Wafer Grinding
KYEC provides wafer grinding services for silicon wafers, including gold and solder bumped wafers. Our core strengths are on wafer grinding includes: Grinding thickness: Mass Production: 4 mils for 6" and 8? wafers, 8 mils for 12? wafers. Engineering capability: 2 mils for 6? and 8? wafers, 2 mils for 12? wafers
