Showing results: 1 - 7 of 7 items found.
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Fraunhofer IPM
The Li-Fi HotSpot Evaluation Kit allows the establishment of an optical wireless bidirectional point-to-point full-duplex data connection over medium distances in the meter range. Data rates of up to 1 GB/s are supported at a distance of up to 5 meters. The kit consists of two Li-Fi HotSpots, two CAT-6 cables (RJ45), two external power supplies and a user manual. Users can thus get to know the technical advantages of Li-Fi technology with little effort and test and evaluate them in their own network or environmental conditions.
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Fraunhofer IPM
The EMSA5 demo platform is an ideal tool for evaluating the RISC-V processor IP core EMSA5. It contains an Artix®-7 35T FPGA Arty evaluation board with implemented EMSA5-IP core. Thanks to the included peripherals and expansion interfaces, the kit is ideal for numerous applications. The kit is JTAG programmable and includes Quad SPI Flash, a JTAG port, 10/100 Mb/s Ethernet and a USB-UART bridge, four Pmod connectors and an Arduino Shield expansion connector.
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Fraunhofer IPM
The evaluation kit offers developers the possibility to test and evaluate Ethernet TSN for their own applications. It consists of either a Smartzync board (Xilinx) or a Netleap board (Intel/Altera) with an optionally implemented IPMS TSN-IP core for endpoint applications (TSN-EP), switched endpoint applications (TSN-SE) or switch applications (TSN- SW). Linux drivers with application examples, as well as RTOS test applications and TSN network configuration examples are also available.
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Fraunhofer IPM
The "QSDrive Scan Kit" evaluation kit enables small and medium-sized companies in particular to operate ResoLin components from the Fraunhofer IPMS in accordance with the specifications without the time-consuming in-house development of control electronics. The evaluation kit consists of a ResoLin component – a cardanic MEMS scanner with a linear axis and an optional, orthogonally oriented resonant axis – and control electronics that enable the components to be operated with an optimized trajectory supplied. The component is held by a scan head, which is also included in the scope of delivery and which, thanks to its special construction, can easily be integrated into common optical test setups. Depending on the design of the MEMS component, controlled operation of the component and synchronized operation of the resonant axis are also possible. The function is controlled by software that communicates with the electronics via USB.
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Fraunhofer IPM
With the Center Nanoelectronic Technologies (CNT), the Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners. In the field of FEoL and BEoL we offer the following technology developments and services at Ultra Large Scale Integration level (ULSI):
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Fraunhofer IPM
Offered for testing, evaluation and demonstration purposes, the Li-Fi GigaDock ® evaluation kits enable the establishment of a full-duplex, short-distance, cm-level optical wireless bi-directional point-to-point data link. The GD-5G offers bi-directional communication with a data rate of up to 5 Gbit/s and SMA connectivity. The GD-1G can be connected to an Ethernet network via an RJ45 connector with a Cat 5 cable or directly to a PC and offers a data rate of up to 1 Gbit/s.
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Fraunhofer IPM
The "CEK CMUT" evaluation kit offers interested developers of ultrasonic sensors and users the opportunity to set up a fully functional test setup for evaluating miniaturized capacitive micromechanical ultrasonic transducers (CMUT). It consists of either one or two CMUT sensor modules, adapted control electronics and software as a web application that controls the CMUT via plug-and-play.
