Showing results: 1 - 9 of 9 items found.
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127 Raman -
Frontier Semiconductor, Inc,
Local and Lattice Stress Measurement, Die level Topography for in-die and in-device stress and composition control.
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900 Series -
Frontier Semiconductor, Inc,
Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles.Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature.
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500 Series -
Frontier Semiconductor, Inc,
Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films in air.Non-Contact Laser Scanning Technology.
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VIT -
Frontier Semiconductor, Inc,
TSV profile (depth, top & bottom CD, tilt, SWA)-Residue Detection-RST-Copper Nail Height-Bump Height and Cu pillar height-Edge trim profile
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128 Series -
Frontier Semiconductor, Inc,
Bow and Global Film Stress Measurement.Non-contact full wafer stress mapping for semiconductor and flat panel application.Dual Laser Switching Technology.
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413 Series -
Frontier Semiconductor, Inc,
Substrate Thickness, Warp, and TTV Measurement- with or without Tape- for Wafer Backgrind and Etch Thinning processes.Non-contact Echoprobe Technology.Thin film and surface roughness options.
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Electrical Char -
Frontier Semiconductor, Inc,
Full line of front end electrical characterization tools: Sheet Resistance, leakage, and CV-IV measurements.