Boin GmbH

software tools are used by IC and wafer manufactures to collect, analyze and distribute metrology data. Their powerful software algorithms help process engineers to analyze test and metrology results and to perform statistical analysis. As a result, Boin's software solutions help improve the yield of IC manufacturers worldwide.

  • +49 7348 928233
  • +49 7348 928234
  • info@boin-gmbh.com
  • Haldenweg 25
    Tomerdingen, 89160
    Germany

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Showing recent results 1 - 3 of 3 products found.

  • PANELMAP

    Boin GmbH

    PANELMAP is a software package used to collect, edit, analyze and visualize measured physical parameters on rectangular semiconductor panels. PANELMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.

  • WAFERMAP

    Boin GmbH

    WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.

  • WAFERView.OCX

    Boin GmbH

    WAFERView.OCX for Windows is a software development kit for both the semiconductor and disk drive industry. It offers 9 different types of graphics of WAFERMAP for Windows as an ActiveX control.