Grinding and Dicing Services, Inc.

Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications targeting unit cost reduction and maximum product yield. GDSI has perfected the process of mechanical stress reduction in ultra-thin wafers after a decade of R&D.

  • 408 451 2000
  • 408 451 2001
  • info@wafergrind.com
  • 925 Berryessa Road
    San Jose, CA 95133
    United States

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