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WaferPro Express Core Measurement and Programming Bundle

WaferPro Express Core Measurement and Programming Bundle

The W8581BP WaferPro Express Core Measurement and Programming Bundle includes all the capabilities of the W8580BP Core Measurement Bundle and adds the ability to further customize tests by using Python and PEL programming. The W8581BP also adds the ability to run tests in virtual or simulation mode. The table below illustrates the key feature components included with the bundle. The bundle includes the user interface environment, including the wafer map environment, the data display, and the SQL Database. All the instrument drivers and their capabilities are included. Drivers for Cascade Microtech probers are also included. Please see the product brochure for details about supported instruments, wafer probers, thermal chucks and switch matrixes.

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