Showing results: 421 - 435 of 642 items found.
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Ampere Altra Dev Kit -
ADLINK Technology Inc.
Ampere Altra Dev Kit consists of a COM-HPC Server Base carrier paired with a COM-HPC Server Type Size E module and heatsink with fan.The module features Ampere® Altra® SoC (Arm Neoverse N1-based architecture) harnessing 32/64/96/128 Arm v8.2 64-bit cores for up to 1.7/2.2/2.8/2.6 GHz and providing support for up to 768GB DDR4 memory, offering unprecedented performance and power per watt with exceptional scalability.
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COM-HPC-cRLS -
ADLINK Technology Inc.
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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COM Express Type 6 Alder Lake-P -
ADLINK Technology Inc.
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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COM-HPC Client Base -
ADLINK Technology Inc.
The COM-HPC Client Base is an ATX size COM-HPC Client Type reference carrier board based on PICMG COM-HPC Revision 1.0. Together with the COM-HPC Client Type module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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ADLINK Technology Inc.
Designed to support the heavy technological demand of industrial applications, ADLINK’s embedded GPU solutions incorporate the latest NVIDIA GPU technology to take graphics processing to the next level. ADLINK’s GPUs allow for accelerated rendering, AI inferencing, graphics, and computing performance, all while reducing I/O latency and improving system responsiveness. ADLINK also takes common industrial concerns into consideration, with its embedded MXM GPUs that address size, weight, and power constraints and professional PCI express graphics cards that enhance graphics quality and support high-performance computing applications. Importantly, ADLINK’s embedded GPU solutions are durable and long-lived, able to respond to the demanding needs of the healthcare, manufacturing, logistics, transportation, aerospace, telecommunications, and defense industries over a long period.
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I-Pi SMARC IMX8M Plus -
ADLINK Technology Inc.
The I-Pi SMARC IMX8M Plus is a SMARC-based smart solution development kit powered by NXP i.MX8M Plus (Quad-core Arm Cortex-A53) processor with a Neural Processing Unit (NPU) at up to 2.3 TOPS.This is the first SMARC R2.1 development kit focused on machine learning, vision, advanced multimedia, and industrial IoT with high reliability. As such, it supports dual image processors and two camera inputs for an effective Vision System, as well as applications beyond, including smart homes, building cities, and industry 4.0.
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COMe Type 7 Ice Lake-D STKit -
ADLINK Technology Inc.
The Type 7 Starter Kit Plus consists of a COM Express Type 7 module with ATX size Type 7 reference carrier board that offers one PCI Express x16 slot with proprietary pinout for 10GbE adapter card that convert 10GBase-KR to 10GbE Optical Fiber or 10GbE Copper signal, one PCI Express x16 slot, two PCI Express x8 slots, Serial ATA, USB3.0/2.0, Gigabit LAN and Super I/O. in addition, a IPMI BMC (miniBMC) located on carrier board connect to COM Express Type7 module by NC-SI interface to support some of out-of-band management features. All necessary cables are included.
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Express-VR7 -
ADLINK Technology Inc.
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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EGX-MXM-AD -
ADLINK Technology Inc.
The EGX-MXM-AD is an PCIe adapter supporting ADLINK NVIDIA® Quadro® MXM 3.1 Type A, Type B, and Type B+ GPU modules for quick validation and early development purposes on your AI applications. The following modules are supported: EGX-MXM-P1000, EGX-MXM-P2000, EGX-MXM-T1000, EGX-MXM-RTX3000, and EGX-MXM-RTX5000. A reference thermal solution is available.
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MECS-6120 -
ADLINK Technology Inc.
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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LEC-IMX8MM -
ADLINK Technology Inc.
ADLINK LEC-IMX8MM, the first SMARC revision 2.1 compliant module offering superior power efficiency, is based on the low-power NXP i.MX 8M Mini processor (dual or quad core Arm Cortex-A53) with integrated Vivante GC NanoUltra graphics for improved processing capabilities. The LEC-IMX8MM is your ideal, cost-effective solution for various general-purpose edge and IoT applications.
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I-Pi SMARC 1200 -
ADLINK Technology Inc.
The I-Pi SMARC 1200 is a SMARC-based, AI and graphics-centric solution development kit powered by MediaTek® Genio 1200 (Octa-core Arm Cortex-A78 x4 + A55 x4) processor with a 5-core Arm Mali-G57 GPU for advanced 3D graphics and an integrated APU (AI Processor Unit) system delivering up to 5 TOPS.
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I-Pi SMARC RB5 -
ADLINK Technology Inc.
The I-Pi SMARC RB5 is a SMARC-based AIoT and robotics development kit harnessing ADLINK LEC-RB5, powered by the Qualcomm® QRB5165 SoC with Qualcomm® Kyro™ 585 octa-core CPU (8x Arm Cortex-A77), and Qualcomm® AI Engine.
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ND-6058 -
ADLINK Technology Inc.
ADLINK's NuDAM data acquisition modules make up a total acquisition network and control system. Up to 256 NuDAM modules an be romotely controlled on any RS-485 network from a host computer, via a single serial RS-232, allowing communication from as far as 4000 feet from the host. Based on the RS-485 multi-drop network system, each module has a unique address ID, whereby simple ASCII command & response protocols through the standard RS-485 interface can control all the NuDAM modules in the RS-485 network. The NuDAM modules provide direct communications with a wide variety of sensors, perform all signal conditioning, scaling, linearization and conversion, and can acquire measurements of temperature, pressure, flow, voltage, current, and multiple digital signal types.
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MECS-7211 -
ADLINK Technology Inc.
The MECS-7211 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. The MECS-7211 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 450mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7211 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.