High-Precision Lithography Metrology

High-Precision Lithography Metrology

The UniFire 7900 provides high-precision lithography metrology for high-volume semiconductor IC manufacturers. This fully automated tool delivers critical dimension (CD), overlay, and film thickness in one measurement. In the back end of the line (BEOL), for redistribution layer (RDL) and under bump metallization (UBM) patterning,

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