Particle Size
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Pocket Sized Dial Thermometer NSF
T125/3
UEi Test & Measurement Instruments
Farenheit scale thermometer with a 1 3/4 inch dial and 5 inch stem with a 25˚ to 125˚F range
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COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Particle Impact Noise Detection
BW-LPD-DAQ4000
Computer based controller with predefined MIL-STD test sequences stored (New)Create unlimited custom tests with multiple vibration frequencies and acceleration and other parameters to meet unique requirements (New)
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Chassis Slide Rail Size 5
65-052
Automatic release in extended position. The chassis/cabinet mounted slide rails are ultra rugged and hold significantly more weight and can withstand shock and vibration in harsh environments.
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Single CMC size PCI Mezzanine Card
PMC SyncClock32
Brandywine Communication’s model PMC-SyncClock32 is a compact PCI Mezzanine Card (PMC) that precisely synchronizes the time on VME cards or provide accurate GPS synchronized time to the host motherboard. The 32-bit interface provides time from microseconds through years.
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Miniature Size - AC Operation
Columbia Research Laboratories
The M Series of LVDT's designed by Columbia Research Labs are ideal for use on small, high-speed mechanisms and in sensitive low-displacement applications. Linear motions over the ranges of +/-0.003" to +/-0.150" are translated into precisely proportional voltage for measurement and control.
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COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
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Chassis Rugged Slide Rail Size 5
CAE016383
Securely locked in extended position. The chassis/cabinet mounted slide rails are ultra rugged and hold significantly more weight and can withstand shock and vibration in harsh environments.
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SMARC Short Size Module with NXP i.MX 8M Mini SoC
LEC-IMX8MM
ADLINK LEC-IMX8MM, the first SMARC revision 2.1 compliant module offering superior power efficiency, is based on the low-power NXP i.MX 8M Mini processor (dual or quad core Arm Cortex-A53) with integrated Vivante GC NanoUltra graphics for improved processing capabilities. The LEC-IMX8MM is your ideal, cost-effective solution for various general-purpose edge and IoT applications.
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COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Pocket Size Analog Multimeter
HH2706
Basic Accuracy 4.0%5 Functions / 13 RangesVoltage test up to AC500V and DC500VCurrent test up to 250mA DCResistance test up to Ω x 1KΩTset Batteries 1.5V and 9VPower: 1 x 1.5V "AAA" batteryFuse: 0.5A, 250V type Φ 5 x 20mmSize: 100mm x 64mm x 35mmNet Weight: 100g
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Mini Palm Size Infrared Thermometer
IR-101
Shenzhen Calibeur Industries Co., Ltd..
'-Temperature range: -20~200°C （0~ 400°F）;'-Accuracy: ±2.5°C (-1°C ~320°C ), ±4°C(＜-1°C);'- Field of View: 8:1; '-℃/℉ exchange;'- Max/Min function'-Backlight, LCD Display;'- Size:65x113x29mm'- Weight: 80g'-Power: 12V 23A Battery(not included)
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Qseven® Standard Size Module With Intel® 6th Gen. Atom® X6000 Processors (Formerly Elkhart Lake)
Q7-EL
The ADLINK Q7-EL is a Qseven module that supports Intel Atom® x6000 (x6425RE, x6414RE, x6413E) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high-speed interfaces. With mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the smallest COM standards currently available. Q7-EL modules support up 16GB LPDDR4 memory, up to 256GB eMMC storage and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Magnetic Particle Inspection
Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Chassis Slide Rail Size 5
CAE010393
Securely locked in extended position. The chassis/cabinet mounted slide rails are ultra rugged and hold significantly more weight and can withstand shock and vibration in harsh environments.
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PXI-6115, 4 AI (12-Bit, 10 MS/s/ch), Buffer Size 16MS, 2 AO, 8 DIO, PXI Multifunction I/O Module
778194-01
4 AI (12-Bit, 10 MS/s/ch), 2 AO, 8 DIO, PXI Multifunction I/O Module - The PXI‑6115 is a simultaneous sampling, multifunction DAQ device. It offers analog I/O, digital I/O, two 24‑bit counters, and digital triggering. It is ideal for a variety of applications, such as stimulus/response applications where synchronization among analog input, analog output, and digital I/O is required, 42 V automotive applications, radar, sonar, and ultrasound. The included NI‑DAQmx driver and configuration utility simplify configuration and measurements.
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Handy Size Digital Multimeter
HH2107A
Basic Accuracy 1.0%. Large LCD display 2000 count, 21mm figure height. Manual Ranging at your choice (19 Range). High Voltage test up to AC 750V and DC 1000V. Higher Current test up to 10A. Resistance test up to 20MΩ
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Swing Mill with Soundproof Enclosure for Sample Sizes 2 - 100 Grams
Disc Grinder 8530
Ring & Puck mill with sound-proof enclosure that accommodates sample sizes ranging from 2 - 100 grams. Ideal for pulverizing dry, brittle samples and slurry grinding. CE Approved.
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COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Poket Size DMM
SDM102
Compact Pen type. Fits easily into shirt pocket. Easy to Use Rotary switch allows easy access and operation
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Chassis Slide Rail Size 7
65-053
Automatic release in extended position. The chassis/cabinet mounted slide rails are ultra rugged and hold significantly more weight and can withstand shock and vibration in harsh environments.
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Cryogenic Mill for Sample Sizes 0.1 - 100 Grams
Cryogenic Gringer 6870
Large cryogenic mill that accommodates sample sizes ranging from 0.1 - 50 grams. Specifically designed for cryogenic grinding and pulverizing tough and/or temperature sensitive samples immersed in liquid nitrogen. CE Approved.
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COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-sIDH
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
Express-ID7
ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.
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Chassis Rugged Slide Rail Size 7
CAE016384
Securely locked in extended position. The chassis/cabinet mounted slide rails are ultra rugged and hold significantly more weight and can withstand shock and vibration in harsh environments.
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COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
