Ardent Concepts, Inc.

High Speed Coaxial Test and Measurement Connectors & Advanced Custom Signal Integrity Connectors

  • 603-474-1760
  • 603-474-1765
  • info@ardentconcepts.com
  • 4 Merrill Industrial Drive
    Hampton, NH 03842
    United States

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Showing results: 1 - 12 of 12 items found.

  • Connectors Specifications

    Flex to Board - Ardent Concepts, Inc.

    This revolutionary new ‘wiping’ action RC contact technology is a Patented Ardent Solution for ultra-small flex-to-board connectors and sockets. Ideal for both test and production use, SC™ connectors are available for custom applications with short lead times. Exceptional Signal Integrity Long Life Lower Component Costs Lower Overall Costs

  • High Performance Chipscale Test Sockets

    SC - Ardent Concepts, Inc.

    Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.

  • Interposers Specifications

    LGA - Ardent Concepts, Inc.

    Molded 1mm Pitch BGA Sockets using Connect-R™ technology are available off the shelf to meet your immediate needs. These durable multi-GHz BGA socket solutions offer low loss compression mount connection for processors, FPGAs, ASIC, MMICS and other high performance devices. Ardent BGA Sockets can be modified for any package size up to 50mm x 50mm with short lead times. RC Connect-R BGA Sockets & LGA Interposers are perfect for RF applications with temperature excursions and can stand up to the most demanding environmental factors. Hardware options are available for a variety of temperature control and mounting configurations.

  • Test Sockets

    Non Standard - Ardent Concepts, Inc.

    Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.

  • Test Sockets

    MEMS Device - Ardent Concepts, Inc.

    Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications

  • Test Sockets

    BGA/LGA - Ardent Concepts, Inc.

    There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.

  • Test Sockets

    QFN/QFP - Ardent Concepts, Inc.

    For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs

  • 50 GHz+ High Density Multicoax

    TR - Ardent Concepts, Inc.

    TR Multicoax enables delivers superior signal integrity from multiple 50GHz+ channels. TR is the highest-density high speed multicoax connector on the market. The interface is compression-mount which drives lower total cost of testing by avoiding costly solder-down components that can’t be recovered, and encouraging reuse across programs.

  • High Density Multi Channel DC to 70 GHz Connectors

    TR Multicoax Series - Ardent Concepts, Inc.

    TR Multicoax series delivers superior signal integrity from multiple GHz+ channels. With a choice of 20 GHz, 40 GHz, or 70 GHz configurations, users can upgrade their connectors as bandwidth requirements on their applications increases. TR is the highest-density high speed multicoax connector on the market. The interface is compression-mount which drives lower total cost of testing by avoiding costly solder-down components that can’t be recovered, and encouraging reuse across programs.

  • Module Sockets

    Ardent Optical Engine - Ardent Concepts, Inc.

    The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.

  • Connector Specifications

    Board to Board Connector Specifications - Ardent Concepts, Inc.

    With Springprobe™ technology, extremely high node count requirements can be satisfied without extreme force. Our system can be designed to work with LESS THAN 5 GRAMS OF FORCE per node to maintain electrical connectivity. And with contact heights as low as .032”, stack ups can be reduced without sacrificing signal integrity. If you have a tough Board to Board Connector requirement, contact us to see if RC Springprobe™ technology is right for your project.

  • Coaxial Cable Termination Toolkit

    ICFP - Ardent Concepts, Inc.

    Ardent’s ICFP is a next generation coaxial cable termination toolkit for advanced system design de-embedding, de-bugging, and calibration. Designed for the lowest loss access to signal paths on an IC circuit footprint, this solution is a simple, cost effective alternative to expensive probers and x-y tables for Engineers who need to probe multiple signals at once.

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