Showing results: 1 - 15 of 29 items found.
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CC-TLP-50-A1 -
High Power Pulse Instruments GmbH
*Capacitively coupled TLP probearm (CC-TLP) compatible with standard probing stations*18 GHz SMA connector*Tilt angle adjustment*Calibration gauge for needle height
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PHD-4001A -
High Power Pulse Instruments GmbH
*Electrically isolated probearm kit for VF-TLP, TLP, HMM, HBM force and sense probingbased on the GGB Picoprobe Model 10 replacement probe tips*Buried coaxial cable channel for thermo-chuck in isolated chamber temperature measurements*Compatible with GGB Picoprobe Model 10 replacement probetips*Compatible with all standard micropositioner interfaces*High precision rotation of the probearm by backlash-free 80:1 gear*Rugged stainless steel design*SMA connectors
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GF-A -
High Power Pulse Instruments GmbH
*Compatible with GGB picoprobe model 10 replacement probe tips*<1 ns rise time (200 ps possible with 5 mm GND wire length)*Custom selectable GND wire length 5-15 mm*Gold-coated spring-steel clamp with micro-machined groove for locking of the clamps on the probe tip*High conductivity and low inductance copper HF litz wire with 200 x Ø 0.02 mm strands*Easy to use clamping*Tungsten carbide probe needle with 1 inch length, 15° taper and 7.5 µm tip radius
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TPA-GFG -
High Power Pulse Instruments GmbH
*Electrically isolated probearm for GND needle contact or general purpose DC, twin-wire HBM or flexible pitch VF-TLP/TLP/HMM/HBM force/sense probing based on the HPPI GF-A flexible pitch setup.*Flexible rotation of the probearm by precision gear 80:1*Suitable to mount the GF-A ground fixture needle for flexible pitch measurements. In addition a cable (e.g. for HBM) can be directly connected to the contact pin.*High stability
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TPA-GFM -
High Power Pulse Instruments GmbH
*Electrically isolated probearm for GND needle contact or general purpose DC, twin-wire HBM or flexible pitch VF-TLP/TLP/HMM/HBM force/sense probing based on the HPPI GF-A flexible pitch setup.*Suitable to mount the GF-A ground fixture needle for flexible pitch measurements. In addition a cable (e.g. for HBM) can be directly connected to the contact pin.*High stability
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PS-5026B -
High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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PHD-3001A -
High Power Pulse Instruments GmbH
*Pulse force and pulse sense fixed pitch and flexible pitch RF probing solution for TLP/VF-TLP/HMM on-wafer measurements using Picoprobe™ Model 10*High peak current capability 80 A (100 ns)*DC – typ. 7 GHz bandwidth*Isolated probe-head ground shield for high pulse sense common mode signal rejection*Including fixed pitch replacement probe tip 50 Ω, right, 100 µm pad pitch*Including fixed pitch replacement probe tip 5 kΩ, left, 100 µm pad pitch*Including flexible pitch clamps plus 10-5k(0502)-125-W-1 and 10-50/30-125-W-1 replacement probe tips*True coaxial high-resolution 80:1 rotary probe-head for accurate probe tip adjustment
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TLP-3011C -
High Power Pulse Instruments GmbH
*Fully automatic pulsewidth extender*Pulse width up to 1.6 µs in 68 programmable steps of 25 ns*Ultra fast 50 Ω pulsewidth extension with typical 100 ps rise time*High pulse output current up to ±40 A*High performance and high quality components
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TPA-95 -
High Power Pulse Instruments GmbH
*Flexible pulse force, pulse sense combined TLP probe arm kit based on TPA-95L and TPA-95R*Compatible with typical standard micropositioner mechanical interfaces*4.7 kΩ pulse sense voltage divider, which results in a voltage transfer ratio of (4700 + 50)/50 = 95 : 1 into 50 Ω*Variable probe pitch configuration*1 m flexible 50 Ω cables with SMA connector for pulse sense*0.1 m flexible 50 Ω cables with SMA connector for pulse force*Tungsten probe tips*Can be used for chuck backside grounded TLP measurements
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TLP-8010A -
High Power Pulse Instruments GmbH
*Wafer and package level TLP/HMM testing*Fast 50 Ω high voltage pulse output with typical 300 ps rise time*Up to 80 kW peak output power into 50 Ω load*Built-in HMM pulse up to ±15 kV with 50 Ω-configuration*High pulse output current up to ±80 A (short circuit) with 6 dB reflection suppression*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 GPIB programmable pulse rise times: 300 ps to 50 ns*1 built-in pulse width: 100 ns*Optional external pulse width extensions 5/10/50/100/200/500 ns using an external pulse width extender TLP-8012A5*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurements of complete wafers*High performance and high quality components
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TLP-3010C -
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Ultra fast 50 Ω high voltage pulse output with typical 100 ps rise time*Built-in HMM (IEC 61000-4-2) pulse up to ±8 kV*High pulse output current up to ±30 A*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns*Optional pulse width extender increases pulse width up to 1.6 µs in 68 programmable steps*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurement of complete wafers*High performance and high quality components
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TLP-4010C -
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Ultra fast 50 Ω high voltage pulse output with typical 100 ps rise time*Built-in HMM (IEC 61000-4-2) pulse up to ±10 kV*High pulse output current up to ±40 A*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns*Optional pulse width extender increases pulse width up to 1.6 µs in 68 programmable steps*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurement of complete wafers*High performance and high quality components
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TLP-8010C -
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Combines TLP-8010A and TLP-4010C into one system*Can be operated together with TLP-8012A5 and TLP-3011C pulse width extenders*Ultra fast 50 Ω high voltage pulse output with typical rise time 100 ps (0-40 A) and 300 ps (> 40 A)*Up to 80 kW peak output power into 50 Ω load*Built-in HMM pulse up to ±15 kV with 50 Ω configuration*High pulse output current up to ±80 A (short circuit) with minimum 6 dB reflection suppression*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 GPIB programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns (0-40 A), 1 built-in pulse width: 100 ns (> 40 A)*The optional pulse width extender TLP-3011C enables pulse width up to 1.6 µs in 68 GPIB programmable steps (0-40 A)*Optional external pulse width extensions from 5 ns to 500 ns (> 40…80 A) using the external pulse width extender TLP-8012A5*Built-in pulse reflection suppression*Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurements of complete wafers*High performance and high quality components
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TLP-12012A6 -
High Power Pulse Instruments GmbH
- Pulse width extender for the high current TLP/HMM test system TLP-12010A and TLP-12010C- 6 manual selectable pulse width: 5, 10, 50, 100, 200 and 500 ns- High pulse output current up to ±120 A- High performance and high quality components
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ATS-8000A -
High Power Pulse Instruments GmbH
The ATS-8000A test system is a fully automated 2-pin probing solution for HBM, TLP, HMM and CC-TLP on package- and wafer-level.Future extension for CDM is optional.
