2D / 3D Inspection & Metrology System w/ 100% bump inspection

Dragonfly System - Rudolph Technologies Inc.

The Dragonfly™ system combines 2D and 3D technologies to detect yield-robbing defects and measure features critical for today’s packaging technology. 2D imaging technology provides fast, reliable inspection for defects down to two microns. Rudolph’s patented Truebump™ Technology combines multiple 3D metrology techniques to deliver 100% bump height. Applications: Bumping. After develop and etch, Large die, multi-chip packages. Reconstituted wafers. Redistribution layers, OQA and post saw. Gel and waffle pack inspection. Multi-product, multi-grid [e.g. MEMS].