FRVS is recognized by the Bluetooth SIG as a validated test system for qualification testing of products to Bluetooth BR/EDR and low energy RF test specifications.
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Product
6TL08 Benchtop Test Platform
H710008
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The 6TL-08 base platform was designed to cover the most common testing and in-system programming (ISP) needs with a reduced initial budget. The system includes a robust manual linear push mechanism allowing a low-cost fixture strategy thanks to the exchangeable cassettesThe platform enclosure features an 8-Slot fixture receiver, compatible with VPC 90 Series Mass Interconnect Module, as well as 6TL intelligent YAVModules (YAV90MMU &YAV90059), with room for fast ISP devices, optional PXI chassis and various power supplies. A removable back panel allows easy placement of custom connectors or test auxiliary circuitry.
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Product
Medalist i1000D
U9401B
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The Keysight Medalist i1000D is now even better. Improving from its previous state of an analog-only ICT, the new digital release of the system now features per pin programmable digital cards and a whole new set of intuitive software graphical user interfaces (GUIs) that makes programming and development effortless.
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Product
Semiconductor / FPD Inspection Microscope
MX61L
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Motorized Microscope for 300mm dia. Wafer/17 inch Glass Substrate use Reflected/Transmitted Illumination.
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Product
Configurable Functional Test System
ATS-5000
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Maximize the uptime of your most critical electronics with the ATS-5000 Functional Test System from Astronics Test Systems. Deployed globally for more than 20 years, the newest version of this tester provides a configurable, affordable solution that delivers just enough test.
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Product
Semiconductor Yield Management Software
QuickLoad-Central
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QuickLoad-Central is our new STDF filtering, analysis, reporting, managing, viewing and editing tool. It looks at all your STDF files before you need to, pulling out key information to pre-generate reports and help you quickly find the files you need. You can list files of interest with yield and header information on our dashboard, visualize your data, open pre-generated reports or push any information from them that you can think of to JMP, Excel or other analysis tools.
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Product
Bottom Electrode SMD Test Fixture
16198A
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Designed for impedance evaluations of bottom electrode SMDs and supports 201 (mm) and 402 (mm) sizes
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Product
Semiconductor Curve Tracer
CS-10000 Series
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This optional unit minimizes parameter variation on devices causedby heat. Pulse rise time can be configured for 1, 3, or 5ms; pulse duration from 1ms to 20ms; and pulse interval from 100ms to 2 seconds. This option is installed at the factory. Any changes desired after purchase will require return the unit back to IWATSUfactory.
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Product
Semiconductor ATE Systems
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Our testers allow for the high-volume production of electronics that touch people’s lives in communication, safety, entertainment, and much more.
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Product
Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Product
PCI Express 4.0 Test Platform
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The PCI Express 4.0 Test Platform provides a convenient means for testing PCIe 4.0 add-in cards with an internal interposer and power supplies. The Summit Z416 Test Platform provides the platform for the Summit Z416 to act as a host emulator, and provides a general purpose test backplane and interposer for testing Gen4, Gen3, Gen2 or Gen1 hosts and devices. It supports SMBus and other sideband signals.
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Product
Semiconductor Lifecycle Management
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Defense and space applications no longer drive the semiconductor industry. There is such a mismatch between the market life of a modern semiconductor, which can be measured in months to a couple of years, and the platform needs of defense and space platforms, measured in decades.Semiconductor Lifecycle Management (SLiM™) from Teledyne e2v HiRel Electronics solves this headache. We have many years of experience partnering with customers to save cost and lower risk when dealing with platform extensions.
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Product
Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Product
Semiconductor Test Equipment
IC Tester
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Equipment to determine the pass/fail of devices in the wafer inspection process and the final inspection process after packaging.
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Product
Semiconductor
DieMark
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DieMark Inking Systems are available in Electric and Pneumatic models and utilize convenient, disposable DieMark Ink Cartridges to streamline and optimize the process of marking defective die. With models available for nearly every test platform and configuration, Xandex inking systems are in operation daily in every corner of the world where wafer sort is performed.
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Product
Semiconductor Thermal Transient Tester
T3Ster®
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T3Ster (pronounced "Trister") is an advanced thermal tester from Mentor Graphics MicReD Products for thermal characterization of semiconductor chip packages. Superior to all other thermal characterization equipment on the market due to its speed and ease of use; its extremely accurate temperature measurements (0.01oC); and its 1 micro-second measurement resolution in time.
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Product
Ethernet and Fibre Channel Test Platform
SierraNet M648
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The SierraNet M648 Ethernet and Fibre Channel test platform provides best in class analysis, jamming and generation for traffic capture and manipulation for testing application and link characteristics. SierraNet M648 is the latest in the line of industry leading test and measurement tools from Teledyne LeCroy, designed for today’s high-speed storage and communications fabrics. SierraNet M648 supports examination and modification of Ethernet and Fibre Channel links utilizing both Pulse Amplitude Modulation 4 (PAM4) and legacy Non-Return to Zero (NRZ) technologies.
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Product
W-CDMA/HSPA+ Analysis Using NI PXI RF Test Instruments
RFmx W-CDMA/HSPA+
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The NI-RFmx W-CDMA personality is a highly optimized API for performing physical layer measurements on W-CDMA cellular standard signals. NI-RFmx W-CDMA is completely interoperable with all NI-RFmx APIs. It provides simple access to the most advanced optimization techniques such as multi-measurement parallelism and multi-DUT measurements. The result is extremely fast and high-quality measurements with minimal software development efforts.
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Product
Semiconductor Technology, Micro Scriber
Precision Micro Diamond Scriber MR200
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Optik Elektronik Gerätetechnik GmbH
Precision micro diamond scriber MR 200 for exact manual scribing for defined cutting of structured silicon wafers.
